共找到 168 条与 消防 相关的标准,共 12 页
This document provides guidelines for accelerated reliability
Performance
his standard establishes the classification system, the qualification and quality conformance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed circuitry and flexible flat cable.
Design
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Copper-Clad Laminate, Flexible
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Resin
The purpose of this Handbook is to provide guidance in the form of troubleshooting
Cloth Reinforcement
This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only
Tape
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the foliowing: flexible PWB-to-glass, flexible PWB-to-rigid PW, flip chip-to-glass, flip chip-toflexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
Other Materials
This document covers guidelines for selecting electrically conductive adhesives for use in assembly of components to printed circuit boards (PCB) or similar wiring interconnect systems. The focus is on the use of adhesives as solder alternatives. The process discussion attempts to stay within the bounds of the existing solder assembly infrastructure as much as possible. Both major types of adhesives, isotropic (conducting equally in all directions) and anisotropic (unidirectional conductivity), are covered. The two major divisions of polymer adhesives, thermosets and thermoplastics, are described.
Pins and Bushings
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Entry and Backup Materials
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Router Bits
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Tooling Accessories
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Rosin Flux
This International Standard relates to grid systems for printed circuits to ensure compatibility between the printed circuits and parts to be mounted on them at the intersections of the grid.
Silver Halide, Diazo Working Films
This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for Electrical and Electronic Equipment (EEE). This standard applies to products, components, subitems and materials that are supplied to producers of EEE for incorporation into their products. It does not apply to packaging materials (e.g. cardboard, plastic tray). It covers materials and substances that may be present in the supplied product or subitem. It does not apply to process chemicals, unless those process chemicals constitute part of the finished product or subitem.
Artwork
This standard provides the principles and details for declarations necessary between members of a supply chain. Although this standard contains only generic information regarding trading partners, when combined with a specific sectional standard, the entire document set is used to define and maintain the declaration type information. The requirements pertain to both hard copy and electronic data descriptions. This standard provides for the creation of a record that will serve as a commitment between trading partners and may be used to establish due diligence in any dispute in third-party litigation.
Photo Imaging Materials
This standard establishes requirements and other considerations
Oxide Treatment Chemicals
This specification covers mat made from nonwoven “E” glass fibers intended as a reinforcing material in laminated plastics for electrical and electronic use.
Smear Removal and Etch Back Materials
This specification covers paper made from cellulosic fibers intended as a reinforcing material in laminated plastics for electrical and electronic use.
Generic Chemicals
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Processing Chemicals
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Screening Inks
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