L04 基础标准与通用方法 标准查询与下载

IEC TR 61340-5-2:2007/COR1:2009 静电学.第5-2部分:静电现象中电子设备的防护.用户指南.技术勘误1

Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide; Corrigendum 1

JIS C 6950-1:2009 信息技术设备.安全性.第1部分:一般要求

Information technology equipment -- Safety -- Part 1: General requirements

IEC 62137-1-4:2009 表面安装技术.表面安装焊缝的环境和耐久性试验方法.第1-4部分:反复弯曲试验

Surface mounting technology - Environmental and endurance test methods for surface-mount solder joints - Part 1-4: Cyclic bending test

ANSI/IEEE 1680:2009 电子产品的环境评定标准

The 1680 family of standards defines environmental performance criteria for electronic products. The scope of this document is to provide guidelines and implementation procedures for the standards included in the 1680 family of standards.

Standard for Environmental Assessment of Electronic Products

IEEE 1680-2009 电子产品的环境评定

IEEE Standard for Environmental Assessment of Electronic Products (IEEE Computer Society)

BS 25777:2008 信息和通信技术连续性管理.实施规范

This British Standard gives recommendations for information and communications technology (ICT) continuity management within the framework of business continuity management provided by BS 25999.

Information and communications technology continuity management. Code of practice

KS A IEC 82045-1:2008 文档管理.第1部分:原则和方法

이 표준은 문서의 수명 기간 동안을 다하도록 대상과 연관된 문서 관리에 관련된 메타데이터를

Document management-Part 1:Principles and methods

DIN ISO 80416-4:2008 设备用图形符号基本原则.第4部分:荧光屏和显示器用图形符号的适用性指南(图标)

This part of ISO 80416 provides guidelines for the adaptation of graphical symbols for use on screens and displays (icons) on a wide range of equipment, such as electrotechnical equipment, photocopiers, vehicle dashboards and home appliances. It also provides principles for maintaining the fidelity of icons to the original graphical symbols.

Basic principles for graphical symbols for use on equipment - Part 4: Guidelines for the adaptation of graphical symbols for use on screens and displays (icons) (ISO 80416-4:2005); English version of DIN ISO 80416-4:2008-11

KS C IEC 60352-2:2008 无焊连接.第2部分:无焊压接.通用要求、试验方法和使用指南

이 표준은 단면적이 0.05 mm2에서 10 mm2인 꼬인 소선이나 지름이 0.25 mm에

Solderless connections－Part 2：Crimped connections－General requirements, test methods and practical guidance

KS X ISO/IEC 11770-3:2008 信息技术.安全技术.密钥管理.第3部分:使用不对称技术的机制

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Information technology-Security techniques-Key management-Part 3:Mechanisms using asymmetric techniques

HJ 450-2008 清洁生产标准.印制电路板制造业

本标准规定了印制电路板制造企业清洁生产的一般要求。本标准将清洁生产指标分为五类，即生产工艺与装备要求、资源能源利用指标、污染物产生指标（末端处理前）、废物回收利用指标和环境管理要求等。 本标准适用于印制电路板制造企业的清洁生产审核、清洁生产潜力与机会的判断，以及清洁生产绩效评定和清洁生产绩效公告制度，也适用于环境影响评价和排污许可证等环境管理制度。

Cleaner production standard.Printed circuit board manufacturing

IEC PAS 62137-3:2008 电子组装技术 焊缝用环境和耐久性试验方法的选择指南

This guidance describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material. The regions of the joints to be tested are shown in Figure 1. The test methods given here are applicable to evaluate the strength of joints of a component mounted on printed wiring board but not to test the mechanical strength of components themselves. The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range for a component. The lead-free solders have different properties from those of the conventional tin-lead eutectic solder. The reliability of soldered joints using lead-free solder may be reduced by the composition of the solder used, the shape of terminals and surface treatment. The factors affecting the joint reliability using Sn96,5Ag3Cu,5 solder are shown in Figure 2. This solder has the properties of higher melting temperature and harder than the tin-lead eutectic solder and the solid is not easily deformed. Consequently, the stress induced to the joint becomes higher than the tin-lead eutectic solder. These properties may induce break of a soldered joint by accelerated temperature changes, or mechanical stress.

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

IEC 62137-1-3:2008 表面安装技术.表面安装焊缝的环境和耐久性试验方法.第1-3部分:循环跌落试验

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

GJB 6600.1-2008 装备交互式电子技术手册 第1部分：总则

本部分规定了装备交互式电子技术手册的功能、内容、样式、数据格式和管理信息等要求。 本部分适用于装备交互式电子技术手册的研发、使用和维护等。

Interactive electronic technical manual of materiel.Part 1:General rules

GEIA-HB-0005-3-2008 致力于航空和高性能电气系统中不含铅电子设备和混合装配内涵的返工/维修手册

This document provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “Rework/Repair” is used as applicable. NOTE: The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

Rework/Repair Handbook to Address the Implications of Lead-Free Electronics and Mixed Assemblies in Aerospace and High Performance Electronic Systems

KS C IEC 60469-1:2008 脉冲技术和装置.第1部分:脉冲术语和定义

이 표준은 일반적 용도의 시간 영역 펄스 기술에 대한 기본적인 정의를 규정한다. 이 표준은

Pulse techniques and apparatus－Part 1：Pulse terms and definitions

IEC TS 62396-4:2008 电子设备用生产管理.大气辐射影响.第4部分:带高压航空器电子装置和潜在单个事件影响的设计指南

This technical specification is intended to provide guidance on atmospheric radiation effects on high voltage (nominally above 200 V) avionics electronics used in aircraft operating at altitudes up to 60 000 ft (18,3 km). It is intended to be used in conjunction with IEC/TS 62396- 1. This specification defines the effects of that environment on high voltage electronics and provides design considerations for the accommodation of those effects within avionics systems. This technical specification is intended to help aerospace equipment manufacturers and designers to standardise their approach to single event effects on high voltage avionics by providing guidance, leading to a standard methodology. Details are given of the types of single event effects relevant to the operation of high voltage avionics electronics, methods of quantifying those effects, appropriate methods to assist design and methods to demonstrate the suitability of the electronics for the application.

Process management for avionics - Atmospheric radiation effets - Part 4: Guidelines for designing with high voltage aircraft electronics and potential single event effects

ISO/IEC 11770-3:2008 信息技术.安全技术.密钥管理.第3部分:使用不对称技术的机制

This part of ISO/IEC 11770 defines key management mechanisms based on asymmetric cryptographic techniques. It specifically addresses the use of asymmetric techniques to achieve the following goals. 1) Establish a shared secret key for a symmetric cryptographic technique between two entities A and B by key agreement. In a secret key agreement mechanism, the secret key is the result of a data exchange between the two entities A and B. Neither of them can predetermine the value of the shared secret key. 2) Establish a shared secret key for a symmetric cryptographic technique between two entities A and B by key transport. In a secret key transport mechanism, the secret key is chosen by one entity A and is transferred to another entity B, suitably protected by asymmetric techniques. 3) Make an entity's public key available to other entities by key transport. In a public key transport mechanism, the public key of entity A must be transferred to other entities in an authenticated way, but not requiring secrecy. Some of the mechanisms of this part of ISO/IEC 11770 are based on the corresponding authentication mechanisms in ISO/IEC 9798-3. This part of ISO/IEC 11770 does not cover aspects of key management such as -- keylifecycle management, -- mechanisms to generate or validate asymmetric key pairs, -- mechanisms to store, archive, delete, destroy, etc. keys. While this part of ISO/IEC 11770 does not explicitly cover the distribution of an entity's private key (of an asymmetric key pair) from a trusted third party to a requesting entity, the key transport mechanisms described can be used to achieve this. A private key can in all cases be distributed with these mechanisms where an existing, non-compromised key already exists. However, in practice the distribution of private keys is usually a manual process that relies on technological means like smart cards, etc. This part of ISO/IEC 11770 does not cover the implementations of the transformations used in the key management mechanisms. NOTE To achieve authenticity of key management messages, it is possible to make provisions for authenticity within the key establishment protocol or to use a public key signature system to sign the key exchange messages.

Information technology - Security techniques - Key management - Part 3: Mechanisms using asymmetric techniques

CLC/TR 61340-5-2-2008 静电学.第5-2部分:电子设备的静电现象的防护.用户指南

This technical report has been developed to support IEC 61340-5-1. The controls and limits referenced in this standard were developed to protect devices that are susceptible to discharges of 100 V or greater using the human body model test method. However, the general concepts are still valid for devices that are susceptible to discharges of less than 100 V.

Electrostatics — Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide

ITU-T E.123 NOTE-2008 国内和国际电话号码、电子邮件和网址用符号

This is the erratum 1 (05/2008) to ITU-T Recommendation E.123 (02/2001), Notation for national and international telephone numbers, e-mail addresses and Web addresses

Notation for national and international telephone numbers e-mail addresses and Web addresses