L90 电子技术专用材料 标准查询与下载

EIA JIG-101-2005 电子产品元件声明

The Electrical and Electronic Equipment (EEE) industry tracks and discloses specific information about the material composition of its products due to legal and market requirements. The industry needs to gather information about the composition of products and subparts that are purchased from suppliers for incorporation into final products. This affects the entire supply chain worldwide.

Material Composition Declaration for Electronic Products

IPC TM-650 2.5.7-2004 介电 修订版D

Dielectric Withstanding Voltage, PCB Revision D

Dielectric Withstanding Voltage, PCB Revision D

KS C IEC 61969-2-2:2003 电子设备机械构造.室外密封壳.第2-2部分:详细规范.机箱的尺寸

이 규격은 케이스의 적용 치수를 포함한다.치수는 IEC 61969-2의 단면적에 근거하

Mechanical structures for electronic equipment-Outdoor enclosures-Part 2-2:Detail specification-Dimensions for cases

KS C IEC 61969-2-1:2003 电子设备的机械构造.室外密封壳.第2-1部分:详细规范.壳体的尺寸

이 규격은 캐비닛의 적용 치수를 포함한다. 치수는 IEC 61969-2의 부분 시방으로

Mechanical structures for electronic equipment-Outdoor enclosures-Part 2-1:Detail specification-Dimensions for cabinets

KS C IEC 61587-3:2003 电子设备的机械结构.IEC 60917和IEC 60297试验.第3部分:机壳、支架及辅助框架的电磁屏蔽性能试验

이 규격은 30~1 000 MHz 주파수 범위 내의 전자 차폐 성능과 관련하여 빈 캐비

Mechanical structures for electronic equipment-Tests for IEC 60917 and IEC 60297-Part 3:Electromagnetic shielding performance tests for cabinets, racks and subracks

KS C IEC 61969-3:2003 电子设备机械构造.室外密封壳.第3部分:分规范.机壳和机箱耐候性、机械试验及安全状况

이 규격은 빈 캐비닛과 케이스의 환경적 요구 사항과 더불어 지상 악천후 보호 장소 조건

Mechanical structures for electronic equipment-Outdoor enclosures-Part 3:Sectional specification-Climatic, mechanical tests and safety aspects for cabinets and cases

SJ/T 11283-2003 印制板用处理“E”玻璃纤维布规范

本规范规定了印制板用经表面化学处理的电气级“E”玻璃纤维布性能要求、质量保证及包装、标志、贮存和运输。 本规范适用于印制板用处理“E”玻璃纤维布，其织物全部为平纹组织。

Specification for finished fabric woven from "E" glass for printed boards

SJ/T 11282-2003 印制板用“E”玻璃纤维纸规范

本规范规定了印制板用“E”玻璃纤维纸(简称玻纤纸)性能要求、质量保证及包装、标志、贮存和运输。 本规范适用于印制板用E玻纤纸。

Specification for "E" glass paper for printed boards

SJ/T 10675-2002 电子及电器工业用二氧化硅微粉

′′′′′′′′′′′ ﹤ ﹒ 1

Silicon dioxide micropowder for electronic and electrical equipment industry

SJ/T 11273-2002 免清洗液态助焊剂

本标准规定了电子焊接用免清洗液态助焊剂的技术要求、试验方法、检验规则和产品的标志、包装、运输、贮存。 本标准适用于印制板组装件及电气和电子电路接点锡焊用免清洗液态助焊剂。使用免清洗液态助焊剂时，对具有预涂保护层印制板翘装件的焊接，建议选用与其配套的预涂覆材料。

No-clean liquid soldering flux

KS C 6411-2002 电子设备用1类瓷介固定电容器

이 규격은 KS C 6029에 따라서 주로 산화티탄계 자기를 유전체로 하여 금속막을 전극으

Fixed ceramic capacitors class 1 for use in electronic equipment

JEDEC JEP142-2002 混合/MCM产品中获取和接受材料

This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid / MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing / evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests.

Obtaining and Accepting Material for Use in Hybrid/MCM Products

SJ 20818-2002 电子设备的金属镀覆与化学处理

Metal plating and chemical treatment for electronic equipment

SJ 20805-2001 旋磁铁氧体材料总规范

General specification for gyromagnetic ferrite materials

BS EN 60191-6-8:2001 半导体器件的机械标准化 表面安装半导体器件封装外形图编制的一般规则 玻璃密封陶瓷四方扁平封装(G-QFP)设计指南

This part of IEC 60191 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP)

BS EN 60191-6-5:2001 半导体器件的机械标准化 表面安装半导体器件封装外形图编制的一般规则 细间距球栅格阵列(FBGA)设计指南

This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The demand for area array style packages exists according to the multi-functioning and high performance of electrical equipment. The object of this design guide is to standardize outlines and secure interchangeability of FBGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those of BGA packages.

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA)

DLA MIL-DTL-83528 C-2001 一般规格的电磁干扰/射频干扰弹性导电泡棉密封材料

This specification establishes the general requirements for electrically conductive elastomeric shielding gaskets. These gaskets are intended for use in electromagnetic interference/radio frequency interference suppression applications.

GASKETING MATERIAL, CONDUCTIVE, SHIELDING GASKET, ELECTRONIC, ELASTOMER, EMI/RFI, GENERAL SPECIFICATION FOR

DLA MIL-DTL-83528 C (1)-2001 一般规格的电磁干扰/射频干扰弹性导电泡棉密封材料

This amendment forms a part of MIL-DTL-83528C, dated 5 January 2001, and is approved for use by all Departments and Agencies of the Department of Defense.

GASKETING MATERIAL, CONDUCTIVE, SHIELDING GASKET, ELECTRONIC, ELASTOMER, EMI/RFI, GENERAL SPECIFICATION FOR

DLA MIL-DTL-83528 C SUPP 1A-2001 一般规格的电磁干扰/射频干扰弹性导电泡棉密封材料

This supplement forms a part of Detail Specification MILDTL- 83528C, dated 5 January 2001.

GASKETING MATERIAL, CONDUCTIVE, SHIELDING GASKET, ELECTRONIC, ELASTOMER, EMI/RFI, GENERAL SPECIFICATION FOR

ASTM F106-00 电子器件用铜焊填充金属标准规范

1.1 This specification covers requirements or filler metals suitable for brazing internal parts and other critical areas of electron devices in a nonoxidizing atmosphere (Note 1). 1.2 These materials are available in strip or wire or preforms made by blanking the strip or bending the wire. Powders are also available. Note 1--Brazing filler metals for general applications are specified in AWS Specification A5.8. 1.3 The values stated in inch-pound units are to be regarded as the standard. The values given in parentheses are for information only.

Standard Specification for Brazing Filler Metals for Electron Devices