L90 电子技术专用材料 标准查询与下载

SJ/T 11126-1997 电子元件用酚醛系包封材料

本标准规定了电子元件用酚醛系包封材料的分类、要求、试验方法、检验规则、包装、标志、运输、贮存。 本标准适用于制造瓷介电容器、电阻器、电感器等电子元件外包封所需的酚醛系包封料。

Encapsulation materials of phenolic series for use in electronic components

SJ/T 11116-1997 光纤预制棒总规范

本标准适用于拉制各种光纤的光纤预制棒。

Generic specification for optical fibre preform

SJ/T 11124-1997 电子元器件用环氧系粉末包封材料

本标准规定了电了元器件用环氧系粉末包封材料的分类、要求、试验方法、检验规则、包装、标志、运输、贮存。 本标准适用于制造电阻器、高压陶瓷电容器、钽电容器及电限网络等电子元器件包封所需的粉末包封料。

Encapsulation materials of expoy series powder for use in electronic components

SJ/T 11125-1997 电子元器件用环氧系灌封材料

本标准规定了电子元器件用环氧系灌封材料的分类、要求、试验方法、检验规则、包装、标志、运输、贮存。 本标准适用于用金属或塑料作模具或外壳进行灌封的各类电子元器件所需的包封料。

Encapsulation materials of expoy series for use in electronic components

IEC 60512-1-4:1997 电子设备用机电元件 基本试验程序和测量方法 第1部分:总则 第4节:试验1d:接触件保护效率(防铲)

This section of IEC 60512-1 is to be used when referenced by the detail specification to test mechanical components overseen by the IEC subcommittee 48B. This test can also be done on similar devices when the detail specification so prescribes. The object of this test is to define a standard test method to verify the ability of a connector to prevent the accidental touching of its contact by the front of the mating connector. It is primarily intended to be applied to cylindrical multi-contact connectors which are required to be scoop-proof.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof)

IEC 60512-1-3:1997 电子设备用机电元件 基本试验程序和测量方法 第1部分:一般检查 第3节:试验1c:电气啮合长度

This section of IEC 60512-1, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to define a standard test method to measure the electrical engagement length in a connector as defined in IEV 581-03-15.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General examination - Section 3: Test 1c - Electrical engagement length

IEC 60512-19-3:1997 电子设备用机电元件 基本试验程序和测量方法 第19部分:耐化学品试验 第3节:试验19c:耐焊剂

This section of IEC 60512-19, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to define a standard test method to assess the effects of accidental exposure to fluids and lubricants on electrical connecting devices.

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests - Section 3: Test 19c: Fluid resistance

BS EN 60512-16-20:1997 电子设备的机电元件 基本测试程序和测量方法 触点和端子的机械测试 测试16吨 机械强度（无焊连接的有线端接）

This section of IEC 512-16, when required by the detail specification, is used for testing electromechanical components within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to detail a standard method to assess the mechanical strength of solderless connections including integrated strain relief features.

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Mechanical tests on contacts and terminations. Test 16t. Mechanical strength (wired termination of solderless connections)

BS EN 60512-12-6:1997 电子设备的机电元件 基本测试程序和测量方法 焊接测试 测试 12f 机器焊接中针对助焊剂和清洁溶剂的密封

This section of IEC 512-12, when required by the detail specification, is to be used for testing electromechanical components within the scope of technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to detail a standard test method to verify the effectiveness of the sealing of a component against flux and cleaning solvents during the machine soldering process. The results of this test may not be representative for other fluxes; e.g. resin-reduced foam flux, other fluxing and cleaning methods as prescribed herein. note:* Scope of technical committee 48: Standardization of electric connectors, connecting devices and mechanical structures for electronic and electrical equipment.

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests. Test 12f. Sealing against flux and cleaning solvents in machine soldering

BS EN 60512-15-8:1997 电子设备的机电元件 基本测试程序和测量方法 触点和端子的机械测试 测试15小时 接触保持系统对工具应用的抵抗力

This section of IEC 512-15 defines standard test method to check the ability of connectors to withstand the use of standardised tooling for insertion and extraction of contacts.

Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Mechanical tests on contacts and terminations. Test 15h. Contact retention system resistance to tool application

ASTM F1844-97 用非接触式涡流计测量平板显示器制造用薄膜导体耐力的标准操作规程

1.1 This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates (glass or plastic), used in making flat panel information displays.

Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage

ASTM F1709-97(2008) 电子薄膜用高纯度钛溅射靶机的标准规范

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices. 1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging. 1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.

Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications

ASTM F1845-97(2002) 用高质量减少辉光放电质谱仪测量电子级铝铜、铝硅和铝铜硅中微量金属杂质的标准试验方法

This test method is intended for application in the semiconductor industry for evaluating the purity of materials (for example, sputtering targets, evaporation sources) used in thin film metallization processes. This test method may be useful in additional applications, not envisioned by the responsible technical committee, as agreed upon between the parties concerned. This test method is intended for use by GDMS analysts in various laboratories for unifying the protocol and parameters for determining trace impurities in aluminum-copper, aluminum-silicon, and aluminum-copper-silicon alloys. The objective is to improve laboratory-to-laboratory agreement of analysis data. This test method is also directed to the users of GDMS analyses as an aid to understanding the determination method, and the significance and reliability of reported GDMS data. For most metallic species the detection limit for routine analysis is on the order of 0.01 wt. ppm. With special precautions, detection limits to sub-ppb levels are possible. This test method may be used as a referee method for producers and users of electronic-grade aluminum-copper, aluminum-silicon and aluminum-copper-silicon materials.1.1 This test method determines the concentrations of trace metallic impurities in high purity (99.99 wt. % pure, or purer, with respect to metallic trace impurities) aluminum-copper, aluminum-silicon and aluminum-copper-silicon alloys with major alloy constituents as follows:aluminumGreater than 95.0 %copperLess or equal than 5.0 %siliconLess or equal than 5.0 %1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS).1.3 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment, skillfully used by an experienced operator, is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparation, setting of relative sensitivity factors, determination of detection limits, etc.) known by the responsible technical committee to effect the reliability of high purity aluminum analyses.1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Reduction Glow Discharge Mass Spectrometer

ASTM F1844-97(2008) 用非接触式涡流计测量平板显示器制造用薄膜导体耐力的标准实施规程

Resistivity is a primary quantity for characterization and specification of coated glass plates used for flat panel displays. Sheet resistance is also a primary quantity for characterization, specification, and monitoring of thin film fabrication processes. This practice requires no specimen preparation. The eddy current method is non-destructive to the thin film being measured. Special geometrical correction factors, needed for some four-point probe electrical resistivity measurements, are not required to derive the true sheet resistance so long as the transducers have a continuous layer of conductive thin film between them. Test Methods F 673 refers to a testing arrangement in which the transducers and specimen (a semiconductor grade silicon wafer) are rigidly positioned. Similar apparatus is commercially available for testing large glass or plastic substrates, not envisioned in the scope of Test Methods F 673. A hand held probe can also be used, depending on throat depth required. For use as a referee method, the probe and measuring apparatus must first be checked and qualified before use by the procedures of Test Methods F 673 (9.1.1 through 9.1.3 and 9.1.4.2 through 9.1.4.5), then this practice is used. For use as a routine quality assurance method, this practice may be employed with periodic qualifications of probe and measuring apparatus by the procedures of Test Methods F 673 (9.1.1 through 9.1.3 and 9.1.4.2 through 9.1.4.5). The parties to the test must agree upon adequate qualification intervals for the test apparatus.1.1 This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates (glass or plastic), used in making flat panel information displays. 1.2 This practice is intended to be used with Test Methods F 673. This practice pertains to a “manual” measurement procedure in which an operator positions the measuring head on the test specimen and then personally activates the test apparatus. The resulting test data may be tabulated by the operator, or, alternatively, sent to a computer-based data logging system. Both Methods I and II of Test Methods F 673 (paragraphs 3.1 through 3.3.3 of Test Methods F 673) are applicable to this practice. 1.3 Sheet resistivity in the range 0.020 to 3000 Ω per square (sheet conductance in the range 3 by 10–4 to 50 mhos per square) may be measured by this practice. The sheet resistance is assumed to be uniform in the area being probed. Note 18212;Typical manual test units, as described in this practice, measure and report in the units “mhos per square”; this is the inverse of “ohms per square.” 1.4 This practice is applicable to flat surfaces only. 1.5 This practice is non-destructive. It may be used on production panels to help assure production uniformity. 1.6 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.7 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage

ASTM F1843-97 薄膜开关涂覆层上抛光光泽测量用透明塑料薄膜的样品制备的标准指南

1.1 This practice covers the method of sample preparation, prior to taking gloss measurements on a membrane switch overlay. 1.2 Typical applications include window display areas on a graphic overlay, and surface texture. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Sample Preparation of Transparent Plastic Films for Specular Gloss Measurements, on Membrane Switch Overlays

ASTM F1843-97(2002) 薄膜开关涂覆层上抛光光泽测量用透明塑料薄膜的样品制备的标准指南

Gloss measurements are used to qualify a raw material or finished product. Sample preparation will effect the outcome of gloss readings. This practice will eliminate second surface reflection, and allow a more accurate gloss reading of the substrate. Materials which require this preparation include the following: clear or translucent substrates, colored transparent substrates, and areas printed with clear, translucent, or transparent colored coatings.1.1 This practice covers the method of sample preparation, prior to taking gloss measurements on a membrane switch overlay. 1.2 Typical applications include window display areas on a graphic overlay, and surface texture. 1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Sample Preparation of Transparent Plastic Films for Specular Gloss Measurements, on Membrane Switch Overlays

ASTM F1845-97 用高质量减少辉光放电质谱仪测量电子级铝铜、铝硅和铝铜硅中微量金属杂质的标准试验方法

1.1 This test method determines the concentrations of trace metallic impurities in high purity (99.99 wt. % pure, or purer, with respect to metallic trace impurities) aluminum-copper, aluminum-silicon and aluminum-copper-silicon alloys with major alloy constituents as follows: aluminum---Greater than 95.0% copper---Less or equal than 5.0% silicon---Less or equal than 5.0% 1.2 This test method pertains to analysis by magnetic-sector glow discharge mass spectrometer (GDMS). 1.3 This test method does not include all the information needed to complete GDMS analyses. Sophisticated computer-controlled laboratory equipment, skillfully used by an experienced operator, is required to achieve the required sensitivity. This test method does cover the particular factors (for example, specimen preparations, setting of relative sensitivity factors, determination of detection limits, etc.) known by the responsible technical committee to effect the reliability of high purity aluminum analyses. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Trace Metallic Impurities in Electronic Grade Aluminum-Copper, Aluminum-Silicon, and Aluminum-Copper-Silicon Alloys by High-Mass-Reduction Glow Discharge Mass Spectrometer

ASTM F1844-97(2002) 用非接触式涡流计测量平板显示器制造用薄膜导体耐力的标准操作规程

Resistivity is a primary quantity for characterization and specification of coated glass plates used for flat panel displays. Sheet resistance is also a primary quantity for characterization, specification, and monitoring of thin film fabrication processes. This practice requires no specimen preparation. The eddy current method is non-destructive to the thin film being measured. Special geometrical correction factors, needed for some four-point probe electrical resistivity measurements, are not required to derive the true sheet resistance so long as the transducers have a continuous layer of conductive thin film between them. Test Methods F 673 refers to a testing arrangement in which the transducers and specimen (a semiconductor grade silicon wafer) are rigidly positioned. Similar apparatus is commercially available for testing large glass or plastic substrates, not envisioned in the scope of Test Methods F 673. A hand held probe can also be used, depending on throat depth required. For use as a referee method, the probe and measuring apparatus must first be checked and qualified before use by the procedures of Test Methods F 673 (9.1.1 through 9.1.3 and 9.1.4.2 through 9.1.4.5), then this practice is used. For use as a routine quality assurance method, this practice may be employed with periodic qualifications of probe and measuring apparatus by the procedures of Test Methods F 673 (9.1.1 through 9.1.3 and 9.1.4.2 through 9.1.4.5). The parties to the test must agree upon adequate qualification intervals for the test apparatus.1.1 This practice describes methods for measuring the sheet electrical resistance of sputtered thin conductive films deposited on large insulating substrates (glass or plastic), used in making flat panel information displays.1.2 This practice is intended to be used with Test Methods F 673. This practice pertains to a "manual" measurement procedure in which an operator positions the measuring head on the test specimen and then personally activates the test apparatus. The resulting test data may be tabulated by the operator, or, alternatively, sent to a computer-based data logging system. Both Methods I and II of Test Methods F 673 (paragraphs 3.1 through 3.3.3 of Test Methods F 673) are applicable to this practice.1.3 Sheet resistivity in the range 0.020 to 3000 per square (sheet conductance in the range 3 by 10-4 to 50 mhos per square) may be measured by this practice. The sheet resistance is assumed to be uniform in the area being probed.Note 18212;Typical manual test units, as described in this practice, measure and report in the units "mhos per square"; this is the inverse of "ohms per square."1.4 This practice is applicable to flat surfaces only.1.5 This practice is non-destructive. It may be used on production panels to help assure production uniformity.1.6 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage

KS C 5510-1996 电子设备R01型圆筒形连接器

이 규격은 KS C 6033을 토대로 해서 주로 전자 기기에 사용하는 원통형 R01 커넥터

Type R01 cylindrical connectors for use in electronic equipment

DB65/ 021-1996 长效接地降阻剂

Long-term grounding resistance reducer