DS/EN 60068-2-54-2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method


DS/EN 60068-2-54-2006 发布历史

This part of 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

DS/EN 60068-2-54-2006由丹麦标准化协会 DK-DS 发布于 2006-12-21,并于 2006-12-21 实施。

DS/EN 60068-2-54-2006在国际标准分类中归属于: 19.040 环境试验。

DS/EN 60068-2-54-2006的历代版本如下:

DS/EN 60068-2-54-2006 由 DS/IEC 68-2-54-1986 变更而来。

 

 

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标准号
DS/EN 60068-2-54-2006
发布日期
2006年12月21日
实施日期
2006年12月21日
废止日期
国际标准分类号
19.040
发布单位
DK-DS
被代替标准
DS/HD 323.2.54 S1-1997 DS/IEC 68-2-54-1986
适用范围
This part of 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), 60068-2-69 should be applied if it is suitable.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

DS/EN 60068-2-54-2006系列标准





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