DS/EN 60068-2-69-2007

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

DS/EN 60068-2-69-2007 发布历史

This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable.The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free

DS/EN 60068-2-69-2007由丹麦标准化协会 DK-DS 发布于 2007-12-02，并于 2007-12-02 实施。

DS/EN 60068-2-69-2007在国际标准分类中归属于: 19.040 环境试验。

DS/EN 60068-2-69-2007的历代版本如下：

• 2007年12月02日 DS/EN 60068-2-69-2007

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标准号

DS/EN 60068-2-69-2007

发布日期

2007年12月02日

实施日期

2007年12月02日

废止日期

无

国际标准分类号

19.040

发布单位

DK-DS

被代替标准

DS/EN 60068-2-69-1997

适用范围

This part of IEC 60068 outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable.The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free

DS/EN 60068-2-69-2007系列标准