This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:– wafers;– singulated bare die;– die and wafers with attached connection structures;– minimally or partially encapsulated die and wafers.This part of IEC 62258 specifies the information required to facilitate the use of electrical dataand models for simulation of the electrical behaviour and verification of the correct functionalityof electronic systems that include bare semiconductor die, with or without connectionstructures, and/or minimally packaged semiconductor die. It is intended to assist all thoseinvolved in the supply chain