This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:• wafers;• singulated bare die;• die and wafers with attached connection structures;• minimally or partially encapsulated die and wafers.This part of IEC 62258 determines the information required to facilitate the use of thermaldata and models for simulation of the thermal behaviour and verification of the correctfunctionality of electronic systems that include bare semiconductor die, with or withoutconnection structures, and/or minimally packaged semiconductor die. It is intended to assistall those involved in the supply chain for