DIN EN IEC 62878-2-5-2021 设备嵌入组装技术. 第2-5部分: 指南. 设备嵌入基材三维数据格式的实现(IEC 62878-2-5-2019); 德文版本EN IEC 62878-2-5-2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019); German version EN IEC 62878-2-5:2019
This part of IEC 62878 specifies requirements based on XML schema that represents the design data format for device embedded substrate (as known as FUJIKO: Fukuoka University JIsso K(C)Onsortium-format in Japan), that is, active and passive devices embedded board whose electrical