ZH
RU
ES
Electromigration
Electromigration, Total:30 items.
In the international standard classification, Electromigration involves: Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Geology. Meteorology. Hydrology, Particle size analysis. Sieving, Electrical engineering in general, Vocabularies, Electronic components in general, Test conditions and procedures in general, Air quality, Electricity. Magnetism. Electrical and magnetic measurements.
IPC - Association Connecting Electronics Industries, Electromigration
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Electromigration
- JEDEC JESD61A.01-2007 Isothermal Electromigration Test Procedure
- JEDEC JESD61A-2007 Isothermal Electromigration Test Procedure
- JEDEC JESD61-1997 Isothermal Electromigration Test Procedure
- JEDEC JESD63-1998 Standard Method for Calculating the Electromigration Model Parameters for Current Density and Temperature
- JEDEC JEP154-2008 Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
- JEDEC JESD202-2006 Method for Characterizing the Electromigration Failure Time Distribution of Interconnects Under Constant-Current and Temperature Stress
Danish Standards Foundation, Electromigration
- DS/EN 62415:2010 Semiconductor devices - Constant current electromigration test
- DS/ISO 15900:2020 Determination of particle size distribution – Differential electrical mobility analysis for aerosol particles
CENELEC - European Committee for Electrotechnical Standardization, Electromigration
- EN 62415:2010 Semiconductor devices - Constant current electromigration test
Association Francaise de Normalisation, Electromigration
ES-UNE, Electromigration
- UNE-EN 62415:2010 Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)
German Institute for Standardization, Electromigration
- DIN EN 62415:2010-12 Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
- DIN EN 62415:2010 Semiconductor devices - Constant current electromigration test (IEC 62415:2010); German version EN 62415:2010
International Electrotechnical Commission (IEC), Electromigration
- IEC 62415:2010 Semiconductor devices - Constant current electromigration test
British Standards Institution (BSI), Electromigration
- BS EN 62415:2010 Semiconductor devices - Constant current electromigration test
- BS ISO 15900:2020 Determination of particle size distribution. Differential electrical mobility analysis for aerosol particles
- 19/30370177 DC BS ISO 15900. Determination of particle size distribution. Differential electrical mobility analysis for aerosol particles
Lithuanian Standards Office , Electromigration
- LST EN 62415-2010 Semiconductor devices - Constant current electromigration test (IEC 62415:2010)
Institute of Interconnecting and Packaging Electronic Circuits (IPC), Electromigration
Professional Standard - Meteorology, Electromigration
- QX/T 72-2007 Determination of number size distribution of submicron particle by using Electrical Mobility Method
RU-GOST R, Electromigration
- GOST 25532-1989 Photosensitive charge transfer devices. Terms and definitions
Group Standards of the People's Republic of China, Electromigration
Association of German Mechanical Engineers, Electromigration
- VDI 3867 Blatt 3-2012 Measurement of particles in ambient air - Determination of the particle number concentration and number size distribution of aerosols - Electrical mobility spectrometer
American Society for Testing and Materials (ASTM), Electromigration
- ASTM F1260M-96 Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]
- ASTM F1260M-96(2003) Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric]