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Lead-Free Solder Analyzer

Lead-Free Solder Analyzer, Total:96 items.

In the international standard classification, Lead-Free Solder Analyzer involves: Analytical chemistry, Welding, brazing and soldering, Testing of metals, Non-ferrous metals, Electronic components in general, Components for aerospace construction, Materials for aerospace construction, Jewellery.


Korean Agency for Technology and Standards (KATS), Lead-Free Solder Analyzer

CZ-CSN, Lead-Free Solder Analyzer

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Lead-Free Solder Analyzer

  • GB/T 10574.1-2003 Methods for chemical analysis of tin-lead solders--Determination of tin content
  • GB/T 10574.2-2003 Methods for chemical analysis of Tin-lead solders--Determination of antimony content
  • GB/T 10574.12-2003 Methods for chemical analysis of tin-lead solders--Determination of sulphur content
  • GB/T 10574.10-2003 Methods for chemical analysis of tin-lead solders--Determination of cadmium content
  • GB/T 10574.9-2003 Methods for chemical analysis of tin-lead solders--Determination of aluminum content
  • GB/T 10574.5-2003 Methods for chemical analysis of tin-lead solders--Determination of arsenic content
  • GB/T 10574.7-2003 Methods for chemical analysis of tin-lead solders--Determination of silver content
  • GB/T 10574.8-2003 Methods for chemical analysis of tin-lead solders--Determination of zinc content
  • GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
  • GB/T 10574.4-2003 Methods for chemical analysis of tin-lead solders--Determination of iron content
  • GB/T 10574.6-2003 Methods for chemical analysis of tin-lead solders--Determination of copper content
  • GB/T 10574.3-2003 Method for chemical analysis of tin-lead solder - Determination of bismuth content
  • GB/T 10574.5-2003 Determination of arsenic content by chemical analysis method of tin-lead solder
  • GB/T 10574.1-1989 Tin-lead solders--Determination of tin content--Potassium iodate titrimetric method
  • GB/T 10574.9-1989 Tin-lead solders--Determination of silver content--Potentiometric titrimetric method
  • GB/T 10574.4-1989 Tin-lead solders--Determination of bismuth content--Thiourea spectrophotometric method
  • GB/T 10574.3-1989 Tin-lead solders--Determination of antimony content--Potassium bromete titrimetric method
  • GB/T 10574.2-1989 Tin-lead solders--Determination of antimony content--Malachite green spectrophotometric method
  • GB/T 10574.12-1989 Tin-lead solders--Determination of cadmium content--Catalytic oscillopolarographic method
  • GB/T 10574.14-1989 Tin-lead solders--Determination of sulphur content--Oscillopolarographic method after distillation
  • GB/T 10574.6-1989 Tin-lead solders--Determination of arsenic content--Molybdoantimony arsenate blue spectrophotometric method
  • GB/T 10574.5-1989 Tin-lead solders--Determination of iron content--1,10-phenanthroline spectrophotometric method
  • GB/T 10574.10-1989 Tin-lead solders--Determination of zinc content--Flame atomic absorption spectrophotometric method
  • GB/T 10574.8-1989 Tin-lead solders--Determination of silver content--Flame atomic absorption spectrophotometric method
  • GB/T 10574.13-2003 Methods for chemical analysis of tin-lead solders-determination of copper,iron cadmium,silver,gold,arsenic,zinc,aluminium,bismuth,phosphorous content
  • GB/T 10574.13-1989 Tin-lead solders--Determination of phosphorus content--Phosphor-vanadium-molybdium poly acid-crystal violet spectrophotometric method
  • GB/T 10574.7-1989 Tin-lead solders--Determination of copper content--2,9-dimethyl-1,10-phenanthroline spetrophotometric method
  • GB/T 10574.11-1989 Tin-lead solders--Determination of aluminium content--Chrome azurol S-polyethylene glycol oetyl phenyl ether spectrophotometric method

RU-GOST R, Lead-Free Solder Analyzer

UNKNOWN, Lead-Free Solder Analyzer

  • GB/T 10574.11-2003 Method for chemical analysis of tin-lead solder Determination of phosphorus content
  • GB/T 10574.11-2003 Method for chemical analysis of tin-lead solder Determination of phosphorus content

Professional Standard - Non-ferrous Metal, Lead-Free Solder Analyzer

  • YS/T 746.1-2010 Methods for chemical analysis of lead-free tin-based solders- Part 1: Determination of tin content- Pyrogallic acid demasking-lead nitrate titrimetric method
  • YS/T 746.4-2010 Methods for chemical analysis of lead-free tin-based solders- Part 4: Determination of lead content- Flame atomic absorption spectrometric method
  • YS/T 746.12-2010 Methods for chemical analysis of lead-free tin-based solders- Part 12: Determination of Indium content- NaEDTA titrimetric method
  • YS/T 746.8-2010 Methods for chemical analysis of lead-free tin-based slders.Part 8: Determination of arsenic content.Molybdenum antimony arsenate blue spectrometric method
  • YS/T 746.6-2010 Methods for chemical analysis of lead-free tin-based solders- Part 6: Determination of antimony content- Flame atomic absorption spectrometric method
  • YS/T 746.7-2010 Methods for chemical analysis of lead-free tin-based solders- Part 7: Determination of iron content- Flame atomic absorption spectrometric method
  • YS/T 746.10-2010 Methods for chemical analysis of lead-free tin-based solders- Part 10: Determination of aluminum content- Electrothermal atomic absorption spectrometric method
  • YS/T 746.11-2010 Methods for chemical analysis of lead-free tin-based solders- Part 11: Determination of Cadmium content- Flame atomic absorption spectrometric method
  • YS/T 746.13-2010 Methods for chemical analysis of tin-based lead-free solders- Part 13: Determination of nickel content- Flame atomic absorption spectrometric method
  • YS/T 746.16-2010 Methods for chemical analysis of lead-free tin-based solders- Part 16: Determination of total rare earth content- Arserazo Ⅲ spectrophotometry
  • YS/T 746.15-2010 Methods for chemical analysis of lead-free tin-based solders- Part 15: Determination of Germanium content- Salicylfluorone-sim polyethylene glycol phenyl ether spectrophotometry
  • YS/T 746.14-2010 Methods for chemical analysis of lead-free tin-based solders- Part 14: Determination of phosphorus content- Crystal violet phosphorus-vanadium-molybdenum heteropoly acid spectrophotometry
  • YS/T 746.9-2010 Methods for chemical analysis of lead-free tin-based solders- Part 9: Determination of zinc content- Flame atomic absorption spectrometric method and NaEDTA titrimetric method
  • YS/T 746.2-2010 Methods for chemical analysis of tin-based lead-free solders- Part 2: Determination of silver content- Flame atomic absorption spectrometric method and potassium thiosulfate titrimetric method
  • YS/T 746.3-2010 Methods for chemical analysis of tin-based lead-free solders- Part 3: Determination of copper content- Flame atomic absorption spectrometric method and sodium thiosulfate titrimetric method
  • YS/T 746.5-2010 Methods for chemical analysis of lead-free tin-based solders.Part 5 Determination of bismuth content.Flame atomic absorption spectrometric method and EDTA titrimetric method

IPC - Association Connecting Electronics Industries, Lead-Free Solder Analyzer

工业和信息化部, Lead-Free Solder Analyzer

  • SJ/T 11698-2018 Lead-free solder chemical analysis method Inductively coupled plasma atomic emission spectrometry
  • YS/T 746.17-2018 Methods for chemical analysis of lead-free tin-based solders - Part 17: Determination of amounts of silver, copper, lead, bismuth, antimony, iron, arsenic, zinc, aluminum, cadmium, nickel and indium by inductively coupled plasma atomic emission spectromet
  • YS/T 1074-2015 Chemical analysis methods for solder-free precious metal jewelry. Determination of magnesium, titanium, chromium, manganese, iron, nickel, copper, zinc, arsenic, ruthenium, rhodium, palladium, silver, cadmium, tin, antimony, iridium, platinum, lead and bi

未注明发布机构, Lead-Free Solder Analyzer

  • BS 3338-4:1961(2011) Method for The determination of copper in ingot tin and tin - lead solders (photometric method) — Methods for the sampling and analysis oftin and tin alloys
  • BS 3338-8:1961(2011) Method for The determination of bismuth in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys
  • BS 3338-10:1961(2011) Method for The determination of iron in ingot tin, tin - lead solders and white metal bearing alloys (Photometric method) — Methods for the sampling and analysis oftin and tin alloys

British Standards Institution (BSI), Lead-Free Solder Analyzer

  • BS 3338-4:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of copper in ingot tin and tin-lead solders (photometric method)
  • BS 3338-5:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of lead in ingot tin and tin-antimony solders (photometric method)
  • BS 3338-8:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of bismuth in ingot tin, tin-lead solders and white metal bearing alloys (photometric method)
  • BS 3338-10:1961 Methods for the sampling and analysis of tin and tin alloys - Method for the determination of iron in ingot tin, tin-lead solders and white metal bearing alloys (photometric method)

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Lead-Free Solder Analyzer

  • GB/T 10574.14-2017 Methods for chemical analysis of tin-lead solders—Part 14:Determination of tin, lead,antimony,bismuth,silver,copper,zinc,cadmium and arsenic content—Optical emission spectrometry
  • GB/T 10574.9-2017 Methods for chemical analysis of tin-lead solders—Part 9:Determination of aluminium content—Graphite furnace atomic absorption spectrometric method
  • GB/T 10574.8-2017 Methods for chemical analysis of tin-lead solders—Part 8:Determination of zinc content—Flame atomic absorption spectrometric method
  • GB/T 10574.12-2017 Methods for chemical analysis of tin-lead solders—Part 12:Determination of sulfur content—High frequency combustion with infrared absorption method
  • GB/T 10574.11-2017 Methods for chemical analysis of tin-lead solders—Part 11:Determination of phosphorus content—Crystal violet phosphorus-vanadium-molybdeum heteropoly acid spectrophotometry
  • GB/T 10574.10-2017 Methods for chemical analysis of tin-lead solders—Part 10:Determination of cadmium content—Flame atomic absorption spectrometry and Na2EDTA titration method
  • GB/T 10574.7-2017 Methods for chemical analysis of tin-lead solders—Part 7:Determination of silver content—Flame atomic absorption spectrometry and potassium thiocyanate potentiometric titration

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Lead-Free Solder Analyzer

BELST, Lead-Free Solder Analyzer

  • STB 1315-2002 Products tinned. Methods of definition contents of tin and lead by stripping voltammetric analysis on analyzers of a type ТА

IT-UNI, Lead-Free Solder Analyzer

International Electrotechnical Commission (IEC), Lead-Free Solder Analyzer

  • IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
  • IEC TS 62647-2:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of the deleterious effects of tin

Professional Standard - Electron, Lead-Free Solder Analyzer

  • SJ/T 11021-1996 Methods of analysis for silver brazing for electronic components - Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb with spectrochemical method
  • SJ/T 11019-1996 Methods of analysis for pure silver brazing for electronic components - Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb (spectrochemical method)

German Institute for Standardization, Lead-Free Solder Analyzer

  • DIN IEC/TS 62647-2:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)

国家市场监督管理总局、中国国家标准化管理委员会, Lead-Free Solder Analyzer

  • GB/T 41275.2-2022 Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 2:Mitigation of deleterious effects of tin




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