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Semiconductor chip test

Semiconductor chip test, Total:498 items.

In the international standard classification, Semiconductor chip test involves: Semiconducting materials, Optoelectronics. Laser equipment, Semiconductor devices, Applications of information technology, Integrated circuits. Microelectronics, Fibre optic communications, Cutting tools, Insulating materials, Vocabularies, Testing of metals, Inorganic chemicals, Electromechanical components for electronic and telecommunications equipment, Rectifiers. Convertors. Stabilized power supply, Electronic components in general, Surface treatment and coating, Character sets and information coding, Electricity. Magnetism. Electrical and magnetic measurements, Linear and angular measurements, Radiation measurements, Nuclear energy engineering, Piezoelectric and dielectric devices, Mechanical structures for electronic equipment, Technical drawings, Electrical wires and cables, Environmental testing, Electrical and electronic testing, Electrical accessories, Industrial automation systems, Plastics, Protection against fire, Rubber and plastics products, Electrical engineering in general, Graphical symbols, Acoustics and acoustic measurements.

German Institute for Standardization, Semiconductor chip test

DIN 50441-2:1998 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 2: Testing of edge profile
DIN EN 62258-2:2011-12 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011 / Note: DIN EN 62258-2 (2005-12) remains valid alongside this standard until 2014-06-29.
DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
DIN EN 62258-6:2007-02 Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 62258-6:2006); German version EN 62258-6:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).
DIN 50441-5:2001 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 5: Terms of shape and flatness deviation
DIN 50448:1998 Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulating semi-conductor slices using a capacitive probe
DIN EN 62258-5:2007-02 Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006); German version EN 62258-5:2006 / Note: Applies in conjunction with DIN EN 62258-1 (2011-04), DIN EN 62258-2 (2011-12).
DIN 50441-4:1999 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 4: Slice diameter, diamter variation, flat diameter, flat length, flat depth
DIN 50445:1992 Testing of materials for semiconductor technology; contactless determination of the electrical resistivity of semiconductor slices with the eddy current method; homogeneously doped semiconductor wafers
DIN EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN 50442-1:1981 Testing of semi-conductive inorganic materials; determination of the surface structure of circular monocrystalline semi-conductive slices; as-cut and lapped slices
DIN 50435:1988 Testing of semiconductor materials; determination of the radial resistivity variation of silicon or germanium slices by means of the four-probe/direct current method
DIN EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory (IEC 60749-38:2008); German version EN 60749-38:2008
DIN EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2011); English version EN 62258-2:2011
DIN 50441-3:1985 Testing of materials for semiconductor technology; measurement of the geometric dimensions of semiconductor slices; determination of flatness deviation of polished slices by means of the multiple beam interference
DIN EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010); German version EN 62417:2010
DIN EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007); German version EN 60191-6-16:2007
DIN EN 60747-16-10:2005 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004
DIN 50449-2:1998 Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
DIN EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection (IEC 60749-3:2002); German version EN 60749-3:2002
DIN EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
DIN EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
DIN EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2002); German version EN 60749-13:2002
DIN EN 62373:2007 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) (IEC 62373:2006); German version EN 62373:2006
DIN EN 60749-2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure (IEC 60749-2:2002); German version EN 60749-2:2002
DIN EN 60749-44:2017 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (IEC 60749-44:2016); German version EN 60749-44:2016
DIN EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
DIN EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength (IEC 60749-22:200 + Corr. 1:2003); German version EN 60749-22:2003
DIN EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 60749-17:2003); German version EN 60749-17:2003
DIN EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state (IEC 60749-36:2003); German version EN 60749-36:2003
DIN EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
DIN EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (IEC 60749-6:2002); German version EN 60749-6:2003
DIN EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (IEC 60749-12:2002); German version EN 60749-12:2002
DIN EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock (IEC 60749-10:2002); German version EN 60749-10:2002
DIN EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors (IEC 62416:2010); German version EN 62416:2010
DIN EN 60749-26:2007 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 60749-26:2006); German version EN 60749-26:2006
DIN EN 62047-3:2007-02 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006
DIN 50439:1982 Testing of materials for semiconductor technology; determination of the dopant concentration profile of single crystalline semiconductor material by means of the capacitancevoltage method and mercury contact
DIN EN 60749-39:2007 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (IEC 60749-39:2006); German version EN 60749-39:2006
DIN EN 60749-4:2003 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2002); German version EN 60749-4:2002
DIN EN 60749-4:2017-11 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017 / Note: DIN EN 60749-4 (2003-04) remains valid alongside this stand...
DIN 41881-1:1976 Semiconductor devices; metal cases with glass insulation, requirements and tests
DIN 41881-2:1978 Semiconductor devices; metal cases with ceramic insulation, requirements and tests
DIN EN 60749-9:2003 Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2002); German version EN 60749-9:2002

Fujian Provincial Standard of the People's Republic of China, Semiconductor chip test

DB35/T 1193-2011 Semiconductor LED chip

Professional Standard - Electron, Semiconductor chip test

SJ/T 11399-2009 Measurement methods for chips of light emitting diodes
SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources
SJ/T 11398-2009 Technical specification for power light-emitting diode chips
SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
SJ/T 11402-2009 Technical specification of semiconductor laser chip used in optical fiber communication
SJ/T 11818.2-2022 Semiconductor UV Emitting Diodes Part 2: Chip Specifications
SJ/T 11856.1-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 1: Fabry-Perot Type and Distributed Feedback Type Semiconductor Laser Chips for Light Sources
SJ/Z 9016-1987 Semiconductor devices--Mechanical and climatic test methods
SJ 20079-1992 Test mehods for gas sensors of metal-oxide semiconductor
SJ/T 10745-1996 Mechanical and climatic test methods for semiconductor integrated circuits
SJ/T 10801-1996 Semiconductor integrated circuits used as interface circuits - General principles of measuring methods for magnetic memory drivers
SJ/T 11874-2022 Stress test procedures for semiconductor discrete devices used in electric vehicles
SJ/T 11875-2022 Stress test procedures for semiconductor integrated circuits for electric vehicles

Group Standards of the People's Republic of China, Semiconductor chip test

T/QGCML 2041-2023
T/CIE 144-2022
T/ZAQ 10113-2022 Intermittent working life test equipment for semiconductor devices
T/IAWBS 009-2019 High Voltage Bias Steady-state Temperature Humidity Test for Power Semiconductor Devices
T/ZSA 47-2020 Reliability test methods for power semiconductor devices in electric vehicle applications
T/IAWBS 004-2021 General Requirements and Test Methods for Reliability Test of Power Semiconductor Modules Used in Electric Vehicles
T/CIE 119-2021 Atmospheric neutron single event effect test methods and procedures for semiconductor devices
T/CASAS 015-2022 Power cycling test method for silicon carbide metal-oxide-semiconductor field-effect-transistor（SiC MOSFET）

British Standards Institution (BSI), Semiconductor chip test

BS PD CLC/TR 62258-4:2013 Semiconductor die products. Questionnaire for die users and suppliers
PD ES 59008-4-1:2001 Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality
PD IEC/TR 62258-7:2007 Semiconductor die products. XML schema for data exchange
PD ES 59008-5-3:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die
PD IEC/TR 62258-8:2008 Semiconductor die products. EXPRESS model schema for data exchange
PD ES 59008-5-2:2001 Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures
PD CLC/TR 62258-3:2007 Semiconductor die products. Recommendations for good practice in handling, packing and storage
BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
PD ES 59008-6-2:2001 Data requirements for semiconductor die. Exchange data formats and data dictionary. Data dictionary
BS EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BS EN 60749-29:2004 Semiconductor devices - Mechanical and climatic test methods - Latch-up test
BS EN 60749-29:2003 Semiconductor devices - Mechanical and climatic test methods - Part 29:Latch-up test
BS EN 60749:1999 Semiconductor devices - Mechanical and climatic test methods
BS EN 62415:2010 Semiconductor devices - Constant current electromigration test
BS EN 62418:2010 Semiconductor devices. Metallization stress void test
BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BS EN 60747-16-10:2004 Semiconductor devices - Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
BS EN 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - External visual examination
BS EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - General
BS EN 60749-8:2003 Semiconductor devices. Mechanical and climatic test methods. Sealing
BS EN 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Low air pressure
BS EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Mechanical shock
BS EN 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Salt atmosphere
BS EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Bond strength
BS EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Acceleration, steady state
BS EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Neutron irradiation
BS EN 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Power cycling
BS EN 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Solderability
BS EN IEC 60749-13:2018 Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere
BS EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Temperature cycling
BS EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Vibration, variable frequency
BS EN 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Storage at high temperature
BS EN 60749-9:2002 Semiconductor devices - Mechanical and climatic test methods - Permanence of marking
BS EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Die shear strength
BS EN 60749-19:2003+A1:2010 Semiconductor devices. Mechanical and climatic test methods. Die shear strength
BS EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
BS IEC 62830-5:2021 Semiconductor devices. Semiconductor devices for energy harvesting and generation. Test method for measuring generated power from flexible thermoelectric devices
BS EN 60749-23:2004 Semiconductor devices - Mechanical and climatic test methods - High temperature operating life
BS EN 60749-21:2011 Semiconductor devices. Mechanical and climatic test methods. Solderability
BS 9300:1969 Specification for semiconductor devices of assessed quality: generic data and methods of test
IEC TR 63357:2022 Semiconductor devices. Standardization roadmap of fault test method for automotive vehicles
BS EN IEC 60749-12:2018 Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency
BS EN 60749-14:2003 Semiconductor devices - Mechanical and climatic test methods - Robustness of terminations (lead integrity)
BS EN 60749-23:2004+A1:2011 Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
BS EN 60749-5:2003 Semiconductor devices - Mechanical and climatic test methods - Steady-state temperature humidity bias life test
BS EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Rapid change of temperature - Two-fluid-bath method
BS EN 62373:2006 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
BS EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
BS EN 60749-29:2011 Semiconductor devices. Mechanical and climatic test methods. Latch-up test
BS EN 60749-18:2003 Semiconductor devices - Mechanical and climatic test methods - Ionizing radiation (total dose)
BS EN 60749-42:2014 Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
BS IEC 60747-5-13:2021 Semiconductor devices. Optoelectronic devices. Hydrogen sulphide corrosion test for LED packages
BS CECC 00013:1985 Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor dice
BS EN 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Damp heat, steady state, highly accelerated stress test (HAST)
BS EN 62374-1:2010 Semiconductor devices. Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
BS EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
BS EN 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
BS EN 60749-26:2014 Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
BS IEC 62047-29:2017 Semiconductor devices. Micro-electromechanical devices - Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
BS EN 60749-16:2003 Semiconductor devices - Mechanical and climatic test methods - Particle impact noise detection (PIND)
BS EN 62047-10:2011 Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
BS EN 62047-21:2014 Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
BS EN 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Accelerated moisture resistance - Unbiased HAST
BS EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials

IPC - Association Connecting Electronics Industries, Semiconductor chip test

IPC/EIA J-STD-026 CD-1999 Semiconductor Design Standard for Flip Chip Applications
IPC/EIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Semiconductor chip test

GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers
GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation
GB/T 35010.2-2018 Semiconductor die products—Part 2: Exchange data formats
GB/T 35010.5-2018 Semiconductor die products—Part 5：Requirements for concerning electrical simulation
GB/T 35010.1-2018 Semiconductor die products—Part 1：Requirements for procurement and use
GB/T 35010.7-2018 Semiconductor die products—Part 7: XML schema for data exchange
GB/T 35010.8-2018 Semiconductor die products—Part8: EXPRESS model schema for data exchange
GB/T 35010.3-2018 Semiconductor die products—Part 3: Guide for handling, packing and storage

European Committee for Electrotechnical Standardization（CENELEC）, Semiconductor chip test

CLC/TR 62258-4-2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
CLC/TR 62258-7:2007 Semiconductor die products - Part 7: XML schema for data exchange
CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing
CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
EN 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-3:2017 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration@ variable frequency
EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
HD 396-1979 Definitions of Test Method Terms for Semiconductor Radiation Detectors and Scintillation Counting
EN 62373:2006 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)

Danish Standards Foundation, Semiconductor chip test

DS/CLC/TR 62258-4:2013 Semiconductor die products - Part 4: Questionnaire for die users and suppliers
DS/ES 59008-5-1:2001 Data requirements for semiconductor die - Part 5-1: Particular requirements and recommendations for die types - Bare die
DS/EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
DS/EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/ES 59008-4-1:2001 Data requirements for semiconductor die - Part 4-1: Specific requirements and recommendations - Test and quality
DS/CLC/TR 62258-7:2008 Semiconductor die products - Part 7: XML schema for data exchange
DS/CLC/TR 62258-8:2008 Semiconductor die products - Part 8: EXPRESS model schema for data exchange
DS/CLC/TR 62258-3:2007 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
DS/EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
DS/IEC 749:1986 Semiconductor devices. Mechanical and climatic test methods
DS/EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
DS/EN 60749-8+Corr.2:2004 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
DS/EN 60749-2/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
DS/EN 60749-13/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
DS/EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
DS/EN 60749-22+Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strenght
DS/EN 60749-3:2003 Semiconductor devices - Mechanical and climatic test method - Part 3: External visual examination
DS/EN 60749-6/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
DS/EN 60749-12/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-12:2003 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
DS/EN 60749-10/Corr.1:2004 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 60749-10:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
DS/EN 62047-3:2007 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
DS/EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods -- Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
DS/EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

国家市场监督管理总局、中国国家标准化管理委员会, Semiconductor chip test

GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation

AENOR, Semiconductor chip test

UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-8:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
UNE-EN 60749-1:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
UNE-EN 60749-13:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 13: Salt atmosphere.
UNE-EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 17: Neutron irradiation
UNE-EN 60749-22:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
UNE-EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
UNE-EN 60749-25:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
UNE-EN 60749-6:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 6: Storage at high temperature.
UNE-EN 60749-36:2004 Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state

CENELEC - European Committee for Electrotechnical Standardization, Semiconductor chip test

ES 59008-5-1-2001 Data Requirements for Semiconductor Die Part 5-1: Particular Requirements and Recommendations for Die Types - Bare Die
EN 62258-2:2005 Semiconductor die products Part 2: Exchange data formats
EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats
ES 59008-5-3-2001 Data Requirements for Semiconductor Die - Part 5-3: Particular Requirements and Recommendations for Die Types - Minimally-Packaged Die
ES 59008-4-3-1999 Data Requirements for Semiconductor Die Part 4-3: Specific Requirements and Recommendations - Thermal
ES 59008-4-2-2000 2001 Data Requirements for Semiconductor Die - Part 4-2: Specific Requirements and Recommendations Handling and Storage
ES 59008-4-4-1999 Data Requirements for Semiconductor Die Part 4-4: Specific Requirements and Recommendations Electrical Simulation
EN 60749-21:2005 Semiconductor devices Mechanical and climatic test methods Part 21: Solderability
ES 59008-4-1-2000 Data Requirements for Semiconductor Die - Part 4-1: Specific Requirements and Recommendations Test and Quality
EN IEC 60749-17:2019 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Semiconductor chip test

GB/T 36356-2018 Technical specification for power light-emitting diode chips
GB/T 36357-2018 Technical specification for middle power light-emitting diode chips
GB/T 43136-2023 Superabrasive products: grinding wheels for precision scribing of semiconductor chips
GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
GB/T 6616-2023 Non-contact eddy current method for testing semiconductor wafer resistivity and semiconductor film sheet resistance
GB/T 13422-2013 Semiconductor converters.Electrical test methods
GB/T 4937-1995 Mechanical and climatic test methods for semiconductor devices
GB/T 13422-1992 Power semiconductor converters--Electrical test methods
GB/T 26070-2010 Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method
GB/T 3048.3-1994 Test methods for determining electrical properties of electric cables and wires.Measurement of volumeresistivity of semi-conducting rubbers and plastics
GB/T 4937.1-2006 Semiconductor devices. Mechanical and climatic test methods. Part 1: General
GB/T 6616-2009 Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge
GB/T 4937.2-2006 Semiconductor devices. Mechanical and climatic test methods. Part 2: Low air pressure
GB/T 4937.3-2012 Semiconductor devices.Mechanical and climatic tests methods.Part 3:External visual examination
GB/T 4937.4-2012v Semiconductor Device Mechanical and Climatic Test Methods Part 4: Highly Accelerated Steady State Damp Heat Test (HAST)
GB/T 4937.4-2012 Semiconductor devices.Mechanical and climatic test methods.Part 4:Damp heat,steady state,highly accelerated stress test(HAST)
GB/T 3048.3-2007 Test methods for electrical properties of electric cables and wires.Part 3: Test of volume resistivity of semi-conducting rubbers and plastics
GB/T 4937.42-2023 Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Semiconductor chip test

JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
JEDEC JESD49A.01-2013 Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD) (Minor Revision of JESD49, SEPTEMBER 2005, Reaffirmed January 2009)

Association Francaise de Normalisation, Semiconductor chip test

NF EN 62258-1:2011 Produits de puces de semiconducteurs - Partie 1 : approvisionnement et utilisation
NF EN 62258-2:2011 Produits de puces de semiconducteurs - Partie 2 : formats d'échange de données
NF C96-050-3*NF EN 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3 : thin film standard test piece for tensile testing
NF C80-203*NF EN 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs).
NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
NF C96-022-38*NF EN 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38 : soft error test method for semiconductor devices with memory.
NF C80-202*NF EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors
NF C80-201*NF EN 62415:2010 Semiconductor devices - Constant current electromigration test.
NF C80-204*NF EN 62418:2011 Semiconductor devices - Metallization stress void test
NF C96-022-29*NF EN 60749-29:2012 Semiconductor devices - Mechanical and climatic test methods - Part 29 : latch-up test
NF C96-013-6-16*NF EN 60191-6-16:2013 Mechanical standardization of semiconductor devices - Part 6-16 : glossary of semiconductor test and burn-in sockets for BGA, LGA, FBGA and FLGA
NF C96-009:1989 Electronic Components Semiconductor devices Mechanical and climatic test methods
NF C96-022-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere.
NF C96-022-19*NF EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength
NF C96-050-9*NF EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS.
NF C96-016-10*NF EN 60747-16-10:2005 Semiconductor devices - Part 16-10 : Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
NF C96-022-1*NF EN 60749-1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1 : general
NF C96-022-8*NF EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8 : sealing
NF C96-051*NF EN 62373:2006 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
NF C96-022-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability.
NF C96-022-21*NF EN 60749-21:2012 Semiconductor devices - Mechanical and climatic test methods - Part 21 : solderability
NF C96-022-2*NF EN 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2 : low air pressure
NF C96-022-13*NF EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13 : salt atmosphere
NF C96-022-34:2005 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling.
NF C96-022-17*NF EN 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17 : neutron irradiation.
NF C96-022-22*NF EN 60749-22:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22 : bond strength.
NF C96-022-25*NF EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25 : temperature cycling.
NF C96-022-10*NF EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10 : mechanical shock
NF C96-022-34*NF EN 60749-34:2011 Semiconducteur devices - Mechanical and climatic test methods - Part 34 : power cycling
NF C96-022-36*NF EN 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36 : acceleration steady state
NF C96-022-12*NF EN IEC 60749-12:2018 Semiconductor devices - Mechanical and climatic test methods - Part 12 : vibration, variable frequency
NF C96-022-6*NF EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature
NF C96-022-39*NF EN 60749-39:2006 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-39*NF EN IEC 60749-39:2022 Semiconductor devices - Mechanical and climatic test methods - Part 39 : measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
NF C96-022-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4 : damp heat, steady state, highly accelerated stress test (HAST).
NF C96-022-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6 : storage at high temperature.
NF EN 60749-36:2003 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 36 : accélération constante

ES-UNE, Semiconductor chip test

UNE-EN 62258-1:2010 Semiconductor die products -- Part 1: Procurement and use (Endorsed by AENOR in February of 2011.)
UNE-EN 62258-2:2011 Semiconductor die products - Part 2: Exchange data formats (Endorsed by AENOR in October of 2011.)
UNE-EN 62258-6:2006 Semiconductor die products -- Part 6: Requirements for information concerning thermal simulation(IEC 62258-6:2006) (Endorsed by AENOR in January of 2007.)
UNE-EN 62258-5:2006 Semiconductor die products -- Part 5: Requirements for information concerning electrical simulation (IEC 62258-5:2006) (Endorsed by AENOR in January of 2007.)
UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)

(U.S.) Telecommunications Industries Association , Semiconductor chip test

TIA J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

Hebei Provincial Standard of the People's Republic of China, Semiconductor chip test

DB13/T 5120-2019 Specifications for DC performance test of FP and DFB semiconductor laser chips for optical communication

SE-SIS, Semiconductor chip test

SIS SS CECC 00013-1985 Basic specification: Scanning electron microscope inspection of semiconductor dice

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Semiconductor chip test

IPC J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

TIA - Telecommunications Industry Association, Semiconductor chip test

J-STD-026-1999 Semiconductor Design Standard for Flip Chip Applications (IPC/EIA J-STD-026)

Association of German Mechanical Engineers, Semiconductor chip test

VDI/VDE 3713 Blatt 8-1995 Technical procurement specification - Epoxy encapsulants for semiconductor chips

PT-IPQ, Semiconductor chip test

NP 3081-1985

Lithuanian Standards Office , Semiconductor chip test

LST EN 62258-2-2011 Semiconductor die products -- Part 2: Exchange data formats (IEC 62258-2:2011)
LST EN 60749-19+AC-2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2002)
LST EN 60749-19+AC-2003/A1-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2003/A1:2010)

HU-MSZT, Semiconductor chip test

International Electrotechnical Commission (IEC), Semiconductor chip test

IEC 62951-6:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
IEC 62047-3:2006 Semiconductor devices - Micro electromechanical devices - Part 3: Thin film standard test piece for tensile-testing
IEC 62417:2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
IEC 60749:1984 Semiconductor devices. Mechanical and climatic test methods
IEC 62415:2010 Semiconductor devices - Constant current electromigration test
IEC 60749:2002 Semiconductor devices - Mechanical and climatic test methods
IEC 62418:2010 Semiconductor devices - Metallization stress void test
IEC 60749-38:2008 Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
IEC 62373-1:2020 Semiconductor devices - Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET
IEC 60700:1981 Testing of semiconductor valves for high-voltage d.c. power transmission
IEC 60759:1983 Standard test procedures for semiconductor X-ray energy spectrometers
IEC 63364-1:2022 Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
IEC 62951-5:2019 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials
IEC 60749/AMD1:2000 Semiconductor devices - Mechanical and climatic test methods; Amendment 1
IEC 60749/AMD2:2001 Semiconductor devices - Mechanical and climatic test methods; Amendment 2
IEC 60333:1993 Nuclear instrumentation; semiconductor charged-particle detectors; test procedures
IEC 62047-34:2019 Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
IEC 60749-29:2011 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test
IEC 63275-1:2022 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability
IEC 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
IEC 60759:1983/AMD1:1991 Standard test procedures for semiconductor X-ray energy spectrometers; amendment 1
IEC 60749-3:2002 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 62047-9:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
IEC 60749-1:2002 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-1:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 1: General
IEC 60749-8:2002/COR2:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
IEC 63275-2:2022 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 2: Test method for bipolar degradation due to body diode operatio
IEC 60747-16-10:2004 Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
IEC 62830-5:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
IEC 60749-26:2003 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing; Human body model (HBM)
IEC 60749-21:2004 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2005 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 60749-21:2011 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
IEC 62526:2007 Standard for extensions to Standard Test Interface Language (STIL) for semiconductor design environments
IEC 60749-2:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-2:2002 Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure
IEC 60749-39:2021 RLV Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60749-39:2021 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
IEC 60747-18-1:2019 Semiconductor devices - Part 18-1: Semiconductor bio sensors - Test method and data analysis for calibration of lens-free CMOS photonic array sensors
IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60749-13:2002 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-17:2003 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
IEC 60749-34:2005 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-13:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
IEC 60749-10:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
IEC 60596:1978 Definitions of test method terms for semiconductor radiation detectors and scintillation counting
IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC 60749-34:2004 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
IEC 60749-36:2003 Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC 60749-12:2017 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
IEC 60749-22:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-22:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
IEC 60749-19:2003/AMD1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
IEC 63284:2022 Semiconductor devices - Reliability test method by inductive load switching for gallium nitride transistors
IEC 60749-26:2006 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
IEC 62830-6:2019 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6: Test and evaluation methods for vertical contact mode triboelectric energy harvesting devices
IEC 62951-8:2023 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 8: Test method for stretchability, flexibility, and stability of flexible resistive memory
IEC 60749-4:2002 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC 60749-6:2002 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-6:2002/COR1:2003 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
IEC 60749-19:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
IEC 62373:2006 Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)
IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

Korean Agency for Technology and Standards (KATS), Semiconductor chip test

KS M 1804-2008 Test method of hydrofluoric acid for semi-conductor
KS C 6565-2022 Test methods of semiconductor acceleration sensors
KS C IEC 60749:2004 Semiconductor devices－Mechanical and climate test methods
KS C IEC 60749-2004(2020) Semiconductor devices－Mechanical and climate test methods
KS C 6049-1980 Environmental Testing Methods and Endurance Testing Methods for Semiconductor Integrated Circuits
KS C IEC 60759:2009 Standard test procedures for semiconductor X-ray energy spectrometers
KS C 6049-1980(2020) Environmental Testing Methods and Endurance Testing Methods for Semiconductor Integrated Circuits
KS C IEC 62951-1:2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
KS C 6046-1978(2001) ENVIRONMENTAL TESTING METHODS AND ENDURANCE TESTING METHODS FOR DISCRETE SEMICONDUCTOR DEVICES
KS C 6046-1986 ENVIRONMENTAL TESTING METHODS AND ENDURANCE TESTING METHODS FOR DISCRETE SEMICONDUCTOR DEVICES
KS C IEC 60749-3:2002 Discrete semiconductor devices－Mechanical and climatic test methods－Part 3：External visual examination
KS C IEC 60749-19:2005 Semiconductor devices－Mechanical and climatic test methods－Part 19：Die shear strength
KS C IEC 60749-1:2006 Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8:2006 Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-8-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-1-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-1-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 1：General
KS C IEC 60749-8-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 8：Sealing
KS C IEC 60749-24-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
KS C IEC 60749-24-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 24：Accelerated moisture resistance－Unbiased HAST
KS C IEC 60749-2:2004 Semiconductor devices－Mechanical and climatic test methods－Part 2：Low air pressure
KS C IEC 60749-21:2005 Semiconductor devices－Mechanical and climatic test methods－ Part 21：Solderability
KS C IEC 60749-39-2006(2021) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-39-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-13:2002 Semiconductor devices-Mechanical and climatic test methods-Part 13:Salt atmosphere
KS C IEC 60749-22:2004 Semiconductor devices-Mechanical and climatic test methods-Part 22:Bond strength
KS C IEC 60749-10:2004 Semiconductor devices－Mechanical and climatic test methods－Part 10：Mechanical shock
KS C IEC 60749-17:2006 Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-10:2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-17-2006(2016) Semiconductor devices－Mechanical and climatic test methods－Part 17：Neutron irradiation
KS C IEC 60749-12:2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-34-2017(2022) Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-39:2006 Semiconductor devices－Mechanical and climatic test methods－Part 39：Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
KS C IEC 60749-4:2003 Semiconductor devices－Mechanical and climatic test methods－Part 4：Damp heat, steady state, highly accelerated stress test(HAST)
KS C IEC 60749-6:2004 Semiconductor devices-Mechanical and climatic test methods-Part 6:Storage at high temperature
KS C IEC 60749-9:2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking

YU-JUS, Semiconductor chip test

JUS N.R1.500-1980 Semioonductor ?evices. Acceptance. Electrical tests

Military Standard of the People's Republic of China-General Armament Department, Semiconductor chip test

GJB 128-1986 Aerial photographic specification for military topographic mapping
GJB 128B-2021 Semiconductor discrete device test methods
GJB 762.1-1989 Semiconductor device radiation hardening test method Neutron irradiation test
GJB 762.3-1989 Semiconductor device radiation hardening test method γ instantaneous irradiation test
GJB 762.2-1989 Semiconductor device radiation hardening test method gamma total dose irradiation test
GJB 7678-2012 Test method for 10KeV X-ray irradiation hardening of semiconductor devices
GJB 762.1A-2018 Test methods for radiation hardening of semiconductor devices Part 1: Neutron irradiation test
GJB 762.3A-2018 Test methods for radiation hardening of semiconductor devices - Part 3: Gamma instantaneous irradiation test
GJB 762.2-1989(XG1-2015) Semiconductor device radiation hardening test method γ total dose irradiation test modification sheet 1-2015

KR-KS, Semiconductor chip test

KS M 1804-2008(2023) Test method of hydrofluoric acid for semi-conductor
KS C IEC 62951-1-2022 Semiconductor devices — Flexible and stretchable semiconductor devices — Part 1: Bending test method for conductive thin films on flexible substrates
KS C IEC 60749-17-2021 Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
KS C IEC 60749-10-2020 Semiconductor devices — Mechanical and climatic test methods — Part 10: Mechanical shock
KS C IEC 60749-34-2017 Semiconductor devices－Mechanical and climatic test methods－Part 34：Power cycling
KS C IEC 60749-12-2020 Semiconductor devices — Mechanical and climatic test methods — Part 12: Vibration, variable frequency
KS C IEC 60749-9-2020 Semiconductor devices — Mechanical and climatic test methods — Part 9: Permanence of marking

未注明发布机构, Semiconductor chip test

GJB 128A-1997 Semiconductor discrete device test methods
BS CECC 13:1985(1999) Harmonized system of quality assessment for electronic components : Basic specification : Scanning electron microscope inspection of semiconductor dice

RU-GOST R, Semiconductor chip test

GOST 28578-1990 Semiconductor devices. Mechanical and climatic test methods
GOST 26567-1985 Semiconductor energy converters. Test methods
GOST 24461-1980 Power semiconductor devices. Test and measurement methods

Defense Logistics Agency, Semiconductor chip test

DLA MIL-STD-750 E-2006 TEST METHOD STANDARD FOR SEMICONDUCTOR DEVICES
DLA MIL-PRF-19500/657 B-2011 SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE, N AND P-CHANNEL, SILICON VARIOUS TYPES JANHC AND JANKC
DLA SMD-5962-87685-1987 MICROCIRCUITS, 8-BIT MICROPROCESSOR CPU, NMOS, MONOLITHIC SILICON
DLA SMD-5962-90976-1992 MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
DLA SMD-5962-91566 REV C-1996 MICROCIRCUIT, DIGITAL, CMOS SINGLE CHIP 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
DLA SMD-5962-93228 REV B-2005 MICROCIRCUIT, DIGITAL, CMOS, TEST BUS CONTROLLER, MONOLITHIC SILICON
DLA MIL-PRF-19500/741 A-2009 SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED (TOTAL DOSE AND SINGLE EVENT EFFECTS) TRANSISTOR DIE, N-CHANNEL AND P-CHANNEL, SILICON, VARIOUS TYPES, JANHC AND JANKC
DLA SMD-5962-92201 REV A-2003 MICROCIRCUIT, DIGITAL, ADVANCED CMOS, NINE-BIT PARITY GENERATOR/CHECKER, MONOLITHIC SILICON
DLA SMD-5962-04227 REV B-2005 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K X 32-BIT (16 M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE

Japanese Industrial Standards Committee (JISC), Semiconductor chip test

JIS C 7033:1975 Testing methods for semiconductor rectifier diodes
JIS C 7021:1977 Environmental testing methods and endurance testing methods for discrete semiconductor devices
JIS C 7022:1979 Environmental testing methods and endurance testing methods for semiconductor integrated circuits

PH-BPS, Semiconductor chip test

PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
PNS IEC 62373-1:2021 Semiconductor devices - Bias-temperature stability test for metal-ox ide, semiconductor, field-effect transistors (MOSFET) - Part 1: Fast BTI test for MOSFET
PNS IEC 60749-44:2021 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
PNS IEC 62830-4:2021 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
PNS IEC 60749-17:2021 Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

American Society for Testing and Materials (ASTM), Semiconductor chip test

ASTM F673-90(1996)e1 Standard Test Methods for Measuring Resistivity of Semiconductor Slices or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage
ASTM E1161-03 Standard Test Method for Radiologic Examination of Semiconductors and Electronic Components
ASTM F1892-12(2018) Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
ASTM D6095-99 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D6095-05 Standard Test Method for Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM F1892-06 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
ASTM F1892-04 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
ASTM F1892-98 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
ASTM F1892-12 Standard Guide for Ionizing Radiation (Total Dose) Effects Testing of Semiconductor Devices
ASTM F978-90(1996)e1 Standard Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques
ASTM D6095-12(2023) Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D6095-06 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials
ASTM D6095-12 Standard Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials

CZ-CSN, Semiconductor chip test

CSN 35 1609-1983 Power semiconductor devices. Heat sinks. Testing methodo

American National Standards Institute （ANSI), Semiconductor chip test

ANSI/IEEE 300:1988 Test Procedures for Semiconductor Charged-Particle Detectors
ANSI/ASTM E1161:1996 Test Method for Radiologic Examination of Semiconductors and Electronic Components
ANSI/ASTM D4325:2013 Test Methods for Nonmetallic Semi-Conducting and Electrically Insulating Rubber Tapes
ANSI/IEEE C62.35:2010 Standard Test Methods for Avalanche Junction Semiconductor Surge-Protective Device Components
ANSI/UL 2360-2004 Test Methods for Determining the Combustibility Characteristics of Plastics Used in Semi-Conductor Tool Construction
ANSI/ASTM D6095:2012 Test Method for Longitudinal Measurement of Volume Resistivity for Extruded Crosslinked and Thermoplastic Semiconducting Conductor and Insulation Shielding Materials

Institute of Electrical and Electronics Engineers (IEEE), Semiconductor chip test

IEEE 759-1984 Test procedures for semiconductor X-ray energy spectrometers
IEEE 857-1990 Guide for test procedures for HVDC thyristor valves
IEEE Std C62.35-1987(R1993) IEEE Standard Test Specifications for Avalanche Junction Semiconductor Surge Protective Devices
IEEE Std C62.37/COR-2009 Errata to IEEE Standard Test Specification for Thyristor Diode Surge Protective Devices

Professional Standard - Aerospace, Semiconductor chip test

QJ 10004-2008 Total dose radiation testing method of semiconductor devices for space applications
QJ 10005-2008 Test guidelines of single event effects induced by heavy ions of semiconductor devices for space applications

JP-JEITA, Semiconductor chip test

JEITA EDR-4704A-2007 Application guide of the accelerated life test for semiconductor devices

PL-PKN, Semiconductor chip test

PN E06171-1985 Fuses for protection of semiconductor devices General requirements and tests
PN T01101-1987 Semiconductor devices Mechanical and climatic test methods [Translation of Publication IEC 749 (1984)]

Shaanxi Provincial Standard of the People's Republic of China, Semiconductor chip test

DB61/T 1448-2021 Intermittent life test procedures for high-power semiconductor discrete devices

Taiwan Provincial Standard of the People's Republic of China, Semiconductor chip test

CNS 5076-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Vibration Test)
CNS 5073-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Shock Test)
CNS 5541-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Transistor)
CNS 5543-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Intermittent Operation Test of Transistor)
CNS 5072-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Sealing Test)
CNS 6117-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Damp Heat Test)
CNS 5069-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Thermal Shock)
CNS 6122-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Applying Voltage Test of Thyristors)
CNS 6120-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Continuous Operation Test of Thyristors)
CNS 6124-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices(Intermittent Applying Voltage Test of Thyristors)
CNS 6126-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (High Temperature for Applying Voltage Test of Thyristors)
CNS 5070-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature)
CNS 5077-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Terminal Strength)
CNS 5547-1988 1
CNS 5075-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Constant Acceleration)
CNS 5074-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Free Fall)
CNS 5078-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Salt Mist Spray)
CNS 6118-1988 1
CNS 5542-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Continuous Operation Test of Field Effect Transistor
CNS 5545-1988 Environmental Testing Methods and Endurance Testing Methods for Discrate Semiconductor Devices Reverse Bias Test of Transistor Under High Temperature)
CNS 5544-1988 Environmantal Testing Methods and Endurance Testing Methods for Discrate Semiconductor Devices (Intermittent Operation Test of Fleld Effect Transistor)
CNS 5071-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Cycle Test for Temperature & Humidity)
CNS 5067-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Test of Soft Solders for Heat Endurance)
CNS 5068-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Solderability Testing for Adhesion)
CNS 5546-1988 Environmental Testing Methods and Endurance Testing Methods for Discrete Semiconductor Devices (Reverse Bias Test of Field Effect Transistor Under High Temperature)

工业和信息化部, Semiconductor chip test

SJ/T 11586-2016 Test method for 10KeV low-energy X-ray total dose irradiation of semiconductor devices

GOSTR, Semiconductor chip test

GOST R 57394-2017 Integrated circuits and semiconductor devices. Methods of accelerated tests for non-failure operation

European Committee for Standardization (CEN), Semiconductor chip test

HD 396 S1-1979 Definitions of test method terms for semiconductor radiation detectors and scintillation counting

Underwriters Laboratories (UL), Semiconductor chip test

UL 2360-2000 Test Methods for Determining the Combustibility Characteristics of Plastics Used in Semi-Conductor Tool Construction

AT-OVE/ON, Semiconductor chip test

OVE EN IEC 63275-1:2021 Semiconductor devices - Reliability test method for silicon carbide discrete metal-oxide semiconductor field effect transistors - Part 1: Test method for bias temperature instability (IEC 47/2679/CDV) (english version)