31.190 电子元器件组件 标准查询与下载

KS C IEC 61192-4-2007(2017) 焊接电子组件工艺要求第4部分:端子组件

Workmanship requirements for soldered electronic assemblies－Part 4：Terminal assemblies

KS C IEC 61192-4-2007(2022) 焊接电子组件的工艺要求第4部分:端子组件

Workmanship requirements for soldered electronic assemblies－Part 4：Terminal assemblies

KS C IEC 61192-3:2007 钎焊电子组件的工艺要求.第3部分:通孔安装组件

이 규격은 유기기판, 인쇄기판 그리고 유기기판의 표면에 부착된 유사 적층판상의 관통홀 실장

Workmanship requirements for soldered electronic assemblies－Part 3：Through-hole mount assemblies

KS C IEC 61192-4:2007 钎焊电子组件的工艺要求.第4部分:终端组件

이 규격은 유기기판, 인쇄기판 그리고 유기기판의 표면에 부착된 유사 적층판상의 단자 납땜

Workmanship requirements for soldered electronic assemblies－Part 4：Terminal assemblies

LST EN 61192-5-2007 焊接电子组件的工艺要求 第5部分：焊接电子组件的返工、修改和维修（IEC 61192-5:2007）

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 61192-5:2007)

DS/EN 61190-1-2:2007 电子组装用连接材料 第 1-2 部分：电子组装中高质量互连用焊膏的要求

This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

LST EN 61190-1-2-2007 电子组装用附件材料 第 1-2 部分：电子组装中高质量互连用焊膏的要求（IEC 61190-1-2:2007）

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007)

LST EN 61190-1-3-2007 电子组装用附件材料 第 1-3 部分：电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊料的要求（IEC 61190-1-3:2007）

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2007)

BS EN 61163-1:2007 可靠性应力筛分 第1部分：批制造的可修复组件

Reliability stress screening - Repairable assemblies manufactured in lots

BS EN 61163-1:2006 可靠性应力筛分.第1部分:批制造的可修复组件

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable. The reasons for using reliability stress screening may be time constraints and/or the very nature of the deficiencies that the reliability stress screening is designed to catch. The processes apply to any stage of a series production of repairable assemblies (see Figure 3). The methods for setting up a process can be used during production planning, during pilot-production, as well as during well-established running production. A prerequisite for the application of the methods is that a certain level of flaws remaining in the outgoing assembly can be specified. The processes described are general processes for reliability stress screening in cases where no specific process is described in a product standard. They are also intended for use by IEC committees in connection with preparation of product standards. A reliability stress screening process can form part of an overall reliability programme (see IEC 60300-2).

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

EN 62137-1-2:2007 表面安装技术.表面安装焊接接缝的环境和耐久性试验方法.第1-2部分:剪切强度试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

IEC 62421:2007 电子组装技术.电子模块

This International Standard provides a generic standard of electronic modules on which their sectional standards are based. This standard provides a definition, business model, interface between the trading partners, and related areas of standardization of electronic modules. In addition a generic set of test method is provided.

Electronics assembly technology - Electronic modules

BS EN 61192-5:2007 钎焊电子组装件的工艺要求.钎焊电子组装件的再加工、改进和维修

This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. This part of IEC 61192 also contains guidance on design matters where they have relevance to rework.

Workmanship requirements for soldered electric assemblies - Rework, modification and repair of soldered electronic assemblies

BS EN 61190-1-3:2007+A1:2010 电子组件用连接材料.电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

IEC 61192-5:2007 焊接电子组件的工艺要求.第5部分:焊接电子组件的再加工、改进和检修

This part of IEC 61192 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products. This part of IEC 61192 also contains guidance on design matters where they have relevance to rework.

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

IEC 61190-1-3:2007 电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料用要求

This part of IEC61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. This standard is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solder powders, etc.

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

IEC 61190-1-2:2007 电子组件用连接材料.第1-2部分:电子组件中高质量互连接件用焊剂的要求

This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. Related information on flux characterization, quality control and procurement documentation for solder flux and flux containing material may be found in IEC 61190-1-1.

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly

IPC 9151B-2007 印制电路板制程能力,质量和可靠性相对(PCQR2)基准测试标准和数据库

The purpose of this document is to define the Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database Program used for the evaluation of Printed Circuit Board (PCB) manufacturing processes. This is in accordance with The National Technology Roadmap for Electronic Interconnections 2000/2001 published by IPC, which states that ‘‘For a company to efficiently manage its supply chain it must identify the capability of its suppliers and make certain that their capability for manufacturing a product is consistent with the needs of the customer.’’

Printed Board Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard and Database

IPC 4554-2007 印刷电路板沉浸镀锡规格

This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM).

Specification for Immersion Tin Plating for Printed Circuit Boards

KS C IEC 61190-1-2-2006(2016) 电子组装用连接材料第1－2部分:电子组装用高质量互连用焊膏的要求

Attachment materials for electronic assembly－Part 1－2：Requirements for solder pastes for high-quality interconnections in electronics assembly