L30 印制电路 标准查询与下载

IEC 61249-4-16:2009 印制板和其他互连结构用材料.第4-16部分:非包被预浸料(多层板结构)的分规范集.无铅化装配用指定易燃性多功能环氧化合物编织E型玻璃预浸料(垂直燃烧试验)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined

BS EN 61249-2-35:2009 印制板和其他互连结构用材料.第2-35部分:包覆和非包覆增强基材.无铅装配用规定易燃性(垂直燃烧试验)铜包改性环氧化物编织的E玻璃层压板

This part of IEC 61249 gives requirements for properties of modified brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C to 200 °C. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order; otherwise, the default class of material will be supplied.

Materials for printed boards and other interconnecting structures — Part 2-35: Reinforced base materials, clad and unclad — Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free ass

BS EN 61249-2-37:2009 印制板和其他互连结构用材料.第2-37部分:包层和非包层增强基材.无铅装配用规定可燃性的铜包改性非卤化环氧化物编织的E玻璃层压板(垂直燃烧试验)

This part of IEC 61249 gives requirements for properties of modified non-halogenated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C to 200 °C. Its flame resistance is defined in terms of the flammability requirements of 7.3. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures — Part 2-37: Reinforced base materials, clad and unclad — Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-34:2009 印制板和其他互连结构用材料.第2-34部分:高频设施用包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤3.7)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材非卤化的改良或非改良树脂系统

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permi

IEC 61249-2-32:2009 印制板和其他互连结构用材料.第2-32部分:包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤3.7)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材卤化的改良或非改良树脂系统

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 3,7 at

IEC 61249-2-31:2009 印制板和其他互连结构用材料.第2-31部分:包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤4.1)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材卤化的改良或非改良树脂系统

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal or less than

IEC 61249-2-33:2009 印制板和其他互连结构用材料.第2-33部分:包覆和非包覆增强基材.铜包覆限定介电常数(1GHz下≤4.1)和易燃性(垂直燃烧试验)的环氧编织E型玻璃层压板材非卤化的改良或非改良树脂系统

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminated sheets of defined permittivity (equal or less than 4,1

GOST R 53386-2009 印刷电路板.术语和定义

Printed circuit boards. Terms and definitions

ASTM B885-09 印刷线路板触点上存在杂质的标准试验方法

This test method provides a way to detect contamination on printed wiring board fingers that affects the electrical performance of such fingers. Such contamination may arise during PWB manufacture, circuit assembly, or service life and may include solder mask, solder flux, hardened lubricants, dust, or other materials. This test method provides a nondestructive method of inspecting such fingers at any point in the life of the product including after original manufacture, after assembly of circuit components to the PWB, and after time in service such as when returned for repair. Because this test method uses two probes to finger contacts in series, it provides a sensitive test for contaminants that may increase electrical resistance when the fingers are plugged into an edgecard connector that typically makes contact to the finger through only one contact to finger interface. Practice B 667 describes a more general procedure for measuring contact resistance of any solid material in practically any geometrical form. The method in Practice B 667 should be used for general studies and fundamental studies of electrical contact materials.1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria. 1.2 Practice B 667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B 667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers. 1.3 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to become familiar will all hazards including those identified in the appropriate Material Safety Data Sheet (MSDS) for this product/material as provided by the manufacturer, to establish appropriate safety and health practices, and determine the applicability of regulatory limitations prior to use.

Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

KS C IEC 61086-1:2008 加感印制电路板用敷层(保形敷层)规范.第1部分:定义、分类及通用要求

이 표준은 실장인쇄배선기판 코팅(등각 코팅)으로 적용하기에 적합한 전기 절연 재료에 대한

Specification for coatings for loaded printed wire boards(conformal coatings)－Part 1：Definitions, classification and general requirements

IEC 61249-2-35:2008 印制板和其他互连结构用材料.第2-35部分:包覆和非包覆增强基材.无铅组件用铜包覆的规定可燃性(垂直燃烧试验)的改良环氧编织E型玻璃层压板材

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials; clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-2-38:2008 印制板和其他互连结构用材料 第2-38部分 包覆和非包覆增强基材 无铅组件用铜包覆的规定可燃性(垂直燃烧试验)的非卤化环氧编织E型玻璃层压板材

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free as

IEC 61249-2-37:2008 印制板和其他互连结构用材料 第2-37部分 包覆和非包覆增强基材 无铅组件用铜包覆的规定可燃性(垂直燃烧试验)的改良非卤化环氧编织E型玻璃层压板材

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lea

BS DD IEC/PAS 62588:2008 鉴别有铅(PB)、无铅和其它属性的元件、印制电路板(PCBs)和印制电路板组件(PCBAs)的标记和标注

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

DIN EN 61249-4-1:2008 印制板和其他互连结构用材料.第4-1部分:非包覆预浸料的分规范集(用于多层板产品).指明易燃的环氧编织E型玻璃纤维预浸料

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (IEC 61249-4-1:2008)

IEC PAS 62588:2008 鉴别有铅(PB)、无铅和其它属性的元件、印制电路板(PCBs)和印制电路板组件(PCBAs)的标记和标注

This document applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes. This document describes the marking of components and the labeling of their shipping containers to identify their 2na level terminal finish or material, and applies to components that are intended to be attached to boards or assemblies with solder or mechanical clamping or are press fit. This document also applies to 2nd level terminal materials for bumped die that are used for direct board attach. This document applies to boards/assemblies, to identify the type of Pb-free or Pb-containing solder used. This document documents a method for identifying board surface finishes and Printed Circuit Board (PCB) resin systems. This docu- ment applies to PCB base materials and for marking the type of conformal coating utilized on Printed Circuit Board Assemblies (PCBAs). Material and their containers previ- ously marked or labeled according to JESD 97 or IPC-1066 need not be remarked unless agreed upon by the supplier and customer. Labeling of exterior surfaces of finished articles, such as computers, printers, servers, and the like, is outside the scope of this document. However internal PCBs and PCBAs are covered by this document. Labeling of retail packages containing electronic products is also outside the scope of this document.

Marking and labeling of components, PCBs and PCBAs to identify lead (PB), Pb-free and other attributes

JIS C 6485:2008 印制电路用基础材料.纸基、酚醛树脂

This Standard specifies the requirements for properties of paper based phenolic resin copper-clad laminates of both economic and high electrical grades, in thicknesses of 0.8 mm up to 3.2 mm. NOTE 1 This Standard gives the specification concerning the characteristics of the copper-clad laminates, the requirements of which present the values the products are expected to have. This Standard, therefore, is not intended to be used to conduct a conformity assessment by itself. NOTE 2 The International Standards corresponding to this Standard and the sym- bol of degree of correspondence are as follows. IEC 61249-2-1 : 2005 Materials for printed boards and other interconnect- ing structures Part 2-1: Reinforced base materials, clad and unclad-- Phenolic cellulose paper reinforced laminated sheets; economic grade, copper clad IEC 61249-2-2 : 2005 Materials for printed boards and other interconnect- ing structures Part 2-2: Reinforced base materials, clad and unclad-- Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad (Overall evaluation: MOD) The symbols which denote the degree of correspondence in the contents in the corresponding International Standard and JIS are IDT (identical), MOD (modified) and NEQ (not equivalent) according to ISO/IEC Guide 21.

Base materials for printed circuits -- Paper base, phenolic resin

BS EN 61249-4-1:2008 印制电路板和其它互连结构用材料.(多层板的加工用)非包覆预浸料的分规范集.规定易燃性的环氧化合物机织E型玻璃预浸料坯

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

UL 796F BULLETIN-2008 挠性材料互连结构的UL安全标准(评审和投票到期日:2008年5月27日)

The following topics are being recirculated: 1. Revision of Paragraph 1.1.2 5. Revision of the Proposed Definition of "Dessicator" in Paragraph 1.4.50.1 20. Revision of Proposed Paragraph 5.1.3.1.1 22. Revision of Proposed Paragraphs 5.1A.3.3 and 5.1A.4.1 36. Revision of Proposed Requirements for Solder Limits, Section 6.5; Proposed Change of "Thermal Shock" to "Thermal Stress" Throughout UL 796F; Revision of Requirements in Section 5.2

UL Standard for Safety for Flexible Materials Interconnect Constructions COMMENTS AND BALLOTS DUE: May 27, 2008

DIN EN 61188-5-4:2008 印制电路板和印制电路板组件 设计和使用 第5-4部分 焊接(焊接区和焊缝)考虑 两面带有J形引线的部件

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007