L30 印制电路 标准查询与下载

DIN EN 61188-5-5:2008 印制电路板和印制电路板组件 设计和使用 第5-5部分 焊接(焊接区/焊缝)考虑 四面带有翅形引线的部件

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007

DIN EN 61188-5-8:2008 印制电路板和印制电路板组件 设计和使用 第5-8部分 焊接(焊接区/焊缝)考虑 区域阵列组件(BGA、FBGA、CGA、LGA)

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008

DIN EN 61188-5-4:2008 印制电路板和印制电路板组件 设计和使用 第5-4部分 焊接(焊接区和焊缝)考虑 两面带有J形引线的部件

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007

KS C IEC 61249-4-11:2008 印刷电路板和其他互连结构用材料.第4-11部分:非包覆预浸料的分规范集.阻燃型非卤化环氧编织E型玻璃纤维预浸料坯

KS C IEC 61249 중 이 표준은 IEC 62326-4에 따라 다층회로기판을 제작할

Materials for printed boards and other interconnecting structures-Part 4-11:Sectional specification set for prepreg materials, unclad-Non-halogenated epoxide, woven E-glass prepreg of defined flammability

KS C IEC 61249-4-12:2008 印刷电路板和其他互连结构用材料.第4-12部分:非包覆预浸料的分规范集.阻燃型非卤化多功能环氧编织E型玻璃纤维预浸料坯

KS C IEC 61249 중 이 부분은 IEC 62326-4에 따라 다층회로기판을 제작할

Materials for printed boards and other interconnecting structures-Part 4-12:Sectional specification set for prepreg material, unclad-Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

KS C IEC 61249-4-2:2008 印刷电路板和其他互连结构用材料.第4-2部分:非包覆预浸料的分规范集.阻燃型多功能环氧编织E型玻璃纤维预浸料坯

KS C IEC 61249 중 이 표준은 IEC 62326-4에 따라 다층회로기판을 제작할

Materials for printed boards and other interconnecting structures-Part 4-2:Sectional specification set for prepreg materials, unclad-Multifunctional epoxide woven E-glass prepreg of defined flammability

KS C IEC 61249-4-5:2008 印刷电路板和其他互连结构用材料.第4-5部分:非包覆预浸料的分规范集.阻燃型改良和未改良的聚酰亚胺编织E型玻璃纤维预浸料坯

KS C IEC 61249 중 이 표준은 IEC 62326-4에 따라 다층회로기판을 제작할

Materials for printed boards and other interconnecting structures-Part 4-5:Sectional specification set for prepreg materials, unclad-Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

DIN EN 61189-3:2008 印制电路板和其它互连设备和配件用电材料的试验方法.第3部分:互连设备的试验方法(印制电路板)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) (IEC 61189-3:2007); German version EN 61189-3:2008

BS EN 61188-5-8:2008 印制电路板和印制电路板组件.设计和使用.焊接(焊接区/焊缝)要求.区域阵列组件(BGA、FBGA、CGA、LGA)

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder joint no matter which solder alloy is used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different depending on the solder alloy and should be analyzed so that the process is taking place above the liquidus temperature of the alloy, and remains above that temperature a sufficient time to form a reliable metallurgical bond.Area array land patterns do not use "land protrusion" concepts and attempt to match the characteristics of the physical and dimensional termination properties. There are several configurations available, as shown in Figure 1. However, the tables provided show only the optimum dimension across the outer construction of the land.

Printed boards and printed board assemblies — Design and use — Part 5-8: Attachment (land/joint) considerations — Area array components (BGA, FBGA, CGA, LGA)

BS EN 61189-3:2008 电气材料、印制板和其它互连结构及组装件的试验方法.互连结构的试验方法(印制板)

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards)

JB/T 7488-2008 无铅波峰焊接通用工艺规范

本标准规定了电子组装件产品（简称为产品）在进行无铅波峰焊焊接时应遵循的工艺要求和质量检查规范。 本标准适用于以印制电路板（PCB）为组装基板的电子组装件的无铅波峰焊接加工和质量检验。

General technological specification for lead-free wavesoldering

UL 746E BULLETIN-2008 UL安全标准.聚合材料制工业用层压板,纤维缠绕管,硫化纤维以及印制线路板用材料.评议提交截止日期:2008年2月25日

These requirements cover test procedures to be used for the evaluation of industrial laminates, filament wound tubing, vulcanized fibre, and materials for use in fabricating printed wiring boards. These requirements provide data with respect to the physical, electrical, flammability, thermal, and other properties of the materials, that are intended to provide guidance to the material manufacturer, the fabricator, the end product manufacturer, safety engineers and other interested parties.

UL Standard for Safety Polymeric Materials ?Industrial Laminates, Filament Wound Tubing, Vulcanized Fibre, and Materials Used In Printed- Wiring Boards COMMENTS DUE: February 25, 2008

IEC 60749-37:2008 半导体装置.机械和气候试验方法.第37部分:用加速计的电路板级落锤试验方法

This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. The purpose of this standard is to prescribe a standardized test method and reporting procedure. This is not a component qualification test and is not meant to replace any system level drop test that may be needed to qualify a specific handheld electronic product. The standard is not meant to cover the drop test required to simulate shipping and handlingrelated shock of electronic components or PCB assemblies. These requirements are already addressed in test methods such as IEC 60749-10. The method is applicable to both area array and perimeter-leaded surface mounted packages. This test method uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The test method described in the future IEC 60749-401 uses strain gauge to measure the strain and strain rate of a board in the vicinity of a component. The detailed specification states which test method is to be used.

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

IEC 61249-4-1:2008 印制板和其他互连结构用材料.第4-1部分:(多层板产品用)非包预浸料的分规范集.指明易燃的环氧编织E型玻璃纤维预浸料

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilayer boards in line with IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After lamination according to the supplier’s instructions, the glass transition temperature is defined as being 120 °C minimum.

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

ANSI/IPC 7095B-2008 BGAs用设计和组装过程的实施

This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and Fine Pitch BGA (FBGA) technology. The effect of BGA and FBGA on current technology and component types are addressed, as is the move to lead-free assembly processes. The focus on the information contained herein is on critical inspection, repair, and reliability issues associated with BGAs. Throughout this document the word 'BGA' can mean all types and forms of ball/column grid array packages.

Design and Assembly Process Implementation for BGAs

BS EN 61188-5-4:2007 印制电路板和印制电路板组件.设计和使用.第5-4部分:焊接(焊接区/焊缝)考虑.两面带有J形引线的部件

This part of IEC 61188 provides the component and land pattern dimensions for small outline integrated circuits with “J“ leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Printed boards and printed board assemblies - Design and use - Attachments (land/joint) considerations - Components with J leads on two sides

BS EN 61188-5-5:2007 印制电路板和印制电路板组件.设计和使用.第5-5部分:焊接(焊接区/焊缝)考虑.四面带有翅形引线的部件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design and the land pattern dimensions. The land pattern dimensions are based on a mathematical model that establishes a platform for a solder joint attachment to the printed board. The existing models create a platform that is capable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.). Process requirements for solder reflow are different based on the solder alloy and should be analyzed in order that the process is above that temperature a sufficient time to form a reliable metallurgical bond.

Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on four sides

BS EN 61188-5-3:2007 印制电路板和印制电路板组件.设计和使用.第5-3部分:焊接(焊接区/焊缝)考虑.两面带有翅形引线的部件

This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on two sides

KS C IEC 61188-5-1:2007 印制电路板和印制电路板组件.设计和使用.第5.1部分:附属物(所有的/共同的)要求

이 규격은 전자 구성품의 표면 부착을 위해 사용되는 랜드 패턴 구조에 관한 정보를 제공한다

Printed boards and printed board assemblies－Design and use－Part 5－1：Attachment(land/joint) considerations－Generic requirements

KS C IEC 61191-4:2007 印刷电路板组件.第4部分:分规范.端点焊接组件的要求

이 규격은 단자가 납땜된 조립품에 대한 요구사항을 규정된다. 요구사항은 전적으로 단자/배선

Printed board assemblies-Part 4:Sectional specification-Requirements for terminal soldered assemblies