TM-650 2.4.52-2013

Fracture Toughness of Resin Systmes for Base Materials

TM-650 2.4.52-2013 发布历史

This test method establishes a procedure for characterizing the toughness of the resin system materials used in making laminates for the fabrication of printed wiring boards. The single-edge-notch bending (SENB) geometry is used to determine the critical-stress-intensity factor@ K1c@ and the energy per unit area of crack surface or critical strain energy release rate@ G1c@ at fracture initiation. This method assumes linear elastic behavior of the cracked specimen@ so there are corresponding restrictions on the linearity of the load-displacement diagram. Use of this test method for printed wiring board laminate materials or other composites may not yield comparative results.

TM-650 2.4.52-2013由IPC - Association Connecting Electronics Industries 发布于 2013-07-01，并于 2015-05-15 实施。

TM-650 2.4.52-2013的历代版本如下：

• 2013年07月01日 TM-650 2.4.52-2013

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标准号

TM-650 2.4.52-2013

发布日期

2013年07月01日

实施日期

2015年05月15日

废止日期

无

中国标准分类号

/

国际标准分类号

/

发布单位

IPC - Association Connecting Electronics Industries

引用标准

8

适用范围

This test method establishes a procedure for characterizing the toughness of the resin system materials used in making laminates for the fabrication of printed wiring boards. The single-edge-notch bending (SENB) geometry is used to determine the critical-stress-intensity factor@ K1c@ and the energy per unit area of crack surface or critical strain energy release rate@ G1c@ at fracture initiation. This method assumes linear elastic behavior of the cracked specimen@ so there are corresponding restrictions on the linearity of the load-displacement diagram. Use of this test method for printed wiring board laminate materials or other composites may not yield comparative results.