BS IEC 63011-1:2018

Integrated circuits. Three dimensional integrated circuits - Terminology

标准号

BS IEC 63011-1:2018

发布

2019年

发布单位

英国标准学会

当前最新

BS IEC 63011-1:2018

 

 

适用范围

What is BS IEC 63011-1 about?    BS IEC 63011-1 is the first part of the BS IEC 63011 series of standards that provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided. BS IEC 63011-1 provides terminology that will help in performing their work which will prevent them from any work hazards.   Who is BS IEC 63011-1 for?   BS IEC 63011-1 on integrated circuits is useful for:   Integrated circuits manufacturers

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