What is BS IEC 63011-1 about?
BS IEC 63011-1 is the first part of the BS IEC 63011 series of standards that provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided. BS IEC 63011-1 provides terminology that will help in performing their work which will prevent them from any work hazards.
Who is BS IEC 63011-1 for?
BS IEC 63011-1 on integrated circuits is useful for:
Integrated circuits manufacturers