This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip@ soldering iron@ solder wave@ or reflow soldering techniques. Object The heat and/or environment of soldering may affect the electrical characteristics of the connector and may cause damage to the materials making up the connector. It may also result in loosening of terminations@ softening or distortion of insulation materials@ opening of solder seals@ weakening of mechanical joints@ etc.