This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip@ soldering iron@ solder wave@ or reflow soldering techniques. Object The heat and/or environment of soldering may affect the electrical characteristics of the connector and may cause damage to the materials making up the connector. It may also result in loosening of terminations@ softening or distortion of insulation materials@ opening of solder seals@ weakening of mechanical joints@ etc.
EIA/ECA-364-56D-2008由ECIA - Electronic Components Industry Association 发布于 2008-02-28,并于 2011-12-15 实施。
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