J-STD-012-1996 发布历史

This document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations@ assembly processes@ technology choices@ application@ and reliability data. Chip scale packaging variations include: flip chip@ High Density Interconnect (HDI)@ Micro Ball Grid Array (??GA)@ Micro Surface Mount Technology (MSMT) and Slightly Larger than Integrated Circuit Carrier (SLICC). Purpose This document is intended to provide general information on implementing flip chip and chip scale technologies for creating single chip or multichip modules (MCM)@ IC cards@ memory cards and very dense surface mount assemblies. Categorization Flip chip is categorized as versions of a tin-lead (SnPb) solder bump process@ and alternative solutions that use other forms of chip bond site bumping. Chip scale technology is categorized as semiconductor chip structures that have been made robust to facilitate ease of chip handling@ testing and chip assembly. The chip scale technologies have common attributes of minimal size@ no more than 1.2X the area of the original die size@ and are direct surface mountable.

J-STD-012-1996由IPC - Association Connecting Electronics Industries 发布于 1996-01-01，并于 2013-11-06 实施。

J-STD-012-1996 发布之时，引用了标准

120 *， 2017-01-31 更新

* 在 J-STD-012-1996 发布之后有更新，请注意新发布标准的变化。

J-STD-012-1996的历代版本如下：

1996年01月01日 J-STD-012-1996

非常抱歉，我们暂时无法提供预览，您可以试试：免费下载 J-STD-012-1996 前三页，或者稍后再访问。

注意：点击下载后，生成下载文件时间比较长，请耐心等待......

标准号: J-STD-012-1996
发布日期: 1996年01月01日
实施日期: 2013年11月06日
废止日期: 无
中国标准分类号: /
国际标准分类号: /
发布单位: IPC - Association Connecting Electronics Industries
引用标准: 120

适用范围: This document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations@ assembly processes@ technology choices@ application@ and reliability data. Chip scale packaging variations include: flip chip@ High Density Interconnect (HDI)@ Micro Ball Grid Array (??GA)@ Micro Surface Mount Technology (MSMT) and Slightly Larger than Integrated Circuit Carrier (SLICC). Purpose This document is intended to provide general information on implementing flip chip and chip scale technologies for creating single chip or multichip modules (MCM)@ IC cards@ memory cards and very dense surface mount assemblies. Categorization Flip chip is categorized as versions of a tin-lead (SnPb) solder bump process@ and alternative solutions that use other forms of chip bond site bumping. Chip scale technology is categorized as semiconductor chip structures that have been made robust to facilitate ease of chip handling@ testing and chip assembly. The chip scale technologies have common attributes of minimal size@ no more than 1.2X the area of the original die size@ and are direct surface mountable.

J-STD-012-1996

Implementation of Flip Chip and Chip Scale Technology