This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages@ which@ because of absorbed moisture@ could be sensitive to damage during solder reflow. The term SMD as used in this document means plastic encapsulated surface mount packages and other packages made with moisture-permeable materials. The categories are intended to be used by SMD producers to inform users (board assembly operations) of the level of moisture sensitivity of their product devices@ and by board assembly operations to ensure that proper handling precautions are applied to moisture eflow sensitive devices. If no major changes have been made to a previously qualified SMD package@ this method may be used for reclassification according to 4.2.This standard cannot address all of the possible component@ board assembly and product design combinations. However@ the standard does provide a test method and criteria for commonly used technologies. Where uncommon or specialized components or technologies are necessary@ the development should include customer/manufacturer involvement and the criteria should include an agreed definition of product acceptance.SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020@ JESD22-A112 (rescinded)@ IPC-SM-786 (superseded) do not need to be reclassified to the current revision unless a change in classification level or a higher peak reflow temperature is desired.Note: If the procedures in this document are used on packaged devices that are not included in this specification??s scope@ the failure criteria for such packages must be agreed upon by the device supplier and their end user.