Hybrid microelectronics and the use of ceramic printed boards
represent viable approaches to electronic circuit packaging. As
the term "hybrid" implies, this approach encompasses multiple
technical disciplines which sometimes require compromises
among process flow, component selection, and final
package configuration. The purpose of this chapter is to
present an overview of the hybrid microcircuit design procedure,
to assist the design activity in the early identification of
such compromises, as mentioned above, and to permit the
selection of design and process alternatives that will emphasize
the inherent advantages of this packaging technology.