BS PD CLC/TR 62258-3-2007
半导体压模产品.第3部分:搬运、包装和储存的良好规范建议

Semiconductor die products — Part 3: Recommendations for good practice in handling, packing and storage

BS PD CLC/TR 62258-3-2007 发布历史

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, and – minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

BS PD CLC/TR 62258-3-2007由英国标准学会 GB-BSI 发布于 2005-12-07，并于 2005-12-07 实施。

BS PD CLC/TR 62258-3-2007 在中国标准分类中归属于: L40 半导体分立器件综合，在国际标准分类中归属于: 31.080.99 其他半导体分立器件。

BS PD CLC/TR 62258-3-2007 发布之时，引用了标准

• IEC 60050 修改件3.国际电工词汇（IEV）.第904部分:电气和电子产品及系统的环境标准化*， 2019-10-17 更新
• IEC 60286-3 自动处理组件的包装 - 第3部分:连续胶带上表面贴装组件的包装*， 2019-01-16 更新
• IEC 62258-1 半导体压模产品.第1部分:采购和使用*， 2009-04-01 更新
• ISO 14644-1 洁净室和相关控制环境.第1部分:颗粒物浓度的空气洁净度分级*， 2015-12-01 更新

* 在 BS PD CLC/TR 62258-3-2007 发布之后有更新，请注意新发布标准的变化。

BS PD CLC/TR 62258-3-2007的历代版本如下：

• 2005年12月07日 BS PD CLC/TR 62258-3-2007 半导体压模产品.第3部分:搬运、包装和储存的良好规范建议

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标准号

BS PD CLC/TR 62258-3-2007

发布日期

2005年12月07日

实施日期

2005年12月07日

废止日期

无

中国标准分类号

L40

国际标准分类号

31.080.99

发布单位

GB-BSI

引用标准

IEC 60050 IEC 60286-3 IEC 61340-5-1-1998 IEC 61340-5-2-1999 IEC 62258-1 ISO 14644-1

被代替标准

PD ES 59008-4-2-2001 PD IEC/TR 62258-3-2005

适用范围

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: – wafers, – singulated bare die, – die and wafers with attached connection structures, and – minimally or partially encapsulated die and wafers. This report contains suggested good practice for the handling, packing and storage of die products. Success in manufacture of electronic assemblies containing die products is enhanced by attention to handling, storage and environmental conditions. This report provides guidelines taken from industry experience and is especially useful to those integrating die products into assemblies for the first time. It is also intended as an aid to setting up and auditing facilities that handle or use bare die products, from wafer fabrication to final assembly.

BS PD CLC/TR 62258-3-2007系列标准