JIS C6485-2008
印制电路用基础材料.纸基、酚醛树脂

Base materials for printed circuits -- Paper base, phenolic resin

标准号

JIS C6485-2008

发布日期

2008年08月20日

实施日期

2008年08月20日

废止日期

无

中国标准分类号

L30

国际标准分类号

31.180

发布单位

JP-JISC

引用标准

JIS C6481 JIS C6515 IEC 60194 IEC 61189-2

被代替标准

JIS C6485-1997

适用范围

This Standard specifies the requirements for properties of paper based phenolic resin copper-clad laminates of both economic and high electrical grades, in thicknesses of 0.8 mm up to 3.2 mm. NOTE 1 This Standard gives the specification concerning the characteristics of the copper-clad laminates, the requirements of which present the values the products are expected to have. This Standard, therefore, is not intended to be used to conduct a conformity assessment by itself. NOTE 2 The International Standards corresponding to this Standard and the sym- bol of degree of correspondence are as follows. IEC 61249-2-1 : 2005 Materials for printed boards and other interconnect- ing structures Part 2-1: Reinforced base materials, clad and unclad-- Phenolic cellulose paper reinforced laminated sheets; economic grade, copper clad IEC 61249-2-2 : 2005 Materials for printed boards and other interconnect- ing structures Part 2-2: Reinforced base materials, clad and unclad-- Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad (Overall evaluation: MOD) The symbols which denote the degree of correspondence in the contents in the corresponding International Standard and JIS are IDT (identical), MOD (modified) and NEQ (not equivalent) according to ISO/IEC Guide 21.