EN 60191-6-21-2010 半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOP)的封装尺寸测量方法
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)