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Semiconductor heat

Semiconductor heat, Total:20 items.

In the international standard classification, Semiconductor heat involves: Electricity. Magnetism. Electrical and magnetic measurements, Semiconductor devices, Mechanical structures for electronic equipment, Rectifiers. Convertors. Stabilized power supply.

Electronic Components, Assemblies and Materials Association, Semiconductor heat

• ECA CB 5-1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
• ECA CB 5-1-1971 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices Addendum to CB5

CU-NC, Semiconductor heat

• NC 66-13-1984 Electronics. Thermal Dissipators for Semiconductors Quality Specifications

ECIA - Electronic Components Industry Association, Semiconductor heat

• EIA CB-5:1969 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices
• EIA CB-5-1:1971 Recommended Test Procedure for Semiconductor Thermal Dissipating Devices (Addendum to Bulletin No.5; (STABILIZED))

CZ-CSN, Semiconductor heat

• CSN 35 8850 Cast.1-1984 Semiconductor radiators. Main parameters of measuring methods
• CSN 35 1609-1983 Power semiconductor devices. Heat sinks. Testing methodo

British Standards Institution (BSI), Semiconductor heat

• PD IEC TR 63378-1:2021 Thermal standardization on semiconductor packages. Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
• BS EN 62416:2010 Semiconductor devices - Hot carrier test on MOS transistors

Defense Logistics Agency, Semiconductor heat

• DLA DESC-DWG-84002-1984 HEAT SINKS FOR SEMICONDUCTOR DEVICES

International Electrotechnical Commission (IEC), Semiconductor heat

• IEC TR 63378-1:2021 Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Semiconductor heat

• GB/T 7423.2-1987 Heat sink of semiconductor devices--Heat sink, Extruded shapes
• GB 7423.2-1987 Semiconductor device heat sink profile heat sink
• GB/T 7423.3-1987 Heat sink of semiconductor devices--Heat sink, staggered fingers shapes
• GB 7423.3-1987 Semiconductor device heat sink interdigitated heat sink
• GB/T 8446.1-1987 Heat sink for power semiconductor device
• GB/T 7423.1-1987 Heat sink of semiconductor devices--Generic specification
• GB 7423.1-1987 General technical requirements for heat sinks for semiconductor devices

Professional Standard - Machinery, Semiconductor heat

• JB/T 8757-1998 Hot pipe radiators intended to be used in power semiconductor devices

Professional Standard - Electron, Semiconductor heat

• SJ 20788-2000 Measurment method for thermal impedance of semiconductor diodes

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