ZH

RU

ES

semiconductor equipment

semiconductor equipment, Total:197 items.

In the international standard classification, semiconductor equipment involves: Aircraft and space vehicles in general, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment, Rectifiers. Convertors. Stabilized power supply, Vocabularies, Integrated circuits. Microelectronics, Optoelectronics. Laser equipment, Electrical engineering in general, Electronic components in general, Capacitors, Electrical accessories, Linear and angular measurements, Safety of machinery, Industrial automation systems, Telecommunication systems, Air quality, Protection against fire, Technical drawings, Mechanical structures for electronic equipment.


Defense Logistics Agency, semiconductor equipment

CZ-CSN, semiconductor equipment

  • CSN 35 8720 Cast.1-1987 Semiconductor devices. Dimensions
  • CSN 35 8756-1973 Semiconductor devices. Transistors Measurement of y-parameters
  • CSN IEC 749:1994 Semiconductor devices.Mechanical and climatic test methods
  • CSN 35 8742-1973 Semiconductor devices. Transistors. Measurement of cut-oíf currents
  • CSN 35 8754-1973 Semiconductor devices. Transistors. Measurement of short-circuit output admittance
  • CSN 35 8737-1975 Semiconductor devices. Diodes. Measurement of differential rosistanoe
  • CSN IEC 748-1:1993 Semiconductor devices. Integrated circuits. Part 1: General
  • CSN 35 8759-1977 Semiconductor devices. Transistors. Methods of measurement of switching times
  • CSN 35 8971 Cast.1-1984 Semiconductor devices. Substrates for masks and masks. Nomenclature and definitions
  • CSN 35 8731-1975 Semiconductor devices. Diodes Measurement of d. c. forward voltage
  • CSN 35 8763-1973 Semiconductor devices. Diodes. Measurement o? reverse breakdown voltage
  • CSN 35 8797 Cast.8 IEC 747-8 ZA1+A2:1996 Semiconductor devices. Discrete devices. Part 8: Field-effect transistore
  • CSN 35 8785-1975 Semiconductor devices. Varicaps. Measurement of thermal capacitance coefflcient.
  • CSN IEC 748-3:1994 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
  • CSN IEC 748-2:1994 Semiconductor devices.Integrated circuits.Part 2:Digital integrated circuits
  • CSN IEC 748-4:1994 Semiconductor devices.Integrated circuits.Part 4:Interface integrated circuits
  • CSN 35 8733-1975 Semiconductor devices. Diodes. Measurement of reverse voltago (working voltago)
  • CSN 35 8764-1976 Semicoaductor devices. Switching diodes. Measurement o? reverse recovery time.
  • CSN 35 8765-1976 Semiconductor devices. Switching diodes. Measurement of reverse recovery charge.
  • CSN 35 8761-1973 Semiconductor devices. Phototransistors photodíodes. Measurement of photoelectric current
  • CSN 35 8762-1973 Semiconductor devices. Phototransistors photodiodes. Measurement of dark current
  • CSN 35 8752-1976 Semiconductor devices. Transistors. Measuring methods for common base output capacitance.
  • CSN 35 8797 Cast.1 IEC 747-1 Z2:1996 Semiconductor devices. Discrete devices and integrated circuits. Pari 1: General.
  • CSN 35 8749-1973 Semiconductor devices. Transistors. Measurement of absolute value of short-circuit forward transfer admittance
  • CSN IEC 747-10:1994 Semiconductor devices. Part 10: Generic specification for discrete devices and integrated circuits
  • CSN 35 8797 Cast.2 IEC 747-2:1990 Semiconductor devices. Discrete devices and integrated circuits. Part 2: Rectifíer diodes
  • CSN IEC 747-3-2:1991 Semiconductor devices. Discrete devices. Part 3: Signal (including switching)and regulator diodes. Section two. Blank detail specification for voltage-regulator diodes and voltage-reference diodes, excluding temperature-compensated precision referenc
  • CSN 35 8797 Cast.3 IEC 747-3 ZA1+A2:1996 Semiconductor devices. Discrete devices. Part 3: Signál (including switching) and regu lator diodes
  • CSN 35 8746-1973 Semiconductor devices. Transistore. Measurement of absolute value of forward current transfer ratio and frequencies fT, fh21b, fh21e
  • CSN 35 8745-1973 Semiconductor devices. Transistore. Measurement of open-circuit reverse voltage transfer ratio and tinie coefíicient at high frequencies
  • CSN IEC 748-20:1993 Semiductors devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

BE-NBN, semiconductor equipment

SE-SIS, semiconductor equipment

British Standards Institution (BSI), semiconductor equipment

  • BS IEC 60747-14-3:2009 Semiconductor devices - Semiconductor sensors - Pressure sensors
  • BS EN 60747-15:2012 Semiconductor devices. Discrete devices. Isolated power semiconductor devices
  • BS EN IEC 62435-3:2020 Electronic components. Long-term storage of electronic semiconductor devices - Data
  • BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices - General
  • BS EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices. - Part 5: Die and wafer devices
  • 18/30367158 DC BS EN 62435-3. Electronic components. Long-term storage of electronic semiconductor devices. Part 3. Data
  • 20/30424473 DC BS EN 62435-9. Electronic components. Long-term storage of electronic semiconductor devices. Part 9. Special Cases
  • BS EN 60204-33:2011 Safety of machinery. Electrical equipment of machines. Requirements for semiconductor fabrication equipment
  • BS EN 60749-44:2016 Semiconductor devices. Mechanical and climatic test methods. Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
  • BS EN 62047-13:2012 Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
  • BS EN 60191-6-18:2010 Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

YU-JUS, semiconductor equipment

  • JUS N.A3.500-1980 Semiconductor devices. Graphical symbols
  • JUS N.E5.240-1991 Low-voltage fuses. Supplementary requirements for fuse-links for the protection of semiconductor devices

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, semiconductor equipment

  • GB/T 15872-1995 Power supply interface for semiconductor equipment
  • GB/T 15872-2013 Power supply interface for semiconductor equipment
  • GB/T 24468-2009 Specification for definition and measurement of semiconductor equipment reliability,availability and maintainability(RAM)
  • GB/T 13539.4-2016 Low-voltage fuses.Part 4:Supplementary requirements for fuse-links for the protection of semiconductor devices
  • GB/T 13539.4-2005 Low-voltage fuses Part 4:Supplementary requirements for fuse-links for the protection of semiconductor devices
  • GB/T 13539.4-2009 Low-voltage fuses.Part 4:Supplementary requirements for fuse-links for the protection of semiconductor devices
  • GB 10292-1988 Semiconductor rectifier equipments for telecommunicat-ions

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, semiconductor equipment

  • JEDEC JESD30E-2008 Descriptive Designation System for Semiconductor-device Packages
  • JEDEC JEP104C.01-2003 Reference Guide to Letter Symbols for Semiconductor Devices
  • JEDEC JESD31D-2010 General Requirements for Distributors of Commercial and Military Semiconductor Devices
  • JEDEC JESD31D.01-2012 General Requirements for Distributors of Commercial and Military Semiconductor Devices
  • JEDEC JESD57-1996 Test Procedures for the Measurement of Single-Event Effects in Semiconductor Devices from Heavy Ion Irradiation
  • JEDEC JESD89A-2006 Measurement and Reporting of Alpha Particle and Terrestrial Cosmic Ray-Induced Soft Errors in Semiconductor Devices
  • JEDEC JESD419A-1980 Standard List of Values to be Used in Semiconductor Device Specifications and Registration Formats Revision of EIA RS-419-A formerly RS-419) [Replaced: JEDEC EIA-419-A]

IN-BIS, semiconductor equipment

工业和信息化部, semiconductor equipment

  • SJ/T 11762-2020 Semiconductor equipment manufacturing information labeling requirements
  • SJ/T 11761-2020 Specification for loading ports of semiconductor equipment for wafers 200mm and below

European Committee for Electrotechnical Standardization(CENELEC), semiconductor equipment

  • EN IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
  • EN 62047-20:2014 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
  • EN 62047-5:2012 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
  • EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
  • EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
  • EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
  • EN IEC 62969-3:2018 Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
  • EN 60749-34:2010 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
  • EN 62779-2:2016 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
  • EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
  • EN 60269-4:2009/A2:2016 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • EN 60269-4:2009 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
  • EN IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • EN IEC 60749-30:2020 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Association Francaise de Normalisation, semiconductor equipment

International Electrotechnical Commission (IEC), semiconductor equipment

  • IEC 63244-1:2021 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
  • IEC 60747-5-6:2016 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
  • IEC 60747-5-6:2021 Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes
  • IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
  • IEC 60747-5-7:2016 Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors
  • IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
  • IEC 60269-4:2012 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • IEC 60269-4:2006 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
  • IEC 60748-3:1986/AMD2:1994/COR1:1996 Corrigendum 1 to Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
  • IEC 60269-4/AMD2:2002 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices; Amendment 2
  • IEC 60749-37:2022 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • IEC 60747-17:2021 Corrigendum 1 - Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

Korean Agency for Technology and Standards (KATS), semiconductor equipment

BELST, semiconductor equipment

  • STB 2340-2013 Cooling radiators of semiconductor devices. General specifications
  • STB 2365-2014 Cooling radiators of semiconductor devices. Methods of calculation

RO-ASRO, semiconductor equipment

  • STAS 6693/2-1975 Semiconductor devices TRANSISTORS Methods for measuring electrical properties
  • STAS 12258/5-1986 OPTOELECTRONIG SEMICONDUCTOR DEVICES DISPLAYS Terminology and essential characteristres
  • STAS 7128/1-1985 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS General rules
  • STAS 7128/9-1980 SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Letter symbols for unijonction transistors
  • STAS 12258/4-1986 Optoelectronic semiconductor devices LIGHT EMITTING DIODES Terminology and main characteristics
  • STAS 7128/6-1986 LETTER SYMBOLS FOR SEMI- CONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for thyristors
  • STAS 7128/4-1971 SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Letter symbols for lunnel diodes
  • STAS 12124/1-1982 Semiconductor devices BIPOLAR TRANZISTORS Methods for measuring electrical static parameters
  • STAS 12123/4-1984 Semiconductor devices VARIABLE-CAPACITANCE DIODES Measuring methodes for electrical characteristics
  • STAS 7128/5-1985 LETTER SYMBOLS FOR SEMICON- DUCTOR DEVICES AND INTEGRA- TED NICROCIRCUITS Symbols for rectifier diodes
  • STAS 7128/2-1986 LETTER SYMBOLS FOR SEMI- ONDUCTOR DEVICES AND INTE- RATED MICROCIRCUITS ymbols for bipolar transistors
  • STAS 12124/3-1983 Semiconductor devices FIFL D-EFFECT TRANZISTORS Methods for measuring electrical static parameters
  • STAS 12124/4-1983 Semiconductor devices FIELD-EFECT TRANZISTORS Methods for measuring electrical static parameters
  • STAS 7128/8-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS Symbols for field effect transitors
  • STAS 7128/11-1985 T.ETTJ?R SYMBOLS FOR EMICONDUCTOR DEVICES ND INTHGRATED CIRCUITS Symbols fur digital integrated eircuits
  • STAS 7128/10-1984 LETTER SIMBOLS FOR SEMICON- DUCTOR DEVICES ANI) INTF.GHA- TED CIRCU1TS Sinibols for analoguc inlcgnated circuits
  • STAS 7128/7-1986 LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED C1RCUITS Symbols for variable capacitance diodes and mixer diodes
  • STAS 7128/12-1985 LETTER SYMBOLS FOR EMICONDUCTOR DEVICES ND INTEGRATED CIRCU1TS ymbols lor voltage reference and voltage egulator diodes
  • STAS 7128/3-1985 LETTER SYMBOI.S FOR SEM1- ONDUCR DEVICES AND INTE- RATED M SOROC IRCUTS Symbols for low-powr signal dides
  • STAS 12123/3-1983 Semiconductor devices VOLTAGE REFERENCE DIODES AND VOLTAGE REGULATOR DIODES Measuring methodes for electrical characteristics
  • STAS 12123/2-1983 Semiconductor devices LOW POWER SIGNAL DIODES, INCLUDING SWITCHING DIODES Measuring methods for electrical characteristics
  • SR CEI 748-11-1-1992 Semiconductor devices Integrated circuits Part 11: Section 1: Internai visual examination for semiconductor integrated circuits excluding hybrid circuits

Standard Association of Australia (SAA), semiconductor equipment

  • AS 1852.521:1988 International electrotechnical vocabulary - Semiconductor devices and integrated circuits

Group Standards of the People's Republic of China, semiconductor equipment

  • T/QGCML 744-2023 Chemical cleaning process specification for semiconductor equipment parts
  • T/QGCML 743-2023 Specifications for anodizing process of semiconductor equipment parts

PL-PKN, semiconductor equipment

AT-OVE/ON, semiconductor equipment

  • OVE EN IEC 63244-1:2020 Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications (IEC 47/2653/CDV) (english version)
  • OVE EN IEC 60747-5-5:2021 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers ((IEC 60747-5-5:2020) EN IEC 60747-5-5:2020) (german version)
  • OVE EN IEC 60749-10:2021 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (IEC 47/2692/CDV) (english version)

RU-GOST R, semiconductor equipment

  • GOST R IEC 748-11-1-2001 Semiconductor devices integrated circuits. Part 11. Section 1. Internal visual examination for semiconductor integrated circuits excluding hybrid circuits
  • GOST 31196.4-2012 Lov-voltage fuse-links. Part 4. Supplementary requirements for fuse-links for the protection of semiconductor devices

Danish Standards Foundation, semiconductor equipment

  • DS/EN 62047-5:2011 Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
  • DS/EN 62047-19:2013 Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses
  • DS/EN 62047-4:2010 Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
  • DS/EN 60749-34:2011 Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
  • DS/EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
  • DS/EN 60269-4:2010 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • DS/EN 60269-4/A1:2012 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • DS/EN 60749-14:2004 Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
  • DS/EN 62047-7:2011 Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
  • DS/EN 60749-37:2008 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
  • DS/EN 60749-30/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
  • DS/EN 60749-30:2005 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

AENOR, semiconductor equipment

  • UNE 20700-11:1991 SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
  • UNE-EN 60269-4:2011/A2:2017 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • UNE-EN 60269-4:2011/A1:2013 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices
  • UNE-EN 60749-30:2005/A1:2011 Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

AIA/NAS - Aerospace Industries Association of America Inc., semiconductor equipment

  • NAS4118-1996 Heat Sink@ Electrical- Electronic Component@ Semiconductor Devices@ Retainer Clip Type

PT-IPQ, semiconductor equipment

  • NP 2626-521-2001 International Electrotechnical Vocabulary Chapter 521: Semiconductor devices and integrated circuits

Aerospace Industries Association, semiconductor equipment

  • AIA NAS 4118-1996 Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Retainer Clip Type
  • AIA NAS 4123-1995 Heat Sink, Electrical-Electronic Component, Semiconductor Devices, for Dual Inline Packages (DIP)

Institute of Electrical and Electronics Engineers (IEEE), semiconductor equipment

  • IEEE Std 1687-2014 IEEE Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
  • IEEE 1687-2014 Access and Control of Instrumentation Embedded within a Semiconductor Device (IEEE Computer Society)
  • IEEE P1687/D1.62, September 2013 IEEE Draft Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device
  • IEEE P1687/D1.71, March 2014 IEEE Approved Draft Standard for Access and Control of Instrumentation Embedded within a Semiconductor Device

American National Standards Institute (ANSI), semiconductor equipment

  • ANSI/EIA 401:1973 Paper, Paper/Film Dielectric Capacitors for Power Semiconductor Applications
  • ANSI/NFPA 318-2011 Standard for the Protection of Semiconductor Fabrication Facilities

SAE - SAE International, semiconductor equipment

  • SAE EIA-4900-2016 Use of Semiconductor Devices Outside Manufacturers' Specified Temperature Ranges

Lithuanian Standards Office , semiconductor equipment

  • LST EN 62417-2010 Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (IEC 62417:2010)
  • LST EN 62047-5-2011 Semiconductor devices - Micro-electromechanical devices -- Part 5: RF MEMS switches (IEC 62047-5:2011)
  • LST EN 62047-1-2006 Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2005)
  • LST EN IEC 60747-5-5:2020 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2020)
  • LST EN 60747-16-3-2003/A1-2009 Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 60747-16-3:2002/A1:2009)
  • LST EN IEC 60749-15:2020 Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
  • LST EN IEC 60747-17/AC:2021 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020/COR1:2021)
  • LST EN 60749-5-2004 Semiconductor devices - Mechanical and climatic test methods. Part 5: Steady-state temperature humidity bias life test (IEC 60749-5:2003)
  • LST EN IEC 60747-17:2021 Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (IEC 60747-17:2020)

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, semiconductor equipment

  • GB/T 5226.33-2017 Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment

IEC - International Electrotechnical Commission, semiconductor equipment

  • PAS 62240-2001 Use of Semiconductor Devices Outside Manufacturer's Specified Temperature Ranges (Edition 1.0)

ES-UNE, semiconductor equipment

  • UNE-EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (Endorsed by Asociación Española de Normalización in June of 2017.)
  • UNE-EN IEC 62435-3:2020 Electronic components - Long-term storage of electronic semiconductor devices - Part 3: Data (Endorsed by Asociación Española de Normalización in June of 2020.)
  • UNE-EN IEC 62435-9:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special Cases (Endorsed by Asociación Española de Normalización in November of 2021.)

TH-TISI, semiconductor equipment

  • TIS 2114-2002 Low.voltage fuses.part 4: supplementary requirements for fuse.links for the protection of semiconductor devices

German Institute for Standardization, semiconductor equipment

  • DIN EN 60269-4:2008 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices (IEC 60269-4:2006); German version EN 60269-4:2007
  • DIN EN 62047-20:2015 Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (IEC 62047-20:2014); German version EN 62047-20:2014
  • DIN EN IEC 60747-5-5:2021 Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (IEC 60747-5-5:2020); German version EN IEC 60747-5-5:2020
  • DIN EN 60749-21:2012 Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011
  • DIN EN 60749-29:2012 Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (IEC 60749-29:2011); German version EN 60749-29:2011

CENELEC - European Committee for Electrotechnical Standardization, semiconductor equipment

  • EN 60269-4:2007 Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices

Professional Standard - Post and Telecommunication, semiconductor equipment

  • YD 576-1992 Semiconductor rectifier equipments For telecommunications

NEMA - National Electrical Manufacturers Association, semiconductor equipment

  • NEMA RI 6-1959 ELECTROCHEMICAL PROCESSING SEMICONDUCTOR RECTIFIER EQUIPMENT




Copyright ©2007-2023 ANTPEDIA, All Rights Reserved