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Chip instrument
Chip instrument, Total:374 items.
In the international standard classification, Chip instrument involves: Medical equipment, Resistors, Road vehicle systems, Data storage devices, Analytical chemistry, Photography, Measurement of force, weight and pressure, Technical drawings, Semiconductor devices, Applications of information technology, Transformers. Reactors, Components for electrical equipment, Document imaging applications, Valves, Capacitors, Audio, video and audiovisual engineering, Electronic component assemblies, Radiation measurements, Nuclear energy engineering, Radiocommunications, Fibre optic communications, Characteristics and design of machines, apparatus, equipment, Dentistry, Electric filters, Optics and optical measurements, Integrated circuits. Microelectronics, Electronic components in general, Materials for aerospace construction, Rubber and plastics products, Cinematography, Character sets and information coding, Electromechanical components for electronic and telecommunications equipment, Magnetic materials, Electrical engineering in general, Electrical wires and cables.
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Chip instrument
- JEDEC JESD82-22-2006 Instrumentation Chip Data Sheet for FBDIMM Diagnostic Senselines
- JEDEC JESD82-29-2009 Definition of the SSTE32882 Registering Clock Driver with Parity and Quad Chip Selects for DDR3 RDIMM Applications
Group Standards of the People's Republic of China, Chip instrument
Defense Logistics Agency, Chip instrument
- DLA DSCC-DWG-02006 REV B-2007 CAPACITORS, FIXED, TANTALUM, CHIP
- DLA DSCC-DWG-04053 REV A-2006 CAPACITOR, FIXED, FUSED TANTALUM CHIP
- DLA DSCC-DWG-95158 REV F-2008 CAPACITOR, FIXED, TANTALUM CHIP, LOW ESR
- DLA DSCC-DWG-05006 REV B-2009 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
- DLA DSCC-DWG-03028 REV B-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
- DLA DSCC-DWG-03028 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
- DLA DSCC-DWG-05006 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
- DLA DSCC-DWG-03028 REV D-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
- DLA DSCC-DWG-03029 REV D-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0402
- DLA DSCC-DWG-05006 REV D-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
- DLA DSCC-DWG-05007 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
- DLA DSCC-DWG-03028 REV E-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
- DLA DSCC-DWG-03029 REV E-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 0402
- DLA DSCC-DWG-05006 REV E-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
- DLA DSCC-DWG-05007 REV D-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
- DLA DSCC-DWG-05006 REV F-2012 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
- DLA DSCC-DWG-05007 REV E-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
- DLA DSCC-DWG-05007 REV F-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
- DLA DSCC-DWG-04051-2006 CAPACITOR, FIXED, POLYMER TANTALUM CHIP
- DLA DESC-DWG-89089 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE
- DLA DSCC-DWG-01033 REV B-2010 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
- DLA DSCC-DWG-02002 REV B-2007 CAPACITORS, FIXED, TANTALUM, CHIP
- DLA DSCC-DWG-11017-2011 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402
- DLA DSCC-DWG-11018-2011 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
- DLA DSCC-DWG-11019-2011 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805
- DLA DSCC-DWG-09009-2009 CAPACITOR, FIXED, TANTALUM CHIP MODULE, LOW ESR
- DLA SMD-5962-81008 REV B-2008 MICROCIRCUIT, LINEAR, MONOLITHIC AND MULTICHIP, 12-BIT DIGITAL-TO-ANALOG CONVERTERS
- DLA DSCC-VID-V62/05615 REV A-2012 MICROCIRCUIT, LINEAR, INTERCONNECT EXTENDER CHIPSET WITH LVDS, MONOLITHIC SILICON
- DLA DSCC-DWG-05001 REV B-2009 CAPACITORS, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
- DLA DSCC-DWG-05002 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
- DLA DSCC-DWG-05001 REV D-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
- DLA DSCC-DWG-05002 REV D-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
- DLA DSCC-DWG-05003 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP
- DLA AN6238 REV 4 VALID NOTICE 1-2009 Gasket, Hydraulic Replaceable Reservoir Type Filter Element
- DLA AN6238 REV 4 VALID NOTICE 2-2013 Gasket, Hydraulic Replaceable Reservoir Type Filter Element
- DLA MIL-M-38510/111 A VALID NOTICE 2-2008 Microcircuits, Analog Switch with Driver, Monolithic and Multi- Chip Silicon
- DLA MIL-M-38510/111 A VALID NOTICE 1-2008 Microcircuits, Analog Switch with Driver, Monolithic and Multi- Chip Silicon
- DLA DSCC-DWG-03011-2003 RESISTOR, FIXED, FILM, CHIP, ZERO-OHM, STYLE 0201
- DLA DSCC-DWG-04052-2006 CAPACITOR, FIXED, MULTIPLE ANODE POLYMER TANTALUM CHIP
- DLA A-A-59742 VALID NOTICE 1-2011 Inductor, Chip, Power, Low Resistance, Surface Mount
- DLA QPL-32192-1 NOTICE 1-2008 Resistors, Chip, Thermal (Thermistor), General Specification for
- DLA DSCC-DWG-94047 REV F-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 2 WATT, STYLE 3610
- DLA DSCC-DWG-95006 REV E-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 1 WATT, STYLE 2512
- DLA QPL-32192-QPD-2010 Resistors, Chip, Thermal (Thermistor), General Specification for
- DLA QPL-32192-2011 Resistors, Chip, Thermal (Thermistor), General Specification for
- DLA DESC-DWG-94047 REV G-2013 RESISTOR, FIXED, FILM, CHIP (MELF), 2 WATT, STYLE 3610
- DLA DESC-DWG-95006 REV F-2013 RESISTOR, FIXED, FILM, CHIP (MELF), 1 WATT, STYLE 2512
- DLA DESC-DWG-95006 REV G-2013 RESISTOR, FIXED, FILM, CHIP (MELF), 1 WATT, STYLE 2512
- DLA QPL-32192-2013 Resistors, Chip, Thermal (Thermistor), General Specification for
- DLA A-A-55562 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip
- DLA DSCC-DWG-03017 REV A-2007 RESISTOR, THERMAL, THERMISTOR, DIE CHIP, POSITIVE TEMPERATURE COEFFICIENT (PTC) style 0303
- DLA DSCC-DWG-03018 REV A-2007 RESISTOR, THERMAL, THERMISTOR, DIE CHIP, NEGATIVE TEMPERATURE COEFFICIENT (NTC), STYLE 0404
- DLA DSCC-DWG-09023-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201
- DLA DSCC-DWG-09024-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
- DLA DSCC-DWG-09025-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603
- DLA DSCC-DWG-09026-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805
- DLA DSCC-DWG-09027-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
- DLA DSCC-DWG-05009 REV A-2009 RESISTOR, FIXED, FILM, CHIP (MELF), 1/4 WATT, STYLE 0204
- DLA DSCC-DWG-94048 REV F-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 1/2 WATT, STYLE 2010
- DLA DSCC-DWG-95011 REV E-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 1/8 WATT, STYLE 1206
- DLA SMD-5962-92061 REV G-2008 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
- DLA A-A-55562/2 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 0805
- DLA A-A-55562/3 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 1206
- DLA A-A-55562/4 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 1210
- DLA A-A-55562/5 VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 0402
- DLA DSCC-DWG-01033 REV A-2002 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
- DLA DSCC-DWG-93079 REV D-2010 RESISTOR, FIXED, BULK METAL FOIL, CHIP, ULTRA PRECISION, STYLE 1505
- DLA DSCC-DWG-02001 REV A-2011 RESISTOR, FIXED, FILM, PRECISION, CHIP 1/8 WATT, STYLE 2012
- DLA SMD-5962-92061 REV F-2003 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
- DLA A-A-59416 A-2008 INDUCTOR, CHIP, FIXED, HIGH SELF RESONANT FREQUENCY, SURFACE MOUNT
- DLA DSCC-DWG-13008-2013 CAPACITORS, FIXED, MULTIPLE ANODE TANTALUM, CHIP, CONFORMAL COATED CASE
- DLA MIL-PRF-32192/1 (2)-2012 RESISTOR, CHIP, THERMAL (THERMISTOR), POSITIVE TEMPERATURE COEFFICIENT, STYLE RCTP0303
- DLA DSCC-DWG-12011-2012 RESISTOR, CHIP, FIXED, FILM, VALUES LESS THAN 1 OHM, STYLE 1010
- DLA SMD-5962-87780-1989 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-88630 REV E-2006 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-87780 REV A-2011 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-90564 REV E-2013 MICROCIRCUIT, DIGITAL, CHMOS, SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 16K BYTES OF EPROM PROGRAM MEMORY, MONOLITHIC SILICON
- DLA DSCC-DWG-02001-2002 RESISTOR, FIXED, FILM, PRECISION, CHIP 1/8 WATT, STYLE 2012
- DLA DSCC-DWG-03010 REV C-2009 RESISTOR, FIXED, FILM, CHIP, SURFACE MOUNTED, ULTRA PRECISION, STYLE 1506
- DLA DSCC-DWG-04032 REV B-2011 RESISTOR, CHIP, FIXED, FILM, LOW VALUES, HIGH POWER, 1.5 WATTS, STYLE 2512
- DLA DSCC-DWG-12009-2012 RESISTOR, CHIP, FIXED, FILM, VALUES LESS THAN 1 OHM, STYLE 2010
- DLA SMD-5962-90976-1992 MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
- DLA DSCC-DWG-07010-2009 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0201
- DLA DSCC-DWG-07010 REV A-2010 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0201
- DLA DESC-DWG-94016 REV H-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY AND SPACE LEVEL, STYLE 1206
- DLA DESC-DWG-94016 REV J-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1206
- DLA DSCC-DWG-04008 REV C-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0402
- DLA DESC-DWG-94012 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY AND SPACE LEVEL, STYLE 0505
- DLA DESC-DWG-94013 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1005
- DLA DSCC-DWG-94014 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 2208
- DLA DESC-DWG-94019 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1010
- DLA DESC-DWG-94025 REV H-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY AND SPACE LEVEL, STYLE 0502
- DLA MIL-PRF-32192/2 (2)-2012 RESISTOR, CHIP, THERMAL (THERMISTOR), INSULATED POSITIVE TEMPERATURE COEFFICIENT STYLE RCTP0805
- DLA DESC-DWG-94013 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1005
- DLA DESC-DWG-94015 REV K-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0705
- DLA DESC-DWG-94017 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 2010
- DLA DESC-DWG-94019 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1010
- DLA DESC-DWG-94026 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1505
- DLA DSCC-DWG-04007 REV D-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0302
- DLA DSCC-DWG-04009 REV D-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0603
- DLA DSCC-DWG-04025 REV A-2010 RESISTOR, CHIP, FIXED, FILM, SURFACE MOUNT, 5 WATTS (UP TO 25 WATTS WITH HEATSINK)
- DLA DSCC-DWG-05015 REV A-2012 RESISTOR, CHIP, FIXED, FILM, SURFACE MOUNT, 2.25 WATTS (UP TO 20 WATTS WITH HEATSINK)
- DLA DSCC-DWG-04025 REV B-2012 RESISTOR, CHIP, FIXED, FILM, SURFACE MOUNT, 5 WATTS (UP TO 25 WATTS WITH HEATSINK)
- DLA SMD-5962-08214 REV A-2009 MICROCIRCUIT, LINEAR, DUAL LOW OFFSET, MATCHED, OPERATIONAL AMPLIFIER, MULTI-CHIP SILICON
- DLA DSCC-DWG-01002 REV F-2010 RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE, STYLE 2512
- DLA DSCC-DWG-01002 REV G-2013 RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE, STYLE 2512
- DLA SMD-5962-95529 REV A-2004 MICROCIRCUIT, LINEAR, INSTRUMENTATION, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
- DLA DSCC-VID-V62/13625-2013 MICROCIRCUIT, LINEAR, LOW POWER INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA DSCC-DWG-01002 REV E-2002 RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE STYLE 2512
- DLA SMD-5962-01511 REV F-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K x 32-BIT, RADIATION-HARDENED SRAM, MULTICHIP MODULE
- DLA SMD-5962-95592 REV B-2013 MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON
- DLA SMD-5962-99503 REV A-2009 MICROCIRCUIT, LINEAR, MICROPOWER, INSTRUMENTATION OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-87719 REV E-2010 MICROCIRCUIT, LINEAR, PROGRAMMABLE GAIN INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-88539 REV F-2011 MICROCIRCUIT, LINEAR, RADIATION HARDENED, PRECISION INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-01533 REV B-2003 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K X 32-BIT, 3.3V, RADIATION-HARDENED SRAM, MULTICHIP MODULE
- DLA SMD-5962-10232-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATIONHARDENED, SRAM, MULTI-CHIP MODULE
- DLA SMD-5962-10232 REV A-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATIONHARDENED, SRAM, MULTI-CHIP MODULE
- DLA DSCC-DWG-04053 REV C-2009 CAPACITOR, FIXED, FUSED TANTALUM CHIP NON-WEIBULL GRADED AND WEIBULL GRADED
- DLA DSCC-DWG-04053 REV D-2010 CAPACITOR, FIXED, FUSED TANTALUM CHIP NON-WEIBULL GRADED AND WEIBULL GRADED
- DLA SMD-5962-88539 REV E-2005 MICROCIRCUIT, LINEAR, RADIATION HARDENED, PRECISION INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-02517 REV B-2011 MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 128M X 8 bit STACKED DIE(1Gbit) SYNCHRONOUS DRAM (SDRAM), MODULE
- DLA SMD-5962-01532 REV C-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1024K x 8-BIT (8 M), RADIATION-HARDENED SRAM, MULTICHIP MODULE
- DLA SMD-5962-01533 REV C-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K x 32-BIT, 3.3 V, RADIATION-HARDENED SRAM, MULTICHIP MODULE
- DLA SMD-5962-02518 REV A-2009 MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE
- DLA SMD-5962-06229 REV D-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16 MBIT (512K X 32), RADIATION-HARDENED, LOW VOLTAGE SRAM, MULTICHIP MODULE
- DLA QPL-32159-QPD-2010 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
- DLA QPL-32159-2011 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
- DLA QPL-32159-2012 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
- DLA SMD-5962-10205 REV A-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1MEG X 39-BIT (40M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
- DLA SMD-5962-10205 REV B-2011 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1MEG X 39-BIT (40M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
- DLA SMD-5962-10206-2012 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2MEG X 39-BIT (80M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
- DLA SMD-5962-10207-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 4MEG X 39-BIT (160M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
- DLA SMD-5962-10205-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1MEG X 39-BIT (40M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
- DLA SMD-5962-87685-1987 MICROCIRCUITS, 8-BIT MICROPROCESSOR CPU, NMOS, MONOLITHIC SILICON
- DLA SMD-5962-04227 REV C-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K x 32-BIT (16 M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
- DLA SMD-5962-01532 REV B-2003 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1024K X 8-BIT, (8 M) RADIATION-HARDENED, LOW VOLTAGE SRAM, MULTICHIP MODULE
- DLA QPL-49464-QPD-2012 Capacitors, Chip, Single Layer, Fixed, Parallel Plate, Ceramic Dielectric, Established Reliability, General Specification for
- DLA MIL-PRF-19500/657 B-2011 SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE, N AND P-CHANNEL, SILICON VARIOUS TYPES JANHC AND JANKC
- DLA DSCC-DWG-95013 REV C-2009 RESISTOR, CHIP, FIXED, FILM, STYLE 0302 [Use: ARMY MIL-PRF-55342/13 (2), ARMY MIL-PRF-55342/13 (1), ARMY MIL-PRF-55342/13]
- DLA SMD-5962-91566 REV C-1996 MICROCIRCUIT, DIGITAL, CMOS SINGLE CHIP 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
- DLA MIL-DTL-3933/29 A-2011 ATTENUATORS, FIXED, SPACE LEVEL, NON SPACE LEVEL, CHIP, (SURFACE MOUNT), 0-20 DB, FREQUENCY RANGE: DC TO 18 GHZ. CLASS IV
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Chip instrument
European Committee for Standardization (CEN), Chip instrument
- EN ISO 10938:2016 Ophthalmic optics - Chart displays for visual acuity measurement - Printed@ projected and electronic
- FprEN ISO 9342-1 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Reference lenses for focimeters used for measuring spectacle lenses (ISO/FDIS 9342-1:2023)
- EN ISO 9342-1:2023 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Reference lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2023)
International Organization for Standardization (ISO), Chip instrument
- ISO 10938:2016 Ophthalmic optics - Chart displays for visual acuity measurement - Printed, projected and electronic
- ISO 10938:1998 Ophthalmic instruments - Chart projectors
- ISO 7943-3:1987 Photography; Overhead projectors; Part 3 : Film rolls, cores and winders; Dimensions
- ISO/FDIS 9342-1 Optics and optical instruments — Test lenses for calibration of focimeters — Part 1: Reference lenses for focimeters used for measuring spectacle lenses
- ISO 9342-1:2023 Optics and optical instruments — Test lenses for calibration of focimeters — Part 1: Reference lenses for focimeters used for measuring spectacle lenses
Professional Standard - Machinery, Chip instrument
国家市场监督管理总局、中国国家标准化管理委员会, Chip instrument
- GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
- GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
German Institute for Standardization, Chip instrument
- DIN 58545:1996 Pencil points or divider points for standard drawing instruments (S)
- DIN EN ISO 9801:2010-04 Ophthalmic instruments - Trial case lenses (ISO 9801:2009); German version EN ISO 9801:2009
- DIN 96156:2011 Medical instruments - Retractor type Kocher, blade curved
- DIN 96156:2017 Medical instruments - Retractor type Kocher, blade curved
- DIN 4000-70:1992 Tabular layouts of article characteristics for core laminations, cores and coil formers for small transformers and chokes
- DIN EN 61021-2:1997-10 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations (IEC 61021-2:1995); German version EN 61021-2:1997
- DIN EN ISO 11380:1996 Optics and optical instruments - Ophthalmic optics - Formers (ISO 11380:1994); German version EN ISO 11380:1996
- DIN EN 61021-2:1997 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations (IEC 61021-2:1995); German version EN 61021-2:1997
- DIN 41307-3:1981 Accessory parts for small transformers and chokes; attachment straps for cores typ E, U and 3 U
- DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
- DIN EN IEC 63215-2:2021-01 Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:...
- DIN EN ISO 9342-1:2005-08 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2005); German version EN ISO 9342-1:2005 / Note: To be replaced by DIN EN ISO 9342-1 (2022-07).
- DIN EN IEC 62148-19:2020-07 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package (IEC 62148-19:2019); German version EN IEC 62148-19:2019
- DIN EN ISO 9342-1:2022-07 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Reference lenses for focimeters used for measuring spectacle lenses (ISO/DIS 9342-1:2022); German and English version prEN ISO 9342-1:2022 / Note: Date of issue 2022-0...
- DIN 13133-1:2005 Medical instruments - Uterine scissors, curved on flat, type Sims - Part 1: Without carbide inserts
- DIN EN IEC 63215-5:2022-06 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English / N...
- DIN EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 62024-1:2008); German version EN 62024-1:2008
- DIN 45635-60:1989-10 Measurement of airborne noise emitted by machines; enveloping surface method; still picture and motion-picture projectors
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Chip instrument
- GB 17342-1998 Ophthalmic instrument--Trial case lenses
- GB/T 17342-2009 Ophthalmic instrument - Trial case lenses
- GB 17342-2009 Ophthalmic instrument-Trial case lenses
- GB/T 26328-2010 Optical interference filters for biochemical analyzer
- GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
- GB/T 22186-2016 Information security techniques.Security technical requirements for IC card chip with CPU
Military Standards (MIL-STD), Chip instrument
Danish Standards Foundation, Chip instrument
- DS/EN ISO 9801:2010 Ophthalmic instruments - Trial case lenses
- DS/EN 61021-2:1998 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations
- DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
- DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
- DS/EN 61021-1:1998 Laminated core packages for transformers and inductors used in telecommunication and electronic equipment - Part 1: Dimensions
- DS/EN ISO 9342-1:2005 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses
- DS/CLC/TR 50489:2007 Smart tracker chips - Feasibility study on the inclusion of RFID in Electrical and Electronic Equipment for WEEE management
- DS/EN 61797-1:1997 Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores
未注明发布机构, Chip instrument
- BS EN ISO 9801:2009(2010) Ophthalmic instruments — Trial case lenses
- BS EN ISO 9342-1:2023 Optics and optical instruments — Test lenses for calibration of focimeters Part 1 : Reference lenses for focimeters used for measuring spectacle lenses
Professional Standard - Electron, Chip instrument
- SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
- SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources
- SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
- SJ/T 11402-2009 Technical specification of semiconductor laser chip used in optical fiber communication
- SJ/T 11856.1-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 1: Fabry-Perot Type and Distributed Feedback Type Semiconductor Laser Chips for Light Sources
Taiwan Provincial Standard of the People's Republic of China, Chip instrument
- CNS 13622-1997 Fixed chip resistor for use in electronic equipment
- CNS 13198-1993 Fixed Multilayer Ceramic Chip Capacitors for Use in Electronic Equipment
- CNS 13788-1996 Methods of Test for Water Vapor Transmission Rate of Plastic Films and Sheets (Instrument Method)
IT-UNI, Chip instrument
CZ-CSN, Chip instrument
Association Francaise de Normalisation, Chip instrument
- NF EN ISO 9801:2010 Instruments ophtalmiques - Verres de boîte d'essai
- NF Z43-205:1984 MICROGRAPHICS. READER-PRINTERS AND ENLARGERS/MICROFORM PRINTGERS.
- NF EN 61021-2:1998 Noyaux en tôles découpées pour transformateurs et inductances destinés aux équipements électroniques et de télécommunications - Partie 2 : caractéristiques électriques pour noyaux utilisant des tôles YEE 2.
- NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
- NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
- NF EN 61021-1:1998 Noyaux en tôles découpées pour transformateurs et inductances destinés aux équipements électroniques et de télécommunications - Partie 1 : dimensions.
- FD S11-485*FD ISO/TR 18476:2018 Ophthalmic optics and instruments - Free form technology - Spectacle lenses and measurement
- NF C93-133:1987 Components for electric equipment. Type 1 and type 2 fixed multilayer ceramic chip capacitors. General requirements.
- NF EN IEC 62148-19:2019 Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 19 : boîtier à puce photonique
- NF C93-883-19*NF EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19 : photonic chip scale package
- FD ISO/TR 18476:2018 Optique et instruments ophtalmiques - Technologie free form - Verres de lunettes correctrices et mesure
- NF EN ISO 9342-1:2005 Optique et instruments d'optique - Verres étalons pour l'étalonnage des frontofocomètres - Partie 1 : verres étalons pour frontofocomètres pour le mesurage des verres de lunettes
- NF C93-330*NF EN 61797-1:1997 Transformers and inductors for use in telecommunication and electronic equipment. Main dimensions of coil formers. Part 1 : coil formers for laminated cores.
- NF EN 61797-1:1997 Transformateurs et inductances destinés aux équipements électroniques et de télécommunication - Dimensions principales des carcasses - Partie 1 : carcasses pour noyaux feuilletés.
- NF EN IEC 62149-11:2020 Composants et dispositifs actifs fibroniques - Normes de performances - Partie 11 : boîtier-puce émetteur/récepteur à plusieurs canaux avec interface à fibre multimodale
- NF EN ISO 9342-2:2006 Optique et instruments d'optique - Verres étalons pour l'étalonnage des frontofocomètres - Partie 2 : verres étalons pour frontofocomètres utilisés pour le mesurage des lentilles de contact
SAE - SAE International, Chip instrument
Society of Automotive Engineers (SAE), Chip instrument
International Electrotechnical Commission (IEC), Chip instrument
- IEC 61021-2:1995 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations
- IEC 61468:2000/AMD1:2003 Nuclear power plants - In-core instrumentation - Characteristics and test methods of self-powered neutron detectors; Amendment 1
- IEC 60740-2:1993 Laminations for transformers and inductors for use in telecommunication and electronic equipment; part 2: specification for the minimum permeabilities of laminations made of soft magnetic metallic materials
- IEC 60740/AMD1:1991 Laminations for transformers and inductors for use in telecommunication and electronic equipment; amendment 1
- IEC 62317-5:2015 Ferrite cores - Dimensions - Part 5: EP-cores and associated parts for use in inductors and transformers
- IEC 61021-1:1990 Laminated core packages for transformers and inductors used in telecommunication and electronic equipment; part 1: dimensions
- IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
- IEC 61468:2021 Nuclear power plants - Instrumentation systems important to safety - In-core instrumentation: Characteristics and test methods of self-powered neutron detectors
- IEC 61468:2000 Nuclear power plants - In-core instrumentation - Characteristics and test methods of self-powered neutron detectors
- IEC 62149-11:2020 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface
- IEC 61343:1996 Nuclear reactor instrumentation - Boiling light water reactors (BWR) - Measurements in the reactor vessel for monitoring adequate cooling within the core
- IEC 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
- IEC 62024-1:2008/COR1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
corrigendum 1
- IEC 60852-4:1996 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment - Part 4: Transformers and inductors using YUI-2 laminations
- IEC 60852-1:1986 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment. Part 1 : Transformers and inductors using YEI-1 laminations
- IEC 60852-3:1992 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment; part 3: transformers and inductors using YUI-1 laminations
- IEC 60852-2:1992 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment; part 2: transformers and inductors using YEx-2 laminations for printed wiring board mounting
Electronic Components, Assemblies and Materials Association, Chip instrument
- EIA_ECA-953-2006 Molded Tantalum Chip Capacitor with Polymer Cathode
- EIA/ECA-953-2006 Molded Tantalum Chip Capacitor with Polymer Cathode
- ECA EIA/ECA-955-2007 SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION)
- ECA 393-1971 Core Laminations, Vertical and Horizontal Channel Frames for Transformers for Radio and TV Receivers
- ECA SP 4984-2005 Surface Mount Aluminum Electrolytic Chip Capacitor with Polymer Cathode To be published as ANSI/EIA/ECA-955
- EIA_ECA-747-A-2007 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
- ECA EIA-747-B-2014 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick
HU-MSZT, Chip instrument
Lithuanian Standards Office , Chip instrument
- LST EN ISO 9801:2010 Ophthalmic instruments - Trial case lenses (ISO 9801:2009)
- LST HD 475 S1-2002 Dimensions of planchets used in nuclear electronic instruments (IEC 60248:1984)
- LST EN 61021-2-2002 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment. Part 2: Electrical characteristics for cores using YEE 2 laminations (IEC 61021-2:1995)
- LST EN 60749-19+AC-2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2002)
- LST EN ISO 9342-1:2005 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2005)
- LST EN 60749-19+AC-2003/A1-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2003/A1:2010)
AENOR, Chip instrument
- UNE-EN ISO 9801:2010 Ophthalmic instruments - Trial case lenses (ISO 9801:2009)
- UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
- UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
- UNE-EN ISO 9342-1:2006 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2005)
AIA/NAS - Aerospace Industries Association of America Inc., Chip instrument
European Standard for Electrical and Electronic Components, Chip instrument
Electronic Components, Assemblies and Materials Association, Chip instrument
- ECA CB-11-1986 Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines for
- ECA 580A000-1992 Sectional Specification for Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric for Use in Electronic Equipment
ECIA - Electronic Components Industry Association, Chip instrument
- EIA-800-1999 Integrated Passive Device (IPD) Chipscale Package Design Guidelines
- 393-1971 Core Laminations@ Vertical and Horizontal Channel Frames for Transformers for Radio and TV Receivers
- EIA-747-B-2014 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick
- EIA-747-2002 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
- IS-747-1997 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
American National Standards Institute (ANSI), Chip instrument
- ANSI/EIA 595-A:2009 Visual & Mechanical Inspection Mulilayer Ceramic Chip Capacitors
- ANSI/ISO 7943.3:1987 Audiovisual Systems - Overhead Projectors - Film Rolls, Cores and Winders (dimensions) / Note: reaffirmation and redesignation of ANSI/ISO 7943.3-1987 and ANSI IT7.217-1989
British Standards Institution (BSI), Chip instrument
- 22/30383603 DC BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices - Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
- BS EN 61021-2:1997 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Electrical characteristics for cores using YEE 2 laminations
- BS EN 62024-1:2002 High frequency inductive components - Electrical characteristics and measuring methods - Nanohenry range chip inductor
- BS EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
- BS IEC 61468:2021 Nuclear power plants. Instrumentation systems important to safety. In-core instrumentation: Characteristics and test methods of self-powered neutron detectors
- BS QC 300800:1991 Harmonized system of quality assessment for electronic components - Fixed capacitors for use in electronic equipment - Sectional specification for fixed tantalum chip capacitors
- BS EN 61797-1:1997 Transformers and inductors for use in telecommunication and electronic equipment. Main dimensions of coil formers. Coil formers for laminated cores
- 20/30383597 DC BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices. Part 2. Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices
- 21/30439434 DC BS EN IEC 63215-5. Endurance test methods for die attach materials - Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
- BS EN IEC 62149-11:2020 Fibre optic active components and devices. Performance standards - Multiple channel transmitter/receiver chip scale package with multimode fibre interface
- BS EN IEC 60404-17:2021 Magnetic materials - Methods of measurement of the magnetostriction characteristics of grain-oriented electrical steel strip and sheet by means of a single sheet tester and an optical sensor
- 22/30406184 DC BS EN ISO 9342-1. Optics and optical instruments. Test lenses for calibration of focimeters - Part 1. Reference lenses for focimeters used for measuring spectacle lenses
RU-GOST R, Chip instrument
- GOST R ISO 7943-3-1993 Photography. Overhead projectors. Film rolls, cores and winders. Dimensions
- GOST 8910-1975 Measuring instruments of film length. Assumed perforation. Gear ratios
- GOST 23587-1996 Electrical wiring of radio-electronic equipment and devices. Technical requirements for termination of hookup wires and wire strand attachment
- GOST 23587-1979 Mounting of electric radioelectronic equipment and instruments. Technical requirements for hookup wires termination and conductors fastening
European Committee for Electrotechnical Standardization(CENELEC), Chip instrument
- EN 61021-2:1997 Laminated Core Packages for Transformers and Inductors for Use in Telecommunication and Electronic Equipment Part 2: Electrical Characteristics for Cores Using YEE 2 Laminations
- EN 61021-1:1997 Laminated Core Packages for Transformers and Inductors Used in Telecommunication and Electronic Equipment Part 1: Dimensions
- EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
- EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
Korean Agency for Technology and Standards (KATS), Chip instrument
- KS C 6489-1991(2001) FIXED MULTILAYER CERAMIC CHIP CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT
- KS C IEC 62317-5:2019 Ferrite cores — Dimensions — Part 5: EP-cores and associated parts for use in inductors and transformers
- KS C 6372-1993(1998) FIXED TANTALUM ELECTOLYTIC CHIP CAPACITORS WITH SOLID ELECTROLYTE FOR USE IN ELECTRONIC EQUIPMENT
- KS G ISO 11380:2001 Optics and optical instruments-Ophthalmic optics-Formers
- KS C IEC 60568-2009(2019) In-core instrumentation for neutron fluence rate(flux) measurements in power reactor
- KS C IEC 60568:2009 In-core instrumentation for neutron fluence rate(flux) measurements in power reactor
- KS C IEC 61468-2006(2016) Nuclear power plants-In-core instrumentation-Characteristics and test methods of self-powered neutron detectors
- KS B ISO 9338:2004 Optics and optical instruments-Contact lenses-Determination of the diameters
- KS B ISO 9338:2014 Optics and optical instruments — Contact lenses — Determination of the diameters
- KS M 3088-1994 Testing methods for water vapor transmission rate of plastic film and sheeting(instrument method)
- KS M 3088-2013 Testing methods for water vapor transmission rate of plastic film and sheeting(instrument method)
- KS B ISO 9339-1:2004 Optics and optical instruments-Contact lenses-Determination of the thickness-Part 1:Rigid contact lenses
- KS B ISO 9339-1:2014 Optics and optical instruments — Contact lenses — Determination of the thickness — Part 1: Rigid contact lenses
- KS C IEC 61468-2006(2021) Nuclear power plants-In-core instrumentation-Characteristics and test methods of self-powered neutron detectors
- KS P ISO 7740:2018 Instruments for surgery — Scalpels with detachable blades — Fitting dimensions
- KS B ISO 9339-2:2004 Optics and optical instruments-Contact lenses-Determination of thickness-Part 2:Hydrogel contact lenses
- KS B ISO 9339-2:2014 Optics and optical instruments — Contact lenses — Determination of thickness — Part 2: Hydrogel contact lenses
- KS C 5115-8-2001 Fixed resistors for use in electronic equipment-Part 8:Sectional specification:Fixed chip resistors
- KS C IEC 61468:2006 Nuclear power plants-In-core instrumentation-Characteristics and test methods of self-powered neutron detectors
- KS M 3088-2009 Testing methods for water vapor transmission rate of plastic film and sheeting(instrument method)
- KS C 5115-81-2013 Fixed resistors for use in electronic equipment-Part 8:Blank detail specification:Fixed chip resistors Assessment level E
- KS C IEC 62024-1:2006 High frequency inductive components-Electrical characteristics and measuring methods-Part 1:Nanohenry range chip inductor
- KS C IEC 62024-1:2017 High frequency inductive components-Electrical characteristics and measuring methods-Part 1:Nanohenry range chip inductor
- KS C 5115-81-2001 Fixed resistors for use in electronic equipment-Part 8:Blank detail specification:Fixed chip resistors Assessment level E
- KS C 6054-1992(1997) FIXED CARBON FILM CHIP CYLINDRICAL TYPE RESISTORS FOR USE IN ELECTRONIC EQUIPMENT (FORM 27, CHARACTERISTIC D AND G,GRADE C)
工业和信息化部, Chip instrument
- JB/T 13778-2020 Positive temperature coefficient thermistor chip for compressor starter
RO-ASRO, Chip instrument
U.S. Military Regulations and Norms, Chip instrument
- ARMY MIL-F-2763 B NOTICE 1-1997 FILTER, LIGHT, OPTICAL INSTRUMENT, BINOCULAR
- ARMY MIL-F-2763 B-1966 FILTER, LIGHT, OPTICAL INSTRUMENT, BINOCULAR
- ARMY MIL-PRF-55681/4 G-2010 CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY)
- ARMY MIL-PRF-55681/2 D VALID NOTICE 1-2011 Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR05
- ARMY MIL-PRF-55681/3 E VALID NOTICE 1-2011 Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR06
Professional Standard - Military and Civilian Products, Chip instrument
- WJ 1223-1980 Universal tool for optical instrument assembly Round head scraper
- WJ 1224-1980 Optical instrument assembly general tool pointed scraper
- WJ 1225-1980 Universal tools for optical instrument assembly Putty scrapers
IN-BIS, Chip instrument
- IS 13897-1993 In-core instrumentation for neutron fluence rate (flux ) measurements in power reactors
KR-KS, Chip instrument
- KS C IEC 62317-5-2019 Ferrite cores — Dimensions — Part 5: EP-cores and associated parts for use in inductors and transformers
- KS P ISO 7740-2018 Instruments for surgery — Scalpels with detachable blades — Fitting dimensions
CN-QIYE, Chip instrument
- Q/GDW 11179.12-2015 Technical Specifications for Components Used in Energy Meters Part 12: Clock Chips
- Q/GDW 11179.14-2015 Technical Specifications for Components for Electric Energy Meters Part 14: Metering Chips
- Q/GDW 11179.11-2015 Part 11 of technical specifications for components used in electric energy meters: serial port communication protocol RS-485 chip
BE-NBN, Chip instrument
Society of Motion Picture and Television Engineers (SMPTE), Chip instrument
- SMPTE ST 159.1-2001 Motion-Picture Film (8-mm Type S) - Model 1 Camera Cartridge - Cartridge-Camera Interface and Take-Up Core Drive
Hebei Provincial Standard of the People's Republic of China, Chip instrument
- DB13/T 5120-2019 Specifications for DC performance test of FP and DFB semiconductor laser chips for optical communication
PH-BPS, Chip instrument
- PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
ES-UNE, Chip instrument
- UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
- UNE-EN 61021-2:1997 LAMINATED CORE PACKAGES FOR TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT. PART 2: ELECTRICAL CHARACTERISTICS FOR CORES USING YEE 2 LAMINATIONS (Endorsed by AENOR in December of 1997.)
AT-ON, Chip instrument
- ONORM EN 27740-1993 Instruments for surgery - Scalpels with detachable blades -Fitting dimensions
Japanese Industrial Standards Committee (JISC), Chip instrument
- JIS K 7129:2008 Plastics --Film and sheeting -- Determination of water vapour transmission rate -- Instrumental method
- JIS K 7129:1992 Testing methods for water vapor transmission rate of plastic film and sheeting (instrument method)
ASHRAE - American Society of Heating@ Refrigerating and Air-Conditioning Engineers@ Inc., Chip instrument
- ASHRAE 4301-1999 Measurement of Frost Characteristics on Heat Exchanger Fins Part 1: Test Facility and Instrumentation (RP-824)
IECQ - IEC: Quality Assessment System for Electronic Components, Chip instrument
- QC 301901/ JP 0002-1987 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
- QC 301901/ JP 0003-1992 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
- QC 301901/ JP 0001-1987 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
- QC 301901/ SG 000-1990 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
- QC 300801/ JP 0002-1990 Detail Specification for Electronic Components Fixed Tantalum Chip Capacitors with Solid Electrolyte Assessment Level(s) E
Standard Association of Australia (SAA), Chip instrument
- AS ISO 9342.1:2017 Optics and optical instruments — Test lenses for calibration of focimeters, Part 1: Test lenses for focimeters used for measuring spectacle lenses
Institute of Electrical and Electronics Engineers (IEEE), Chip instrument
- SMPTE ST 159-1:2001 ST 159-1:2001 - SMPTE Standard - For Motion-Picture Film (8-mm Type S) — Model 1 Camera Cartridge — Cartridge-Camera Interface and Take-Up Core Drive
CENELEC - European Committee for Electrotechnical Standardization, Chip instrument
- EN 62024-1:2002 High frequency inductive components - Electrical characteristics and measuring methods Part 1: Nanohenry range chip inductor
ES-AENOR, Chip instrument