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Chip instrument

Chip instrument, Total:371 items.

In the international standard classification, Chip instrument involves: Medical equipment, Resistors, Road vehicle systems, Data storage devices, Analytical chemistry, Photography, Measurement of force, weight and pressure, Technical drawings, Semiconductor devices, Applications of information technology, Transformers. Reactors, Components for electrical equipment, Document imaging applications, Valves, Capacitors, Audio, video and audiovisual engineering, Electronic component assemblies, Radiation measurements, Nuclear energy engineering, Radiocommunications, Fibre optic communications, Characteristics and design of machines, apparatus, equipment, Dentistry, Electric filters, Optics and optical measurements, Integrated circuits. Microelectronics, Electronic components in general, Materials for aerospace construction, Rubber and plastics products, Cinematography, Character sets and information coding, Electromechanical components for electronic and telecommunications equipment, Magnetic materials, Electrical engineering in general, Electrical wires and cables.

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, Chip instrument

JEDEC JESD82-22-2006 Instrumentation Chip Data Sheet for FBDIMM Diagnostic Senselines
JEDEC JESD82-29-2009 Definition of the SSTE32882 Registering Clock Driver with Parity and Quad Chip Selects for DDR3 RDIMM Applications

Group Standards of the People's Republic of China, Chip instrument

T/CCZX 9-2023 Anti-crosstalk biochip analyzer
T/CASME 671-2023 Wide area oxygen sensor chip
T/QGCML 1986-2023
T/CTS 11-2023 Technical requirements of data security chip for data recorder of vehicle
T/CMIF 116-2020 Thermopile infrared sensor chip
T/QGCML 2041-2023
T/GDRA 011-2019 Technical requirements for transformer core robot stacking
T/ZZB 1840-2020 High-performance spider included thin dynamic speaker unit
T/BFIA 007-2021 Security technical specification of CPU for financial security chip
T/ZSA 106-2021 Battery electric passenger vehicle —Integrated circuit assembled in electronic control unit—Test method
T/ZAII 046-2023 General technical requirements for micro-processor of single-phase smart meter

Defense Logistics Agency, Chip instrument

DLA DSCC-DWG-02006 REV B-2007 CAPACITORS, FIXED, TANTALUM, CHIP
DLA DSCC-DWG-04053 REV A-2006 CAPACITOR, FIXED, FUSED TANTALUM CHIP
DLA DSCC-DWG-95158 REV F-2008 CAPACITOR, FIXED, TANTALUM CHIP, LOW ESR
DLA DSCC-DWG-05006 REV B-2009 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
DLA DSCC-DWG-03028 REV B-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
DLA DSCC-DWG-03028 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
DLA DSCC-DWG-05006 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
DLA DSCC-DWG-03028 REV D-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
DLA DSCC-DWG-03029 REV D-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0402
DLA DSCC-DWG-05006 REV D-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
DLA DSCC-DWG-05007 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
DLA DSCC-DWG-03028 REV E-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 0603
DLA DSCC-DWG-03029 REV E-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 0402
DLA DSCC-DWG-05006 REV E-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
DLA DSCC-DWG-05007 REV D-2011 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
DLA DSCC-DWG-05006 REV F-2012 CAPACITORS, FIXED, CERAMIC, CHIP, 0805
DLA DSCC-DWG-05007 REV E-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
DLA DSCC-DWG-05007 REV F-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 1206
DLA DSCC-DWG-04051-2006 CAPACITOR, FIXED, POLYMER TANTALUM CHIP
DLA DESC-DWG-89089 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, HIGH VOLTAGE
DLA DSCC-DWG-01033 REV B-2010 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
DLA DSCC-DWG-02002 REV B-2007 CAPACITORS, FIXED, TANTALUM, CHIP
DLA DSCC-DWG-11017-2011 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0402
DLA DSCC-DWG-11018-2011 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
DLA DSCC-DWG-11019-2011 INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0805
DLA DSCC-DWG-09009-2009 CAPACITOR, FIXED, TANTALUM CHIP MODULE, LOW ESR
DLA SMD-5962-81008 REV B-2008 MICROCIRCUIT, LINEAR, MONOLITHIC AND MULTICHIP, 12-BIT DIGITAL-TO-ANALOG CONVERTERS
DLA DSCC-VID-V62/05615 REV A-2012 MICROCIRCUIT, LINEAR, INTERCONNECT EXTENDER CHIPSET WITH LVDS, MONOLITHIC SILICON
DLA DSCC-DWG-05001 REV B-2009 CAPACITORS, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
DLA DSCC-DWG-05002 REV C-2010 CAPACITORS, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
DLA DSCC-DWG-05001 REV D-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
DLA DSCC-DWG-05002 REV D-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
DLA DSCC-DWG-05003 REV C-2013 CAPACITORS, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP
DLA AN6238 REV 4 VALID NOTICE 1-2009 Gasket, Hydraulic Replaceable Reservoir Type Filter Element
DLA AN6238 REV 4 VALID NOTICE 2-2013 Gasket, Hydraulic Replaceable Reservoir Type Filter Element
DLA MIL-M-38510/111 A VALID NOTICE 2-2008 Microcircuits, Analog Switch with Driver, Monolithic and Multi- Chip Silicon
DLA MIL-M-38510/111 A VALID NOTICE 1-2008 Microcircuits, Analog Switch with Driver, Monolithic and Multi- Chip Silicon
DLA DSCC-DWG-03011-2003 RESISTOR, FIXED, FILM, CHIP, ZERO-OHM, STYLE 0201
DLA DSCC-DWG-04052-2006 CAPACITOR, FIXED, MULTIPLE ANODE POLYMER TANTALUM CHIP
DLA A-A-59742 VALID NOTICE 1-2011 Inductor, Chip, Power, Low Resistance, Surface Mount
DLA QPL-32192-1 NOTICE 1-2008 Resistors, Chip, Thermal (Thermistor), General Specification for
DLA DSCC-DWG-94047 REV F-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 2 WATT, STYLE 3610
DLA DSCC-DWG-95006 REV E-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 1 WATT, STYLE 2512
DLA QPL-32192-QPD-2010 Resistors, Chip, Thermal (Thermistor), General Specification for
DLA QPL-32192-2011 Resistors, Chip, Thermal (Thermistor), General Specification for
DLA DESC-DWG-94047 REV G-2013 RESISTOR, FIXED, FILM, CHIP (MELF), 2 WATT, STYLE 3610
DLA DESC-DWG-95006 REV F-2013 RESISTOR, FIXED, FILM, CHIP (MELF), 1 WATT, STYLE 2512
DLA DESC-DWG-95006 REV G-2013 RESISTOR, FIXED, FILM, CHIP (MELF), 1 WATT, STYLE 2512
DLA QPL-32192-2013 Resistors, Chip, Thermal (Thermistor), General Specification for
DLA A-A-55562 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip
DLA DSCC-DWG-03017 REV A-2007 RESISTOR, THERMAL, THERMISTOR, DIE CHIP, POSITIVE TEMPERATURE COEFFICIENT (PTC) style 0303
DLA DSCC-DWG-03018 REV A-2007 RESISTOR, THERMAL, THERMISTOR, DIE CHIP, NEGATIVE TEMPERATURE COEFFICIENT (NTC), STYLE 0404
DLA DSCC-DWG-09023-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0201
DLA DSCC-DWG-09024-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0402
DLA DSCC-DWG-09025-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0603
DLA DSCC-DWG-09026-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 0805
DLA DSCC-DWG-09027-2011 CAPACITORS, FIXED, CERAMIC, CHIP, TIGHT TOLERANCE, THIN FILM, 1210
DLA DSCC-DWG-05009 REV A-2009 RESISTOR, FIXED, FILM, CHIP (MELF), 1/4 WATT, STYLE 0204
DLA DSCC-DWG-94048 REV F-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 1/2 WATT, STYLE 2010
DLA DSCC-DWG-95011 REV E-2010 RESISTOR, FIXED, FILM, CHIP (MELF), 1/8 WATT, STYLE 1206
DLA SMD-5962-92061 REV G-2008 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
DLA A-A-55562/2 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 0805
DLA A-A-55562/3 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 1206
DLA A-A-55562/4 A VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 1210
DLA A-A-55562/5 VALID NOTICE 2-2011 Resistor, Voltage Sensitive (Varistor, Metal Oxide), Chip, Style 0402
DLA DSCC-DWG-01033 REV A-2002 RESISTOR, FIXED, FILM, CHIP, VOLTAGE DIVIDER, STYLE 1206
DLA DSCC-DWG-93079 REV D-2010 RESISTOR, FIXED, BULK METAL FOIL, CHIP, ULTRA PRECISION, STYLE 1505
DLA DSCC-DWG-02001 REV A-2011 RESISTOR, FIXED, FILM, PRECISION, CHIP 1/8 WATT, STYLE 2012
DLA SMD-5962-92061 REV F-2003 MICROCIRCUIT, HYBRID, DIGITAL, MULTICHIP, DUAL CHANNEL, DRIVER-RECEIVER
DLA A-A-59416 A-2008 INDUCTOR, CHIP, FIXED, HIGH SELF RESONANT FREQUENCY, SURFACE MOUNT
DLA DSCC-DWG-13008-2013 CAPACITORS, FIXED, MULTIPLE ANODE TANTALUM, CHIP, CONFORMAL COATED CASE
DLA MIL-PRF-32192/1 (2)-2012 RESISTOR, CHIP, THERMAL (THERMISTOR), POSITIVE TEMPERATURE COEFFICIENT, STYLE RCTP0303
DLA DSCC-DWG-12011-2012 RESISTOR, CHIP, FIXED, FILM, VALUES LESS THAN 1 OHM, STYLE 1010
DLA SMD-5962-87780-1989 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-88630 REV E-2006 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-87780 REV A-2011 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-90564 REV E-2013 MICROCIRCUIT, DIGITAL, CHMOS, SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 16K BYTES OF EPROM PROGRAM MEMORY, MONOLITHIC SILICON
DLA DSCC-DWG-02001-2002 RESISTOR, FIXED, FILM, PRECISION, CHIP 1/8 WATT, STYLE 2012
DLA DSCC-DWG-03010 REV C-2009 RESISTOR, FIXED, FILM, CHIP, SURFACE MOUNTED, ULTRA PRECISION, STYLE 1506
DLA DSCC-DWG-04032 REV B-2011 RESISTOR, CHIP, FIXED, FILM, LOW VALUES, HIGH POWER, 1.5 WATTS, STYLE 2512
DLA DSCC-DWG-12009-2012 RESISTOR, CHIP, FIXED, FILM, VALUES LESS THAN 1 OHM, STYLE 2010
DLA SMD-5962-90976-1992 MICROCIRCUIT, CHMOS SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 256 BYTES OF ON CHIP DATA RAM, MONOLITHIC SILICON
DLA DSCC-DWG-07010-2009 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0201
DLA DSCC-DWG-07010 REV A-2010 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0201
DLA DESC-DWG-94016 REV H-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY AND SPACE LEVEL, STYLE 1206
DLA DESC-DWG-94016 REV J-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1206
DLA DSCC-DWG-04008 REV C-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0402
DLA DESC-DWG-94012 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY AND SPACE LEVEL, STYLE 0505
DLA DESC-DWG-94013 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1005
DLA DSCC-DWG-94014 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 2208
DLA DESC-DWG-94019 REV G-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1010
DLA DESC-DWG-94025 REV H-2011 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY AND SPACE LEVEL, STYLE 0502
DLA MIL-PRF-32192/2 (2)-2012 RESISTOR, CHIP, THERMAL (THERMISTOR), INSULATED POSITIVE TEMPERATURE COEFFICIENT STYLE RCTP0805
DLA DESC-DWG-94013 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1005
DLA DESC-DWG-94015 REV K-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0705
DLA DESC-DWG-94017 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 2010
DLA DESC-DWG-94019 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1010
DLA DESC-DWG-94026 REV H-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 1505
DLA DSCC-DWG-04007 REV D-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0302
DLA DSCC-DWG-04009 REV D-2013 RESISTOR, CHIP, FIXED, FILM, MOISTURE RESISTANT, MILITARY and SPACE LEVEL, STYLE 0603
DLA DSCC-DWG-04025 REV A-2010 RESISTOR, CHIP, FIXED, FILM, SURFACE MOUNT, 5 WATTS (UP TO 25 WATTS WITH HEATSINK)
DLA DSCC-DWG-05015 REV A-2012 RESISTOR, CHIP, FIXED, FILM, SURFACE MOUNT, 2.25 WATTS (UP TO 20 WATTS WITH HEATSINK)
DLA DSCC-DWG-04025 REV B-2012 RESISTOR, CHIP, FIXED, FILM, SURFACE MOUNT, 5 WATTS (UP TO 25 WATTS WITH HEATSINK)
DLA SMD-5962-08214 REV A-2009 MICROCIRCUIT, LINEAR, DUAL LOW OFFSET, MATCHED, OPERATIONAL AMPLIFIER, MULTI-CHIP SILICON
DLA DSCC-DWG-01002 REV F-2010 RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE, STYLE 2512
DLA DSCC-DWG-01002 REV G-2013 RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE, STYLE 2512
DLA SMD-5962-95529 REV A-2004 MICROCIRCUIT, LINEAR, INSTRUMENTATION, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
DLA DSCC-VID-V62/13625-2013 MICROCIRCUIT, LINEAR, LOW POWER INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA DSCC-DWG-01002 REV E-2002 RESISTOR, FIXED, FILM, CHIP, 1.5 WATT (MELF), FLAT CERAMIC PACKAGE STYLE 2512
DLA SMD-5962-01511 REV F-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K x 32-BIT, RADIATION-HARDENED SRAM, MULTICHIP MODULE
DLA SMD-5962-95592 REV B-2013 MICROCIRCUIT, DIGITAL-LINEAR, FAST, SERIAL, 16-BIT, A/D CONVERTER, MULTICHIP SILICON
DLA SMD-5962-99503 REV A-2009 MICROCIRCUIT, LINEAR, MICROPOWER, INSTRUMENTATION OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-87719 REV E-2010 MICROCIRCUIT, LINEAR, PROGRAMMABLE GAIN INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-88539 REV F-2011 MICROCIRCUIT, LINEAR, RADIATION HARDENED, PRECISION INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-01533 REV B-2003 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K X 32-BIT, 3.3V, RADIATION-HARDENED SRAM, MULTICHIP MODULE
DLA SMD-5962-10232-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATIONHARDENED, SRAM, MULTI-CHIP MODULE
DLA SMD-5962-10232 REV A-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M X 32-BIT (64Mb), RADIATIONHARDENED, SRAM, MULTI-CHIP MODULE
DLA DSCC-DWG-04053 REV C-2009 CAPACITOR, FIXED, FUSED TANTALUM CHIP NON-WEIBULL GRADED AND WEIBULL GRADED
DLA DSCC-DWG-04053 REV D-2010 CAPACITOR, FIXED, FUSED TANTALUM CHIP NON-WEIBULL GRADED AND WEIBULL GRADED
DLA SMD-5962-88539 REV E-2005 MICROCIRCUIT, LINEAR, RADIATION HARDENED, PRECISION INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
DLA SMD-5962-02517 REV B-2011 MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 128M X 8 bit STACKED DIE(1Gbit) SYNCHRONOUS DRAM (SDRAM), MODULE
DLA SMD-5962-01532 REV C-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1024K x 8-BIT (8 M), RADIATION-HARDENED SRAM, MULTICHIP MODULE
DLA SMD-5962-01533 REV C-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K x 32-BIT, 3.3 V, RADIATION-HARDENED SRAM, MULTICHIP MODULE
DLA SMD-5962-02518 REV A-2009 MICROCIRCUIT MEMORY CMOS, DIGITAL, 256M X 8 BIT STACKED DIE (2GBIT) SYNCHRONOUS DRAM (SDRAM), MODULE
DLA SMD-5962-06229 REV D-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16 MBIT (512K X 32), RADIATION-HARDENED, LOW VOLTAGE SRAM, MULTICHIP MODULE
DLA QPL-32159-QPD-2010 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
DLA QPL-32159-2011 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
DLA QPL-32159-2012 Resistors, Chip, Fixed, Film, Zero OHM, Industrial, High Reliability, Space Level, General Specification for
DLA SMD-5962-10205 REV A-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1MEG X 39-BIT (40M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
DLA SMD-5962-10205 REV B-2011 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1MEG X 39-BIT (40M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
DLA SMD-5962-10206-2012 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2MEG X 39-BIT (80M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
DLA SMD-5962-10207-2013 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 4MEG X 39-BIT (160M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
DLA SMD-5962-10205-2010 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1MEG X 39-BIT (40M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
DLA SMD-5962-87685-1987 MICROCIRCUITS, 8-BIT MICROPROCESSOR CPU, NMOS, MONOLITHIC SILICON
DLA SMD-5962-04227 REV C-2009 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 512K x 32-BIT (16 M), RADIATION-HARDENED, DUAL VOLTAGE SRAM, MULTICHIP MODULE
DLA SMD-5962-01532 REV B-2003 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1024K X 8-BIT, (8 M) RADIATION-HARDENED, LOW VOLTAGE SRAM, MULTICHIP MODULE
DLA QPL-49464-QPD-2012 Capacitors, Chip, Single Layer, Fixed, Parallel Plate, Ceramic Dielectric, Established Reliability, General Specification for
DLA MIL-PRF-19500/657 B-2011 SEMICONDUCTOR DEVICE, FIELD EFFECT, RADIATION HARDENED, TRANSISTOR DIE, N AND P-CHANNEL, SILICON VARIOUS TYPES JANHC AND JANKC
DLA DSCC-DWG-95013 REV C-2009 RESISTOR, CHIP, FIXED, FILM, STYLE 0302 [Use: ARMY MIL-PRF-55342/13 (2), ARMY MIL-PRF-55342/13 (1), ARMY MIL-PRF-55342/13]
DLA SMD-5962-91566 REV C-1996 MICROCIRCUIT, DIGITAL, CMOS SINGLE CHIP 8-BIT MICROCONTROLLER, MONOLITHIC SILICON
DLA MIL-DTL-3933/29 A-2011 ATTENUATORS, FIXED, SPACE LEVEL, NON SPACE LEVEL, CHIP, (SURFACE MOUNT), 0-20 DB, FREQUENCY RANGE: DC TO 18 GHZ. CLASS IV

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Chip instrument

GB/T 34324-2017 Technical requirement of microarray biochip spotter
GB/T 35891-2018 Technical requirement of microarray washer
GB/T 35895-2018 Technical requirement of microarray hybridizer
GB/T 33805-2017 Technical requirement of laser confocal biochip scanner
GB/T 33806-2017 Technical requirement of area fluorescent imaging microarray scanner

European Committee for Standardization (CEN), Chip instrument

EN ISO 10938:2016 Ophthalmic optics - Chart displays for visual acuity measurement - Printed@ projected and electronic
FprEN ISO 9342-1 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Reference lenses for focimeters used for measuring spectacle lenses (ISO/FDIS 9342-1:2023)

International Organization for Standardization (ISO), Chip instrument

ISO 10938:2016 Ophthalmic optics - Chart displays for visual acuity measurement - Printed, projected and electronic
ISO 10938:1998 Ophthalmic instruments - Chart projectors
ISO 7943-3:1987 Photography; Overhead projectors; Part 3 : Film rolls, cores and winders; Dimensions
ISO/FDIS 9342-1 Optics and optical instruments — Test lenses for calibration of focimeters — Part 1: Reference lenses for focimeters used for measuring spectacle lenses
ISO 9342-1:2023 Optics and optical instruments — Test lenses for calibration of focimeters — Part 1: Reference lenses for focimeters used for measuring spectacle lenses

Professional Standard - Machinery, Chip instrument

JB/T 8259.3-1999 Overhead projectors film rolls, cores and winders dimensions
JB/T 8259.1-2014 Overhead projectors.Part 1: Film rolls, cores and winders.Dimensions
JB/T 5590-1991 Optical filter of optical spectrum instrument
JB/T 9330-1999 The basic parameter for diaphragm plate of optical instrument

国家市场监督管理总局、中国国家标准化管理委员会, Chip instrument

GB/T 41407-2022 Technical requirement of nucleic acid isothermal amplification analyzer based on microfluidic chips
GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength

German Institute for Standardization, Chip instrument

DIN 58545:1996 Pencil points or divider points for standard drawing instruments (S)
DIN EN ISO 9801:2010-04 Ophthalmic instruments - Trial case lenses (ISO 9801:2009); German version EN ISO 9801:2009
DIN 96156:2011 Medical instruments - Retractor type Kocher, blade curved
DIN 96156:2017 Medical instruments - Retractor type Kocher, blade curved
DIN 4000-70:1992 Tabular layouts of article characteristics for core laminations, cores and coil formers for small transformers and chokes
DIN EN 61021-2:1997-10 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations (IEC 61021-2:1995); German version EN 61021-2:1997
DIN EN ISO 11380:1996 Optics and optical instruments - Ophthalmic optics - Formers (ISO 11380:1994); German version EN ISO 11380:1996
DIN EN 61021-2:1997 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations (IEC 61021-2:1995); German version EN 61021-2:1997
DIN 41307-3:1981 Accessory parts for small transformers and chokes; attachment straps for cores typ E, U and 3 U
DIN EN 60749-19:2011-01 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003 + A1:2010); German version EN 60749-19:2003 + A1:2010 / Note: DIN EN 60749-19 (2003-10) remains valid alongside this standard until 2013-09-01.
DIN EN IEC 63215-2:2021-01 Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:...
DIN EN ISO 9342-1:2005-08 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2005); German version EN ISO 9342-1:2005 / Note: To be replaced by DIN EN ISO 9342-1 (2022-07).
DIN EN IEC 62148-19:2020-07 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package (IEC 62148-19:2019); German version EN IEC 62148-19:2019
DIN EN ISO 9342-1:2022-07 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Reference lenses for focimeters used for measuring spectacle lenses (ISO/DIS 9342-1:2022); German and English version prEN ISO 9342-1:2022 / Note: Date of issue 2022-0...
DIN 13133-1:2005 Medical instruments - Uterine scissors, curved on flat, type Sims - Part 1: Without carbide inserts
DIN EN IEC 63215-5:2022-06 Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English / N...
DIN EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 62024-1:2008); German version EN 62024-1:2008
DIN 45635-60:1989-10 Measurement of airborne noise emitted by machines; enveloping surface method; still picture and motion-picture projectors

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Chip instrument

GB 17342-1998 Ophthalmic instrument--Trial case lenses
GB/T 17342-2009 Ophthalmic instrument - Trial case lenses
GB 17342-2009 Ophthalmic instrument-Trial case lenses
GB/T 26328-2010 Optical interference filters for biochemical analyzer
GB/T 42706.5-2023 Long-term storage of electronic components and semiconductor devices - Part 5: Chips and wafers
GB/T 22186-2016 Information security techniques.Security technical requirements for IC card chip with CPU

Military Standards (MIL-STD), Chip instrument

DOD A-A-51121-1985 PLIERS, OPTICIANS', CHIPPING

Danish Standards Foundation, Chip instrument

DS/EN ISO 9801:2010 Ophthalmic instruments - Trial case lenses
DS/EN 61021-2:1998 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations
DS/EN 60749-19/A1:2010 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
DS/EN 61021-1:1998 Laminated core packages for transformers and inductors used in telecommunication and electronic equipment - Part 1: Dimensions
DS/EN ISO 9342-1:2005 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses
DS/CLC/TR 50489:2007 Smart tracker chips - Feasibility study on the inclusion of RFID in Electrical and Electronic Equipment for WEEE management
DS/EN 61797-1:1997 Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores

未注明发布机构, Chip instrument

BS EN ISO 9801:2009(2010) Ophthalmic instruments — Trial case lenses
BS EN ISO 9342-1:2023 Optics and optical instruments — Test lenses for calibration of focimeters Part 1 : Reference lenses for focimeters used for measuring spectacle lenses

Professional Standard - Electron, Chip instrument

SJ/T 10416-1993 Generic Apecification for chip for semiconductor discrete devices
SJ/T 11856.3-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 3: Electric Absorption Modulated Semiconductor Laser Chips for Light Sources
SJ/T 11856.2-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 2: Vertical Cavity Surface Emitting Semiconductor Laser Chips for Light Sources
SJ/T 11402-2009 Technical specification of semiconductor laser chip used in optical fiber communication
SJ/T 11856.1-2022 Technical Specifications for Semiconductor Laser Chips for Optical Fiber Communications Part 1: Fabry-Perot Type and Distributed Feedback Type Semiconductor Laser Chips for Light Sources

Taiwan Provincial Standard of the People's Republic of China, Chip instrument

CNS 13622-1997 Fixed chip resistor for use in electronic equipment
CNS 13198-1993 Fixed Multilayer Ceramic Chip Capacitors for Use in Electronic Equipment
CNS 13788-1996 Methods of Test for Water Vapor Transmission Rate of Plastic Films and Sheets (Instrument Method)

IT-UNI, Chip instrument

CZ-CSN, Chip instrument

CSN 37 0356-1964 E. h. v. apparatus terminals for A. C.S. R. and aluminium oables.
CSN IEC 248:1994 Dimension of planchets used in nuclear electronic instruments
CSN 19 8281-1973 Spools for lb mm and 35 mm íilms and microfilm reading apparatus
CSN IEC 384-3:1993 Fixed capactiors for use in electronic euipment. Part 3: Sectional specification: Fixed tantalum chip capacitors
CSN 19 6080-1959

Association Francaise de Normalisation, Chip instrument

NF EN ISO 9801:2010 Instruments ophtalmiques - Verres de boîte d'essai
NF Z43-205:1984 MICROGRAPHICS. READER-PRINTERS AND ENLARGERS/MICROFORM PRINTGERS.
NF EN 61021-2:1998 Noyaux en tôles découpées pour transformateurs et inductances destinés aux équipements électroniques et de télécommunications - Partie 2 : caractéristiques électriques pour noyaux utilisant des tôles YEE 2.
NF C96-435-5*NF EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - die and wafer devices
NF EN 62435-5:2017 Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - dispositifs de puces et plaquettes
NF EN 61021-1:1998 Noyaux en tôles découpées pour transformateurs et inductances destinés aux équipements électroniques et de télécommunications - Partie 1 : dimensions.
FD S11-485*FD ISO/TR 18476:2018 Ophthalmic optics and instruments - Free form technology - Spectacle lenses and measurement
NF C93-133:1987 Components for electric equipment. Type 1 and type 2 fixed multilayer ceramic chip capacitors. General requirements.
NF EN IEC 62148-19:2019 Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 19 : boîtier à puce photonique
NF C93-883-19*NF EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19 : photonic chip scale package
FD ISO/TR 18476:2018 Optique et instruments ophtalmiques - Technologie free form - Verres de lunettes correctrices et mesure
NF EN ISO 9342-1:2005 Optique et instruments d'optique - Verres étalons pour l'étalonnage des frontofocomètres - Partie 1 : verres étalons pour frontofocomètres pour le mesurage des verres de lunettes
NF C93-330*NF EN 61797-1:1997 Transformers and inductors for use in telecommunication and electronic equipment. Main dimensions of coil formers. Part 1 : coil formers for laminated cores.
NF EN 61797-1:1997 Transformateurs et inductances destinés aux équipements électroniques et de télécommunication - Dimensions principales des carcasses - Partie 1 : carcasses pour noyaux feuilletés.
NF EN IEC 62149-11:2020 Composants et dispositifs actifs fibroniques - Normes de performances - Partie 11 : boîtier-puce émetteur/récepteur à plusieurs canaux avec interface à fibre multimodale

SAE - SAE International, Chip instrument

SAE ARP843-1964 Chip Detector@ Electrical Connection@ Remote Indicating
SAE ARP843A-2001 Chip Detector@ Electrical Connection@ Remote Indicating

Society of Automotive Engineers (SAE), Chip instrument

SAE ARP843-1995 CHIP DETECTOR, ELECTRICAL CONNECTION, REMOTE INDICATING
SAE ARP843A-2012 Chip Detector, Electrical Connection, Remote Indicating
SAE ARP843B-2021 Chip Detector, Electrical Connection, Remote Indicating

International Electrotechnical Commission (IEC), Chip instrument

IEC 61021-2:1995 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Part 2: Electrical characteristics for cores using YEE 2 laminations
IEC 61468:2000/AMD1:2003 Nuclear power plants - In-core instrumentation - Characteristics and test methods of self-powered neutron detectors; Amendment 1
IEC 60740-2:1993 Laminations for transformers and inductors for use in telecommunication and electronic equipment; part 2: specification for the minimum permeabilities of laminations made of soft magnetic metallic materials
IEC 60740/AMD1:1991 Laminations for transformers and inductors for use in telecommunication and electronic equipment; amendment 1
IEC 62317-5:2015 Ferrite cores - Dimensions - Part 5: EP-cores and associated parts for use in inductors and transformers
IEC 61021-1:1990 Laminated core packages for transformers and inductors used in telecommunication and electronic equipment; part 1: dimensions
IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
IEC 61468:2021 Nuclear power plants - Instrumentation systems important to safety - In-core instrumentation: Characteristics and test methods of self-powered neutron detectors
IEC 61468:2000 Nuclear power plants - In-core instrumentation - Characteristics and test methods of self-powered neutron detectors
IEC 62149-11:2020 Fibre optic active components and devices - Performance standards - Part 11: Multiple channel transmitter/receiver chip scale package with multimode fibre interface
IEC 61343:1996 Nuclear reactor instrumentation - Boiling light water reactors (BWR) - Measurements in the reactor vessel for monitoring adequate cooling within the core
IEC 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
IEC 62024-1:2008/COR1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor corrigendum 1
IEC 60852-4:1996 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment - Part 4: Transformers and inductors using YUI-2 laminations
IEC 60852-1:1986 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment. Part 1 : Transformers and inductors using YEI-1 laminations
IEC 60852-3:1992 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment; part 3: transformers and inductors using YUI-1 laminations
IEC 60852-2:1992 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment; part 2: transformers and inductors using YEx-2 laminations for printed wiring board mounting

Electronic Components, Assemblies and Materials Association, Chip instrument

EIA_ECA-953-2006 Molded Tantalum Chip Capacitor with Polymer Cathode
EIA/ECA-953-2006 Molded Tantalum Chip Capacitor with Polymer Cathode
ECA EIA/ECA-955-2007 SURFACE MOUNT ALUMINUM ELECTROLYTIC CHIP CAPACITOR WITH POLYMER CATHODE (QUALIFICATION SPECIFICATION)
ECA 393-1971 Core Laminations, Vertical and Horizontal Channel Frames for Transformers for Radio and TV Receivers
ECA SP 4984-2005 Surface Mount Aluminum Electrolytic Chip Capacitor with Polymer Cathode To be published as ANSI/EIA/ECA-955
EIA_ECA-747-A-2007 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
ECA EIA-747-B-2014 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick

HU-MSZT, Chip instrument

Lithuanian Standards Office , Chip instrument

LST EN ISO 9801:2010 Ophthalmic instruments - Trial case lenses (ISO 9801:2009)
LST HD 475 S1-2002 Dimensions of planchets used in nuclear electronic instruments (IEC 60248:1984)
LST EN 61021-2-2002 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment. Part 2: Electrical characteristics for cores using YEE 2 laminations (IEC 61021-2:1995)
LST EN 60749-19+AC-2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2002)
LST EN ISO 9342-1:2005 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2005)
LST EN 60749-19+AC-2003/A1-2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength (IEC 60749-19:2003/A1:2010)

AENOR, Chip instrument

UNE-EN ISO 9801:2010 Ophthalmic instruments - Trial case lenses (ISO 9801:2009)
UNE-EN 60749-19:2003/A1:2011 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-19:2003 Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN ISO 9342-1:2006 Optics and optical instruments - Test lenses for calibration of focimeters - Part 1: Test lenses for focimeters used for measuring spectacle lenses (ISO 9342-1:2005)

AIA/NAS - Aerospace Industries Association of America Inc., Chip instrument

NASM33737-2011 NUT@ SHEET SPRING@ INSTRUMENT MOUNTING (Rev 1)
NASM33737-2014 NUT@ SHEET SPRING@ INSTRUMENT MOUNTING (Rev 2)

European Standard for Electrical and Electronic Components, Chip instrument

CECC 32 101- 007 ISSUE 1-1990 UTE C 83-133; Fixed Multilayer Ceramic Chip Capacitors (Fr)

Electronic Components, Assemblies and Materials Association, Chip instrument

ECA CB-11-1986 Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines for
ECA 580A000-1992 Sectional Specification for Fixed Chip Capacitors with Metallized Electrodes and Polyethylene-Terephthalate Dielectric for Use in Electronic Equipment

ECIA - Electronic Components Industry Association, Chip instrument

EIA-800-1999 Integrated Passive Device (IPD) Chipscale Package Design Guidelines
393-1971 Core Laminations@ Vertical and Horizontal Channel Frames for Transformers for Radio and TV Receivers
EIA-747-B-2014 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0mm Thick
EIA-747-2002 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick
IS-747-1997 Adhesive Backed Punched Plastic Carrier Taping of Singulated Bare Die and Other Surface Mount Components for Automatic Handling of Devices Generally Less Than 1.0 mm Thick

American National Standards Institute （ANSI), Chip instrument

ANSI/EIA 595-A:2009 Visual & Mechanical Inspection Mulilayer Ceramic Chip Capacitors
ANSI/ISO 7943.3:1987 Audiovisual Systems - Overhead Projectors - Film Rolls, Cores and Winders (dimensions) / Note: reaffirmation and redesignation of ANSI/ISO 7943.3-1987 and ANSI IT7.217-1989

British Standards Institution (BSI), Chip instrument

22/30383603 DC BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices - Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
BS EN 61021-2:1997 Laminated core packages for transformers and inductors for use in telecommunication and electronic equipment - Electrical characteristics for cores using YEE 2 laminations
BS EN 62024-1:2002 High frequency inductive components - Electrical characteristics and measuring methods - Nanohenry range chip inductor
BS EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
BS IEC 61468:2021 Nuclear power plants. Instrumentation systems important to safety. In-core instrumentation: Characteristics and test methods of self-powered neutron detectors
BS QC 300800:1991 Harmonized system of quality assessment for electronic components - Fixed capacitors for use in electronic equipment - Sectional specification for fixed tantalum chip capacitors
BS EN 61797-1:1997 Transformers and inductors for use in telecommunication and electronic equipment. Main dimensions of coil formers. Coil formers for laminated cores
20/30383597 DC BS EN IEC 63215-2. Endurance test methods for die attach materials applied to power electronics devices. Part 2. Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices
21/30439434 DC BS EN IEC 63215-5. Endurance test methods for die attach materials - Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
BS EN IEC 62149-11:2020 Fibre optic active components and devices. Performance standards - Multiple channel transmitter/receiver chip scale package with multimode fibre interface
BS EN IEC 60404-17:2021 Magnetic materials - Methods of measurement of the magnetostriction characteristics of grain-oriented electrical steel strip and sheet by means of a single sheet tester and an optical sensor

RU-GOST R, Chip instrument

GOST R ISO 7943-3-1993 Photography. Overhead projectors. Film rolls, cores and winders. Dimensions
GOST 8910-1975 Measuring instruments of film length. Assumed perforation. Gear ratios
GOST 23587-1996 Electrical wiring of radio-electronic equipment and devices. Technical requirements for termination of hookup wires and wire strand attachment
GOST 23587-1979 Mounting of electric radioelectronic equipment and instruments. Technical requirements for hookup wires termination and conductors fastening

European Committee for Electrotechnical Standardization（CENELEC）, Chip instrument

EN 61021-2:1997 Laminated Core Packages for Transformers and Inductors for Use in Telecommunication and Electronic Equipment Part 2: Electrical Characteristics for Cores Using YEE 2 Laminations
EN 61021-1:1997 Laminated Core Packages for Transformers and Inductors Used in Telecommunication and Electronic Equipment Part 1: Dimensions
EN IEC 62148-19:2019 Fibre optic active components and devices - Package and interface standards - Part 19: Photonic chip scale package
EN 62024-1:2008 High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor

Korean Agency for Technology and Standards (KATS), Chip instrument

KS C 6489-1991(2001) FIXED MULTILAYER CERAMIC CHIP CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT
KS C IEC 62317-5:2019 Ferrite cores — Dimensions — Part 5: EP-cores and associated parts for use in inductors and transformers
KS C 6372-1993(1998) FIXED TANTALUM ELECTOLYTIC CHIP CAPACITORS WITH SOLID ELECTROLYTE FOR USE IN ELECTRONIC EQUIPMENT
KS G ISO 11380:2001 Optics and optical instruments－Ophthalmic optics－Formers
KS C IEC 60568-2009(2019) In-core instrumentation for neutron fluence rate(flux) measurements in power reactor
KS C IEC 60568:2009 In-core instrumentation for neutron fluence rate(flux) measurements in power reactor
KS C IEC 61468-2006(2016) Nuclear power plants－In-core instrumentation－Characteristics and test methods of self-powered neutron detectors
KS B ISO 9338:2004 Optics and optical instruments-Contact lenses-Determination of the diameters
KS B ISO 9338:2014 Optics and optical instruments — Contact lenses — Determination of the diameters
KS M 3088-1994 Testing methods for water vapor transmission rate of plastic film and sheeting(instrument method)
KS M 3088-2013 Testing methods for water vapor transmission rate of plastic film and sheeting(instrument method)
KS B ISO 9339-1:2004 Optics and optical instruments-Contact lenses-Determination of the thickness-Part 1:Rigid contact lenses
KS B ISO 9339-1:2014 Optics and optical instruments — Contact lenses — Determination of the thickness — Part 1: Rigid contact lenses
KS C IEC 61468-2006(2021) Nuclear power plants－In-core instrumentation－Characteristics and test methods of self-powered neutron detectors
KS P ISO 7740:2018 Instruments for surgery — Scalpels with detachable blades — Fitting dimensions
KS B ISO 9339-2:2004 Optics and optical instruments-Contact lenses-Determination of thickness-Part 2:Hydrogel contact lenses
KS B ISO 9339-2:2014 Optics and optical instruments — Contact lenses — Determination of thickness — Part 2: Hydrogel contact lenses
KS C 5115-8-2001 Fixed resistors for use in electronic equipment－Part 8：Sectional specification：Fixed chip resistors
KS C IEC 61468:2006 Nuclear power plants－In-core instrumentation－Characteristics and test methods of self-powered neutron detectors
KS M 3088-2009 Testing methods for water vapor transmission rate of plastic film and sheeting(instrument method)
KS C 5115-81-2013 Fixed resistors for use in electronic equipment－Part 8：Blank detail specification：Fixed chip resistors Assessment level E
KS C IEC 62024-1:2006 High frequency inductive components-Electrical characteristics and measuring methods-Part 1:Nanohenry range chip inductor
KS C IEC 62024-1:2017 High frequency inductive components－Electrical characteristics and measuring methods－Part 1：Nanohenry range chip inductor
KS C 6054-1992(1997) FIXED CARBON FILM CHIP CYLINDRICAL TYPE RESISTORS FOR USE IN ELECTRONIC EQUIPMENT (FORM 27, CHARACTERISTIC D AND G,GRADE C)
KS C 5115-81-2001 Fixed resistors for use in electronic equipment-Part 8:Blank detail specification:Fixed chip resistors Assessment level E

工业和信息化部, Chip instrument

JB/T 13778-2020 Positive temperature coefficient thermistor chip for compressor starter

RO-ASRO, Chip instrument

STAS SR ISO 10323:1995 Dental rotary instruments - Bore diameters for discs and wheels

U.S. Military Regulations and Norms, Chip instrument

ARMY MIL-F-2763 B NOTICE 1-1997 FILTER, LIGHT, OPTICAL INSTRUMENT, BINOCULAR
ARMY MIL-F-2763 B-1966 FILTER, LIGHT, OPTICAL INSTRUMENT, BINOCULAR
ARMY MIL-PRF-55681/4 G-2010 CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY)
ARMY MIL-PRF-55681/2 D VALID NOTICE 1-2011 Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR05
ARMY MIL-PRF-55681/3 E VALID NOTICE 1-2011 Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, Style CDR06

Professional Standard - Military and Civilian Products, Chip instrument

WJ 1223-1980 Universal tool for optical instrument assembly Round head scraper
WJ 1224-1980 Optical instrument assembly general tool pointed scraper
WJ 1225-1980 Universal tools for optical instrument assembly Putty scrapers

IN-BIS, Chip instrument

IS 13897-1993 In-core instrumentation for neutron fluence rate (flux ) measurements in power reactors

KR-KS, Chip instrument

KS C IEC 62317-5-2019 Ferrite cores — Dimensions — Part 5: EP-cores and associated parts for use in inductors and transformers
KS P ISO 7740-2018 Instruments for surgery — Scalpels with detachable blades — Fitting dimensions

CN-QIYE, Chip instrument

Q/GDW 11179.12-2015 Technical Specifications for Components Used in Energy Meters Part 12: Clock Chips
Q/GDW 11179.14-2015 Technical Specifications for Components for Electric Energy Meters Part 14: Metering Chips
Q/GDW 11179.11-2015 Part 11 of technical specifications for components used in electric energy meters: serial port communication protocol RS-485 chip

BE-NBN, Chip instrument

Society of Motion Picture and Television Engineers (SMPTE), Chip instrument

SMPTE ST 159.1-2001 Motion-Picture Film (8-mm Type S) - Model 1 Camera Cartridge - Cartridge-Camera Interface and Take-Up Core Drive

Hebei Provincial Standard of the People's Republic of China, Chip instrument

DB13/T 5120-2019 Specifications for DC performance test of FP and DFB semiconductor laser chips for optical communication

PH-BPS, Chip instrument

PNS IEC 62435-5:2021 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices

ES-UNE, Chip instrument

UNE-EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)
UNE-EN 61021-2:1997 LAMINATED CORE PACKAGES FOR TRANSFORMERS AND INDUCTORS FOR USE IN TELECOMMUNICATION AND ELECTRONIC EQUIPMENT. PART 2: ELECTRICAL CHARACTERISTICS FOR CORES USING YEE 2 LAMINATIONS (Endorsed by AENOR in December of 1997.)

AT-ON, Chip instrument

ONORM EN 27740-1993 Instruments for surgery - Scalpels with detachable blades -Fitting dimensions

Japanese Industrial Standards Committee (JISC), Chip instrument

JIS K 7129:2008 Plastics --Film and sheeting -- Determination of water vapour transmission rate -- Instrumental method
JIS K 7129:1992 Testing methods for water vapor transmission rate of plastic film and sheeting (instrument method)

ASHRAE - American Society of Heating@ Refrigerating and Air-Conditioning Engineers@ Inc., Chip instrument

ASHRAE 4301-1999 Measurement of Frost Characteristics on Heat Exchanger Fins Part 1: Test Facility and Instrumentation (RP-824)

IECQ - IEC: Quality Assessment System for Electronic Components, Chip instrument

QC 301901/ JP 0002-1987 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
QC 301901/ JP 0003-1992 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
QC 301901/ JP 0001-1987 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
QC 301901/ SG 000-1990 Detail Specification for Electronic Components Fixed Multilayer Ceramic Chip Capacitors Assessment Level E
QC 300801/ JP 0002-1990 Detail Specification for Electronic Components Fixed Tantalum Chip Capacitors with Solid Electrolyte Assessment Level(s) E

Standard Association of Australia （SAA）, Chip instrument

AS ISO 9342.1:2017 Optics and optical instruments — Test lenses for calibration of focimeters, Part 1: Test lenses for focimeters used for measuring spectacle lenses

Institute of Electrical and Electronics Engineers (IEEE), Chip instrument

SMPTE ST 159-1:2001 ST 159-1:2001 - SMPTE Standard - For Motion-Picture Film (8-mm Type S) — Model 1 Camera Cartridge — Cartridge-Camera Interface and Take-Up Core Drive

CENELEC - European Committee for Electrotechnical Standardization, Chip instrument

EN 62024-1:2002 High frequency inductive components - Electrical characteristics and measuring methods Part 1: Nanohenry range chip inductor

ES-AENOR, Chip instrument

UNE 20-543 Pt.10-1984