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Residual stress test

Residual stress test, Total:15 items.

In the international standard classification, Residual stress test involves: Testing of metals, Packaging and distribution of goods in general, Ceramics, Hydraulic construction, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment.

Indonesia Standards, Residual stress test

• SNI 07-6735-2002 Test methods for determining residual stresses by the hole-drilling strain-gage methods

RU-GOST R, Residual stress test

• GOST 31292-2006 Glass containers. Methods of testing the residual stresses after annealing

Professional Standard - Electron, Residual stress test

• SJ 3232.2-1989 Test method for bonding residual stress of low-melting welding glass powder

Group Standards of the People's Republic of China, Residual stress test

• T/CSTM 00440-2023 Test method for determining thermal expansion coefficient and residual stress of CVD ceramic coatings

Professional Standard - Water Conservancy, Residual stress test

• SL 499-2010 Standard test method for determining residual stresses by the hole-drilling strain-gage method (ASTM E837-08,IDT)

American Society for Testing and Materials (ASTM), Residual stress test

• ASTM E837-08e1 Standard Test Method for Determining Residual Stresses by the Hole-Drilling Strain-Gage Method
• ASTM E837-01 Standard Test Method for Determining Residual Stresses by the Hole-Drilling Strain-Gage Method
• ASTM E837-20 Standard Test Method for Determining Residual Stresses by the Hole-Drilling Strain-Gage Method
• ASTM E2860-20 Standard Test Method for Residual Stress Measurement by X-Ray Diffraction for Bearing Steels

Association Francaise de Normalisation, Residual stress test

• NF C96-050-16*NF EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16 : test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods
• NF EN 62047-16:2015 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 16 : méthodes d'essai pour déterminer les contraintes résiduelles des films de MEMS - Méthodes de la courbure de la plaquette et de déviation de poutre en porte-à-faux

ES-UNE, Residual stress test

• UNE-EN 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)
• UNE-EN ISO 21432:2022 Non-destructive testing - Standard test method for determining residual stresses by neutron diffraction (ISO 21432:2019)

International Electrotechnical Commission (IEC), Residual stress test

• IEC 62047-16:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

German Institute for Standardization, Residual stress test

• DIN EN 62047-16:2015-12 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods (IEC 62047-16:2015); German version EN 62047-16:2015

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