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Thin wafer

Thin wafer, Total:5 items.

In the international standard classification, Thin wafer involves: Semiconducting materials, Woodworking equipment, Thermodynamics and temperature measurements, Cutting tools.

Group Standards of the People's Republic of China, Thin wafer

• T/CASMES 125-2022 Wafer grinding and sawing technical specifications

Professional Standard - Forestry, Thin wafer

• LY/T 2001-2011 Ultra thin tungsten carbide tipped circular saw blade

American Society for Testing and Materials (ASTM), Thin wafer

• ASTM E511-07 Standard Test Method for Measuring Heat Flux Using a Copper-Constantan Circular Foil, Heat-Flux Transducer

AENOR, Thin wafer

• UNE-EN 1653/A1:2001 Copper and copper alloys. Plate, sheet and circles for boilers, pressure vessels and hot water storage units.

Association Francaise de Normalisation, Thin wafer

• NF E75-080:1975 COATED ABRASIVES. SHEETS, DISKS, ROLLS, BELTS, FLAP WHEELS. CORRESPONDENCE BETWEEN CURRENT SIZES AND STANDARDIZED SIZES.

Others:   Wafer terminal, Wafer cutting machine, Wafer cutting machine, Thin wafer, round sheet, Ultrasonic wafer machine, Disc knife, metal foil, cutting disc, Wafer use, Ultracapacitor pole piece is thin, Wafer machine model, Semiconductor Wafer Thickness, Silicon Dioxide Wafer, Wafer.