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jedec 22

jedec 22, Total:127 items.

In the international standard classification, jedec 22 involves: Semiconductor devices, Integrated circuits. Microelectronics, Applications of information technology, Surface treatment and coating, Mechanical structures for electronic equipment.

未注明发布机构, jedec 22

• JEDEC JESD 22-A104F-2020
• JEDEC JESD22-A121A-2008(2014)
• JEDEC JESD22-B118A-2021
• JEDEC JESD22-A111B-2018
• JEDEC JESD22-A108G-2022
• JEDEC JESD22-B120-2022
• JEDEC JESD22-B111A-2016
• JEDEC JESD22-A120C-2022
• JEDEC JESD22-B119-2018
• JEDEC JESD22-A119A-2015(2021)
• JEDEC JESD22-B130-2022
• JEDEC JESD22-A113I-2020
• JEDEC JESD22-A117E-2018
• JEDEC JESD22-A105D-2020
• JEDEC JESD22-B114B-2020
• JEDEC JESD22-B105E-2018
• JEDEC JESD22-A102E-2015(2021)
• JEDEC JESD22-A106B.02-2022
• JEDEC JESD22-B116B-2017
• JEDEC JESD22-B112B-2018
• JEDEC JESD22-B113B-2018
• JEDEC JESD22-A101D.01-2021
• JEDEC JESD22-A118B.01-2018
• JEDEC JESD22-A107C-2013(2020)
• JEDEC JESD22-B101D-2022
• JEDEC JESD22-A104F.01-2023
• JEDEC JESD22-B110B.01-2019
• JEDEC JESD22-B100B-2003(2016)
• JEDEC JESD22-B107D-2011(2018)
• JEDEC JESD22-B104C-2004(2009)

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association, jedec 22

• JEDEC JESD22A121A-2008 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
• JEDEC JESD22-A109-A-2001 Hermeticity
• JEDEC JESD22-A115-A-1997 Test Method A115-A Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM) [Refer To: JEDEC JESD22-A114F, JEDEC JESD22-A114E, JEDEC JESD22-A114D, JEDEC JESD22-A114C.01, JEDEC JESD22-A114C, JEDEC JESD22-A114-B, JEDEC JESD22-A114-A, JEDEC JES
• JEDEC JESD22-A117A-2006 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test
• JEDEC JESD22-A118-2000 Accelerated Moisture Resistance - Unbiased HAST
• JEDEC JESD22-A119-2004 Low Temperature Storage Life
• JEDEC JESD22-A120-2001 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Integrated Circuits
• JEDEC JESD22-A122-2007 Power Cycling
• JEDEC JESD22A111-2004 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices
• JEDEC JESD22A121.01-2005 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
• JEDEC JESD22-A119A-2015 Low Temperature Storage Life
• JEDEC JESD22-A121A-2008 Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes
• JEDEC JESD22-A118A-2011 Accelerated Moisture Resistance - Unbiased HAST
• JEDEC JESD22-A111A-2010 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices
• JEDEC JESD22-A122A-2016 Power Cycling
• JEDEC JESD22-A113H-2016 Universal Flash Storage (UFS) Card Extension Version 3.0
• JEDEC JESD22-A108D-2010 Temperature, Bias, and Operating Life
• JEDEC JESD22-A104E-2014 Temperature Cycling
• JEDEC JESD22-A107C-2013 Salt Atmosphere
• JEDEC JESD22-A101D-2015 Steady-State Temperature-Humidity Bias Life Test
• JEDEC JESD22-A100C-2007 Cycled Temperature-Humidity-Bias Life Test
• JEDEC JESD22-A100D-2013 Cycled Temperature-Humidity-Bias Life Test
• JEDEC JESD22-B115A-2010 Solder Ball Pull
• JEDEC JESD22-A100-B-2000 Cycled Temperature-Humidity-Bias Life Test
• JEDEC JESD22-A101-B-1997 Steady-State Temperature Humidity Bias Life Test
• JEDEC JESD22-A102-C-2000 Accelerated Moisture Resistance - Unbiased Autoclave
• JEDEC JESD22-A103C-2004 High Temperature Storage Life
• JEDEC JESD22-A104C-2005 Temperature Cycling
• JEDEC JESD22-A105C-2004 Power and Temperature Cycling
• JEDEC JESD22-A106B-2004 Thermal Shock
• JEDEC JESD22-A107B-2004 Salt Atmosphere
• JEDEC JESD22-A108C-2005 Temperature, Bias, and Operating Life
• JEDEC JESD22-A110-B-1999 Test Method A110-B Highly-Accelerated Temperature and Humidity Stress Test (HAST)
• JEDEC JESD22A113E-2006 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
• JEDEC JESD22-A114E-2007 Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
• JEDEC JESD22-B101A-2004 External Visual
• JEDEC JESD22-B108A-2003 Coplanarity Test for Surface-Mount Semiconductor Devices
• JEDEC JESD22-B109-2002 Flip Chip Tensile Pull
• JEDEC JESD22-B110A-2004 Subassembly Mechanical Shock
• JEDEC JESD22-B111-2003 Board Level Drop Test Method of Components for Handheld Electronic Products
• JEDEC JESD22-B113-2006 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
• JEDEC JESD22-B115-2007 Solder Ball Pull
• JEDEC JESD22-B116-1998 Test Method B116 Wire Bond Shear Test
• JEDEC JESD22-B117A-2006 Solder Ball Shear
• JEDEC JESD22B112-2005 High Temperature Package Warpage Measurement Methodology
• JEDEC JESD22-A108F-2017 Universal Flash Storage (UFS) Card Extension Version 3.0
• JEDEC JESD22-A104F-2020 Temperature Cycling
• JEDEC JESD22-A110E-2015 Highly Accelerated Temperature and Humidity Stress Test (HAST)
• JEDEC JESD22-A115C-2010 Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM)
• JEDEC JESD22B113A-2012 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
• JEDEC JESD22-A117C-2011 Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Stress Test
• JEDEC JESD22-B109A-2009 Flip Chip Tensile Pull
• JEDEC JESD22-A115B-2010 Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM)
• JEDEC JESD22-A113F-2008 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
• JEDEC JESD22-A113G-2015 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
• JEDEC JESD22-A102D-2010 Accelerated Moisture Resistance - Unbiased Autoclave
• JEDEC JESD22-A102E-2015 Accelerated Moisture Resistance - Unbiased Autoclave
• JEDEC JESD22-A118B-2015 Accelerated Moisture Resistance - Unbiased HAST
• JEDEC JESD22-A109B-2011 Hermeticity
• JEDEC JESD22-A110C-2009 Highly Accelerated Temperature and Humidity Stress Test (HAST)
• JEDEC JESD22-A110D-2010 Highly Accelerated Temperature and Humidity Stress Test (HAST)
• JEDEC JESD22-A103D-2010 High Temperature Storage Life
• JEDEC JESD22-A103E-2015 High Temperature Storage Life
• JEDEC JESD22-A120B-2014 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices
• JEDEC JESD22B114A-2011 Mark Legibility
• JEDEC JESD22-B118-2011 Semiconductor Wafer and Die Backside External Visual Inspection
• JEDEC JESD22-A114F-2008 Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
• JEDEC JESD22-A100E-2020 Cycled Temperature-Humidity-Bias with Surface Condensation Life Test
• JEDEC JESD82-22-2006 Instrumentation Chip Data Sheet for FBDIMM Diagnostic Senselines
• JEDEC JESD8-22-2009 HSUL_12 LPDDR2 I/O
• JEDEC JESD22-B106E-2016 Universal Flash Storage (UFS) Card Extension Version 3.0
• JEDEC JESD22-B106D-2008 Resistance to Solder Shock for Through-Hole Mounted Devices
• JEDEC JESD22-C101D-2008 Field-Induced Charged-Device Model Test Method for Electrostatic- Discharge-Withstand Thresholds of Microelectronic Components
• JEDEC JESD22-B101B-2009 External Visual
• JEDEC JESD22-B101C-2015 External Visual
• JEDEC JESD22-B100B-2003 Physical Dimensions
• JEDEC JESD22-B102D-2004 Solderability
• JEDEC JESD22-B103B-2002 Vibration, Variable Frequency
• JEDEC JESD22-B104C-2004 Mechanical Shock
• JEDEC JESD22-B105C-2003 Lead Integrity
• JEDEC JESD22-B106C-2005 Test Method B106C Resistance to Soldering Temperature for Through-Hole Mounted Devices
• JEDEC JESD22-B107C-2004 Marking Permanency
• JEDEC JESD22-C101C-2004 Field-Induced Charged-Device Model Test Method for Electrostatic- Discharge-Withstand Thresholds of Microelectronic Components
• JEDEC JESD22-A118B.01-2021 Universal Flash Storage (UFS) Card Extension Version 3.0
• JEDEC JESD22-B109C-2021 Flip Chip Tensile Pull
• JEDEC JESD22-B109B-2014 Flip Chip Tensile Pull
• JEDEC JESD22-B102E-2007 Solderability
• JEDEC JESD22-B110B-2013 Mechanical Shock - Component and Subassembly
• JEDEC JESD22-B105D-2011 Lead Integrity
• JEDEC JESD22-A103E.01-2021 High Temperature Storage Life (Minor Editorial Revision of JESD22-A103E, October 2015)
• JEDEC JESD22-B107D-2011 Mark Permanency
• JEDEC JESD22-C101F-2013 Field-Induced Charged-Device Model Test Method for Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
• JEDEC JESD22-B115A.01-2016 Solder Ball Pull
• JEDEC JESD22-B108B-2010 Coplanarity Test for Surface-Mount Semiconductor Devices
• JEDEC JESD22-B117B-2014 Solder Ball Shear
• JEDEC JESD8-22B-2014 HSUL_12 LPDDR2 and LPDDR3 I/O with Optional ODT
• JEDEC JESD22-B103B.01-2016 Universal Flash Storage (UFS) Card Extension Version 3.0

Others:   JEDEC, jedec jesd22a121a-2008, jedec jesd22-c101d-2008, jedec 22, jedec jesd22, jedec22 b116, jedec jesd22-c101f-2013, jedec 22-b111, jedec jesd22-c101, jedec-22-a102, jedec jesd22b112, jedec jesd22-b108b, jedec 22-b117, jedec jesd22-b117a-2006, jedec22, jedec jesd22-a114f, jedec jesd22-a118, jedec jesd22-a115-a, jedec jesd22-a101d, JEDEC 22 A102.