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Silicon Wafer Thickness Meter
Silicon Wafer Thickness Meter, Total:188 items.
In the international standard classification, Silicon Wafer Thickness Meter involves: Insulating fluids, Semiconducting materials, Non-ferrous metals, Solar energy engineering, Testing of metals, Linear and angular measurements, Analytical chemistry, Equipment for the paper industry, Plastics, Medical equipment, Paints and varnishes, Pharmaceutics, Iron and steel products, Road vehicle systems, Non-metalliferous minerals, Photography, Rubber and plastics products, Audio, video and audiovisual engineering, Measurement of fluid flow, Surface treatment and coating, Optical equipment, Integrated circuits. Microelectronics, Rotating machinery, Materials for aerospace construction, Nuclear energy engineering, Products of the textile industry, Semiconductor devices, Electromechanical components for electronic and telecommunications equipment.
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Silicon Wafer Thickness Meter
- GB/T 6618-1995 Test method for thickness and total thickness variation of silicon slices
- GB/T 6618-2009 Test method for thickness and total thickness variation of silicon slices
- GB/T 30867-2014 Test method for measuring thickness and total thickness variation of monocrystalline silicon carbide wafers
- GB/T 30869-2014 Test method for thickness and total thickness variation of silicon wafers for solar cell
- GB/T 29507-2013 Test method for measuring flatness,thickness and total thickness variation on silicon wafers.Automated non-contact scanning
- GB/T 31225-2014 Test method for the thickness of silicon oxide on Si substrate by ellipsometer
- GB/T 25188-2010 Thickness measurements for ultrathin silicon oxide layers on silicon wafers X-ray photoelectron spectroscopy
- GB/T 30857-2014 Standard test method for thickness and thickness variation on sapphire substrates
- GB/T 6619-1995 Test methods for bow of silicon slices
- GB/T 6619-2009 Test method for bow of silicon wafers
- GB/T 15615-1995 Test method for measuring flexture strength of silicon slices
- GB/T 20220-2006 Plastic.Film and sheeting.Determination of average thickness of a sample,and average thickness and yield of a roll,by gravimetric techniques (gravimetric thickness)
- GB/T 6621-2009 Testing methods for surface flatness of silicon slices
- GB/T 42905-2023 Infrared reflection method for measuring the thickness of silicon carbide epitaxial layer
- GB/T 42789-2023 Test method for surface gloss of silicon wafer
- GB/T 11378-2005 Metallic coatings.Measurement of coating thickness.Profilometric method
- GB/T 6620-1995 Test method for measuring warp on silicon slices by nontact scanning
- GB/T 6621-1995 Test methods for surface flatness of silicon polished slices
- GB/T 6620-2009 Test method for measuring warp on silicon slices by noncontact scanning
- GB/T 32278-2015 Test method for flatness of silicon carbide single wafer
- GB/T 6672-2001 Plastics film and sheeting Determination of thickness by mechanical scanning
- GB/T 42897-2023 Micro-electro-mechanical systems (MEMS) technology silicon-based MEMS nano-thick film tensile strength test method
- GB/T 32280-2015 Test method for warp of silicon wafers.Automated non-contact scanning method
- GB/T 30859-2014 Test method for warp and waviness of silicon wafers for solar cells
- GB/T 29505-2013 Test method for measuring surface roughness on planar surfaces of silicon wafer
Korean Agency for Technology and Standards (KATS), Silicon Wafer Thickness Meter
- KS D 0259-2012(2017) Methods of measurement of thickness,thickness variation and bow for silicon wafer
- KS D 0259-2012(2022) Methods of measurement of thickness,thickness variation and bow for silicon wafer
- KS D 0259-2012 Methods of measurement of thickness,thickness variation and bow for silicon wafer
- KS B ISO 9339-1:2004 Optics and optical instruments-Contact lenses-Determination of the thickness-Part 1:Rigid contact lenses
- KS B ISO 9339-1:2014 Optics and optical instruments — Contact lenses — Determination of the thickness — Part 1: Rigid contact lenses
- KS B ISO 9339-2:2004 Optics and optical instruments-Contact lenses-Determination of thickness-Part 2:Hydrogel contact lenses
- KS B ISO 9339-2:2014 Optics and optical instruments — Contact lenses — Determination of thickness — Part 2: Hydrogel contact lenses
- KS M 3089-2009 Testing method for thickness of plastic film and sheeting
- KS M 3089-1994 Testing method for thickness of plastic film and sheeting
- KS M 3089-2013 Testing method for thickness of plastic film and sheeting
- KS D ISO 4518-2012(2017) Metallic coatings-Measurement of coating thickness-Profilometric method
- KS M ISO 4591:2007 Plastics-Film and sheeting-Determiantion of average thickness of a sample, and average thickness and yield of a roll,by gravimetric techniques(gravimetric thickness)
- KS D ISO 4519:2009 Electrodeposited metallic coatings and related finishes-Sampling procedures for inspection by attributes
- KS L 5106-1995 Testing method for fineness of portland cement by air permeability apparatus
- KS D ISO 3497-2002(2017) Metallic coatings-Measurement of coating thickness-X-ray spectrometric methods
Japanese Industrial Standards Committee (JISC), Silicon Wafer Thickness Meter
- JIS H 0611:1994 Methods of measurement of thickness, thickness variation and bow for silicon wafer
- JIS K 7130:1999 Plastics -- Film and sheeting -- Determination of thickness
- JIS K 7130:1992 Testing methods for thickness of plastic film and sheeting
American Society for Testing and Materials (ASTM), Silicon Wafer Thickness Meter
- ASTM F533-96 Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
- ASTM F533-02 Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
- ASTM F1530-94 Standard Test Method for Measuring Flatness, Thickness, and Thickness Variation on Silicon Wafers by Automated Noncontact Scanning
- ASTM F534-97 Standard Test Method for Bow of Silicon Wafers
- ASTM F1527-00 Standard Guide for Application of Silicon Standard Reference Materials and Reference Wafers for Calibration and Control of Instruments for Measuring Resistivity of Silicon
- ASTM D4166-99 Standard Test Method for Measurement of Thickness of Nonmagnetic Materials by Means of a Digital Magnetic Intensity Instrument
German Institute for Standardization, Silicon Wafer Thickness Meter
- DIN V VDE V 0126-18-2-1:2007 Solar wafers - Part 2-1: Measuring the geometric dimensions of silicon wafers - Wafer thickness
- DIN V VDE V 0126-18-2-2:2007 Solar wafers - Part 2-2: Measuring the geometric dimensions of silicon wafers - Variations in thickness
- DIN V VDE V 0126-18-3:2007 Solar wafers - Part 3: Alkaline corrosion damage of crystalline silicon wafers - Method of determining the corrosion rate of mono and multi crystalline silicon wafers (as cut)
- DIN 50933:1987 Measurement of coating thickness by differential measurement using a stylus instrument
- DIN 50933:2015 Measurement of coating thicknesses - Measurement of the thickness of coatings by difference measurement using a stylus instrument
- DIN 50933:2015-08 Measurement of coating thicknesses - Measurement of the thickness of coatings by difference measurement using a stylus instrument
- DIN 50441-1:1996 Testing of materials for semiconductor technology - Determination of the geometric dimensions of semiconductor wafers - Part 1: Thickness and thickness variation
- DIN ISO 4593:2019-06 Plastics - Film and sheeting - Determination of thickness by mechanical scanning (ISO 4593:1993)
- DIN IEC 61336:1999-05 Nuclear instrumentation - Thickness measurement systems utilizing ionizing radiation - Definitions and test methods (IEC 61336:1996)
国家市场监督管理总局、中国国家标准化管理委员会, Silicon Wafer Thickness Meter
- GB/T 40279-2021 Test method for thickness of films on silicon wafer surface—Optical reflection method
- GB/T 37361-2019 Determination of the film thickness—Ultrasonic thickness gauge method
- GB/T 37051-2018 Test method for determination of crystal defect density in PV silicon ingot and wafer
- GB/T 32280-2022 Test method for warp and bow of silicon wafers—Automated non-contact scanning method
Professional Standard - Light Industry, Silicon Wafer Thickness Meter
CZ-CSN, Silicon Wafer Thickness Meter
- CSN 64 0181-1986 Plastics. Methods of thickness determination of films and sheets
- CSN ISO 4518:1994 Metallic coatings. Measurement of coating thickness. Profilometric method
- CSN ISO 1879:1993 Instruments for the measurement of surface roughness by the profile method. Terminology
- CSN ST SEV 1379-1978
- CSN ISO 1880:1993 Instruments for the measurement of surface roughness by the profile method. Contact (stylus) instruments of progressive profile transformation. Profile recording instruments
PL-PKN, Silicon Wafer Thickness Meter
HU-MSZT, Silicon Wafer Thickness Meter
National Metrological Technical Specifications of the People's Republic of China, Silicon Wafer Thickness Meter
- JJF(纺织) 020-2010 Calibration specification for fabric thickness instruments
- JJF(纺织)020-2010 Calibration Specification for Fabric Thickness Instruments
- JJF 1965-2022 Calibration Specification for Solder Paste Inspection Instruments
- JJF(纺织) 13-1985 Verification method of Y531 fabric thickness meter
- JJF(纺织) 101-2021 Calibration Specification for Geosynthetics Lever-Type Thickness Testers
- JJF 1224-2009 Calibration Specification for Reinforced Concrete Covermeter and Floorslab Thickness Tester
- JJF(纺织)101-2021 Calibration Specification for Geosynthetics Lever-Type Thickness Testers
- JJF(纺织) 025-2015 Calibration Specification for Wool Fiber Comb Stapling Sorter
- JJF(纺织)025-2015 Calibration Specification for Wool Fiber Comb Stapling Sorter
- JJF(纺织) 025-2006 Calibration specification for comb type wool length analyzer
Professional Standard - Machinery, Silicon Wafer Thickness Meter
工业和信息化部, Silicon Wafer Thickness Meter
Society of Automotive Engineers (SAE), Silicon Wafer Thickness Meter
SAE - SAE International, Silicon Wafer Thickness Meter
The Society for Protective Coatings (SSPC), Silicon Wafer Thickness Meter
- SSPC PA 9-2015 Measurement of Dry Coating Thickness Using Ultrasonic Gages
- SSPC PA 9-2008 Measurement of Dry Coating Thickness on Cementitious Substrates Using Ultrasonic Gages
SSPC - The Society for Protective Coatings, Silicon Wafer Thickness Meter
- PA 9-2015 Measurement of Dry Coating Thickness Using Ultrasonic Gages
- PA 9-2008 Measurement of Dry Coating Thickness on Cementitious Substrates Using Ultrasonic Gages
- PA GUIDE 9-2008 Measurement of Dry Coating Thickness on Cementitious Substrates Using Ultrasonic Gages
Group Standards of the People's Republic of China, Silicon Wafer Thickness Meter
- T/CAMS 127-2023 Cable insulation thickness tester
- T/IAWBS 007-2018 Test method for thickness of 4H silicon carbide homo-epitaxial layers by infrared reflectance
Taiwan Provincial Standard of the People's Republic of China, Silicon Wafer Thickness Meter
- CNS 6499-1980 Mica Blocks, Thins, Films and Splittings - Measurement of Thickness
- CNS 13923-1997 Method of test for thickness of plastic film and sheeting
Professional Standard - Ferrous Metallurgy, Silicon Wafer Thickness Meter
GM Daewoo, Silicon Wafer Thickness Meter
UNKNOWN, Silicon Wafer Thickness Meter
SE-SIS, Silicon Wafer Thickness Meter
Professional Standard - Chemical Industry, Silicon Wafer Thickness Meter
- HG/T 3009-1999 Photographic film and film base-determination of thickness by mechanical scanning
Military Standard of the People's Republic of China-General Armament Department, Silicon Wafer Thickness Meter
- GJB 3766-1999 Method for measuring the thickness of hard-based explosive foil of impact disk detonators - Surface profilometer method
- GJB 3766-1999(XG1-2015) Method for measuring the thickness of hard-based explosive foils in impact disk detonators—Surface profilometer method modification sheet 1-2015
- GJB 8687-2015 Calibration procedures for optical film refractive index and thickness testers
BR-ABNT, Silicon Wafer Thickness Meter
Defense Logistics Agency, Silicon Wafer Thickness Meter
- DLA SMD-5962-87780-1989 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-88630 REV E-2006 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-87780 REV A-2011 MICROCIRCUIT, LINEAR, INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-89871 REV B-1995 MICROCIRCUIT, LINEAR, FAST PRECISION COMPARATOR, MONOLITHIC SILICON
- DLA DSCC-VID-V62/13625-2013 MICROCIRCUIT, LINEAR, LOW POWER INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-99503 REV A-2009 MICROCIRCUIT, LINEAR, MICROPOWER, INSTRUMENTATION OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-87719 REV E-2010 MICROCIRCUIT, LINEAR, PROGRAMMABLE GAIN INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-88539 REV F-2011 MICROCIRCUIT, LINEAR, RADIATION HARDENED, PRECISION INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA DSCC-VID-V62/11618-2011 MICROCIRCUIT, LINEAR, TEMPERATURE SENSOR, MONOLITHIC SILICON
- DLA DSCC-VID-V62/06608 REV A-2012 MICROCIRCUIT, DIGITAL, TEMPERATURE SENSOR, MONOLITHIC SILICON
- DLA DSCC-VID-V62/05618 REV B-2013 MICROCIRCUIT, DIGITAL, TEMPERATURE SENSOR, MONOLITHIC SILICON
- DLA SMD-5962-95529 REV A-2004 MICROCIRCUIT, LINEAR, INSTRUMENTATION, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-89904 REV B-2004 MICROCIRCUIT, LINEAR, QUAD, LOW POWER PRECISION COMPARATOR, MONOLITHIC SILICON
- DLA SMD-5962-88539 REV E-2005 MICROCIRCUIT, LINEAR, RADIATION HARDENED, PRECISION INSTRUMENTATION AMPLIFIER, MONOLITHIC SILICON
- DLA SMD-5962-90507 REV A-2000 MICROCIRCUIT, LINEAR, TEMPERATURE TRANSDUCER, MONOLITHIC SILICON
- DLA SMD-5962-96687 REV B-2007 MICROCIRCUIT, LINEAR, PRECISION TEMPERATURE SENSOR, MONOLITHIC SILICON
- DLA SMD-5962-77037 REV H-2011 MICROCIRCUIT, DIGITAL, CMOS, 4-BIT MAGNITUDE COMPARATOR, MONOLITHIC SILICON
- DLA MIL-M-38510/150 D VALID NOTICE 1-2009 Microcircuits, Digital, Bipolar, TTL, Magnitude Comparators, Monolithic Silicon
- DLA SMD-5962-89711 REV B-2006 MICROCIRCUIT, DIGITAL, CMOS 64-BIT OUTPUT CORRELATOR, MONOLITHIC SILICON
British Standards Institution (BSI), Silicon Wafer Thickness Meter
- BS 5806:1979 Method of measurement of thickness for mica blocks, thins, films and splittings
- BS EN ISO 4518:1980 Metallic coatings - Measurement of coating thickness - Profilometric method
- BS TA 57:1974 Specification for plate of titanium-aluminium-molybdenum-tin-silicon alloy (tensile strength 1030-1220 MPa) (maximum thickness 65 mm)
- BS ISO 8255-1:2011 Microscopes. Cover glasses. Dimensional tolerances, thickness and optical properties
- BS IEC 61336:1996 Nuclear instrumentation. Thickness measurement systems utilizing ionizing radiation. Definitions and test methods
- BS 2782-6 Method 631A:1993 Methods of testing plastics. Dimensional properties. Determination of gravimetric thickness and yield of flexible sheet
ES-UNE, Silicon Wafer Thickness Meter
International Organization for Standardization (ISO), Silicon Wafer Thickness Meter
- ISO 4518:1980 Metallic coatings; Measurement of coating thickness; Profilometric method
- ISO 4591:1992 Plastics; film and sheeting; determination of average thickness of a sample, and average thickness and yield of a roll, by gravimetric techniques (gravimetric thickness)
- ISO 8255-1:1986 Optics and optical instruments; Microscopes; Cover glasses; Part 1 : Dimensional tolerances, thickness and optical properties
- ISO 5972:1978 Mica blocks, thins, films and splittings - Measurement of thickness
- IEC TR 63258:2021 Nanotechnologies — A guideline for ellipsometry application to evaluate the thickness of nanoscale films
- IEC/TR 63258:2021 Nanotechnologies — A guideline for ellipsometry application to evaluate the thickness of nanoscale films
- ISO 14701:2018 Surface chemical analysis — X-ray photoelectron spectroscopy — Measurement of silicon oxide thickness
National Metrological Verification Regulations of the People's Republic of China, Silicon Wafer Thickness Meter
- JJG 818-2005 Magnetic and Eddy Current Measuring Instrument for Coating Thickness
- JJG(轻工) 50-1990 Verification Regulations for Paper and Board Thickness Meter
- JJG 819-1993 Verification Regulation of Instrument for Measuring Thickness Variation of Bearing Ring
- JJG 818-2018 Verification regulations for magnetic and eddy current coating thickness measuring instruments
RU-GOST R, Silicon Wafer Thickness Meter
- GOST 8.502-1984 State system for ensuring the uniformity of measurments. Coating thickness gauges. Verification methods and means
- GOST 24680-1981 Rotating electrical machinery. Insulating collector plates. Row of thichnesses
- GOST 8.495-1983 State system for ensuring the uniformity of measurements. Ultrasonic contact-type instruments for measurement of thickness. Verification methods and means
Guangdong Provincial Standard of the People's Republic of China, Silicon Wafer Thickness Meter
Association Francaise de Normalisation, Silicon Wafer Thickness Meter
- NF EN ISO 12625-3:2014 Papier en tissue et produits tissue - Partie 3 : détermination de l'épaisseur, de l'épaisseur moyenne d'une feuille en liasse et de la masse volumique moyenne et de la main
- NF A91-114:1995 Metallic coatings. Measurement of coating thickness. Profilometric method.
- NF C96-050-9*NF EN 62047-9:2012 Semiconductor devices - Micro-electromechanical devices - Part 9 : wafer to wafer bonding strength measurement for MEMS.
Professional Standard - Non-ferrous Metal, Silicon Wafer Thickness Meter
- YS/T 23-2016 Test method for thickness of epitaxial layers.Stacking fault size
- YS/T 23-1992 Stacking Fault Size Method for Determination of Silicon Epitaxial Layer Thickness
- YS/T 15-1991 Determination of silicon epitaxial layer and diffusion thickness by grinding angle staining method
- YS/T 14-2015 Method for measuring the thickness of heteroepitaxial layer and silicon polycrystalline layer
- YS/T 14-1991 Method for measuring the thickness of heteroepitaxial layer and silicon polycrystalline layer
- YS/T 15-2015 Determination of thickness of silicon epitaxial layer and diffusion layer by grinding angle dyeing method
RO-ASRO, Silicon Wafer Thickness Meter
- STAS 7200-1973 PLASTICS Dotermination of thicknc;,s of films and sheets
IN-BIS, Silicon Wafer Thickness Meter
ZA-SANS, Silicon Wafer Thickness Meter
- SANS 4591:2003 Plastics - Film and sheeting - Determination of average thickness of a sample, and average thickness and yield of a roll, by gravimetric techniques (gravimetric thickness)
- SANS 4518:1980 Metallic coatings - Measurement of coating thickness - Profilometric method
- SANS 4593:2003 Plastics - Film and sheeting - Determination of thickness by mechanical scanning
- SANS 10834:2003 Textile floor coverings - Non-destructive measurement of pile thickness above the backing - WRONZ gauge method
PT-IPQ, Silicon Wafer Thickness Meter
- NP 2214-1986
- NP 770-1988 Paper and board Determination of the thickness of single sheets and method of calculation of the apparent density of board
National Electrical Manufacturers Association(NEMA), Silicon Wafer Thickness Meter
- NEMA MS 5-2003 Determination of Slice Thickness in Diagnostic Magnetic Resonance Imaging
NEMA - National Electrical Manufacturers Association, Silicon Wafer Thickness Meter
- NEMA MS 5-2010 Determination of Slice Thickness in Diagnostic Magnetic Resonance Imaging
- NEMA MS 5-1991 Determination of Slice Thickness in Diagnostic Magnetic Resonance Imaging
- NEMA MS 5-2018 Determination of Slice Thickness in Diagnostic Magnetic Resonance Imaging
AENOR, Silicon Wafer Thickness Meter
- UNE-ISO 4591:2010 Plastics -- Film and sheeting -- Determination of average thickness of a sample, and average thickness and yield of a roll, by gravimetric techniques (gravimetric thickness)
YU-JUS, Silicon Wafer Thickness Meter
- JUS C.A6.037-1991 Metali1c coatings. heasurement of coatlng tbickness. Profilometrlc metbo?
European Committee for Standardization (CEN), Silicon Wafer Thickness Meter
- EN ISO 4518:2021 Metallic coatings - Measurement of coating thickness - Profilometric method (ISO 4518:2021)
- EN ISO 4518:1995 Metallic Coatings - Measurement of Coating Thickness - Profilometric Method (ISO 4518:1990)
- EN 20534:1993 Paper and Board - Determination of Thickness and Apparent Bulk Density or Apparent Sheet Density (ISO 534 : 1988)
工业和信息化部/国家能源局, Silicon Wafer Thickness Meter
- JB/T 12962.3-2016 Energy dispersive X-ray fluorescence spectrometer Part 3: Coating thickness analyzer
Military Standard of the People's Republic of China-Commission of Science,Technology and Industry for National Defence, Silicon Wafer Thickness Meter
- GJB/J 5463-2005 Verification regulation for measurement equipment of optical film refractive index and thickness
Danish Standards Foundation, Silicon Wafer Thickness Meter
- DS/EN ISO 4518:1995 Metallic coatings - Measurement of coating thickness - Profiliometric method
Professional Standard - Nuclear Industry, Silicon Wafer Thickness Meter
- EJ/T 1141-2002 Cladding thickness measurement for USi-Al fuel plate Phase sensitive eddy current method
未注明发布机构, Silicon Wafer Thickness Meter
- BS IEC 61336:1996(1999) Nuclear instrumentation — Thickness measurement systems utilizing ionizing radiation — Definitions and test methods
International Electrotechnical Commission (IEC), Silicon Wafer Thickness Meter
- IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
- IEC 62047-9:2011/COR1:2012 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Silicon Wafer Thickness Meter
- GB/T 33826-2017 Measurement of nanofilm thickness on glass substrate—Profilometric method
Professional Standard - Commodity Inspection, Silicon Wafer Thickness Meter
- SN/T 0770-1999 Determination of silicon oxide in middle carbon flake graphite.Molybdenum blue photometric method