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Semiconductor bonder
Semiconductor bonder, Total:28 items.
In the international standard classification, Semiconductor bonder involves: Semiconductor devices, Products of non-ferrous metals, Semiconducting materials, Electronic component assemblies, Electrical wires and cables, Integrated circuits. Microelectronics, Spools. Bobbins.
General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Semiconductor bonder
- GB/T 41853-2022 Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
- GB/T 8750-1997 Gold wire for semiconductor devices lead bonding
- GB/T 8750-2014 Gold bonding wire for semiconductor package
- GB/T 8750-2007 Gold bonding wire for semiconductor devices
- GB/T 8646-1998 Fine aluminum-1% silicon wire for semiconductor lend-bonding
- GB/T 8750-2022 Gold-based bonding wire and bandlet for semiconductor package
Professional Standard - Non-ferrous Metal, Semiconductor bonder
Group Standards of the People's Republic of China, Semiconductor bonder
工业和信息化部, Semiconductor bonder
American Society for Testing and Materials (ASTM), Semiconductor bonder
- ASTM F72-17e1 Standard Specification for Gold Wire for Semiconductor Lead Bonding
- ASTM F72-95 Standard Specification for Gold Wire for Semiconductor Lead Bonding
- ASTM F72-17 Standard Specification for Gold Wire for Semiconductor Lead Bonding
- ASTM F72-21 Standard Specification for Gold Wire for Semiconductor Lead Bonding
- ASTM F638-88(1995)e1 Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding
- ASTM F487-13(2018) Standard Specification for Fine Aluminum–1 % Silicon Wire for Semiconductor Lead-Bonding
Professional Standard - Electron, Semiconductor bonder
- SJ/T 10705-1996 Standard practice for inspection of surface quality of semiconductor lead-bonding wire
国家市场监督管理总局、中国国家标准化管理委员会, Semiconductor bonder
- GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
未注明发布机构, Semiconductor bonder
- BS EN 62047-9:2011(2012) Semiconductor devices — Micro - electromechanical devices Part 9 : Wafer to wafer bonding strength measurement for MEMS
German Institute for Standardization, Semiconductor bonder
- DIN EN 62047-9:2012-03 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
ES-UNE, Semiconductor bonder
- UNE-EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
Danish Standards Foundation, Semiconductor bonder
- DS/EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
Association Francaise de Normalisation, Semiconductor bonder
- NF EN 62047-9:2012 Dispositifs à semiconducteurs - Dispositifs microélectromécaniques - Partie 9 : mesure de la résistance de collage de deux plaquettes pour les MEMS
Lithuanian Standards Office , Semiconductor bonder
- LST EN 62047-9-2011 Semiconductor devices - Micro-electromechanical devices -- Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011)
British Standards Institution (BSI), Semiconductor bonder
- BS 3934-5:1997 Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits