ZH
RU
ES

Herborist Ingredients

Herborist Ingredients, Total:498 items.

In the international standard classification, Herborist Ingredients involves: Tobacco, tobacco products and related equipment, Mechanical structures for electronic equipment, Applications of information technology, Character sets and information coding, Industrial automation systems, Integrated circuits. Microelectronics, Semiconductor devices, Terminology (principles and coordination), Farming and forestry, Electricity. Magnetism. Electrical and magnetic measurements, Vocabularies, Optoelectronics. Laser equipment, Water quality, Services, Energy and heat transfer engineering in general, Open systems interconnection (OSI), Buildings, Transport, Construction materials, Space systems and operations, Electronic component assemblies, Products of non-ferrous metals, Extraction and processing of petroleum and natural gas, Analytical chemistry.

Professional Standard - Tobacco, Herborist Ingredients

YC/T 493.1-2014 Technical specifications requirements for enterprise application integration for tobacco industry.Part 1: Portal integration standards
YC/T 493.2-2014 Technical specifications requirements for enterprise application integration for tobacco industry.Part 2: Service bus
YC/T 256.2-2008 Data elements for industrial and commercial statistics of tobacco industry.Part 2:Code set
YC/T 549.9-2016 Tobacco machinery.Identification method for dedicated tobacco machinery.Part 9:Filter rod making machinery

American National Standards Institute （ANSI), Herborist Ingredients

ANSI/VITA 58.0-2009 Line Replaceable Integrated Electronics Chassis Draft Standard
ANSI/ISA 95.00.04-2012 Enterprise-Control System Integration - Part 4: Objects and Attributes for Manufacturing Operations Management Integration

British Standards Institution (BSI), Herborist Ingredients

BS ISO 10303-101:1995 Industrial automation systems and integration - Product data representation and exchange - Integrated application resources: Draughting
BS ISO 10303-101:1994 Industrial automation systems and integration - Product data representation and exchange - Integrated application resources: Draughting
BS IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Semicustom integrated circuits
BS EN 60747-16-3:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Frequency converters
BS EN 60747-16-1:2002 Discrete semiconductor devices and integrated circuits - Microwave integrated circuits - Amplifiers
BS EN ISO 11807-2:2005 Integrated optics - Vocabulary - Terms used in classification
BS EN ISO 11807-2:2021 Integrated optics. Vocabulary. Terms used in classification
BS IEC 60748-11:2000 Semiconductor devices - Integrated circuits - Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS IEC 60748-11:1991 Semiconductor devices. Integrated circuits. Sectional specification for semiconductor integrated circuits excluding hybrid circuits
BS 6493 Sec.2.3:1987 Semiconductor devices. Integrated circuits. Recommendations for analogue integrated circuits
BS ISO 10303-201:1995 Industrial automation systems and integration - Product data representation and exchange - Application protocol: Explicit draughting
BS ISO 10303-201:1994 Industrial automation systems and integration - Product data representation and exchange - Application protocol: Explicit draughting
BS EN IEC 62769-4:2021 Field Device Integration (FDI). FDI Packages
BS EN IEC 62769-1:2021 Field Device Integration (FDI). Overview
BS ISO 24638:2009 Space systems. Pressure components and pressure system integration
BS ISO 24638:2008 Space systems - Pressure components and pressure system integration
BS EN IEC 62769-3:2021 Field Device Integration (FDI). Server
BS ISO 10303-45:1998 Industrial automation systems and integration - Product data representation and exchange - Integrated generic resource: Materials
BS ISO 10303-45:1999 Industrial automation systems and integration - Product data representation and exchange - Integrated generic resource: Materials
23/30454986 DC BS EN IEC 62264-2. Enterprise-control system integration - Part 2. Object and attributes for enterprise-control system integration
BS QC 760200:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
BS QC 760100:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
23/30454990 DC BS EN IEC 62264-4. Enterprise-control system integration - Part 4. Objects models attributes for manufacturing operations management integration
20/30408846 DC BS ISO 23218-2. Industrial automation systems and integration. Numerical control systems for machine tools. Part 2. Requirements for numerical control system integration
BS EN 60747-16-4:2004 Discrete semiconductor devices - Microwave integrated circuits - Switches

Standard Association of Australia （SAA）, Herborist Ingredients

AS 10303.101:1998 Industrial automation systems and integration - Product data representation and exchange - Integrated application resources: Draughting
AS 10303.201:1998 Industrial automation systems and integration - Product data representation and exchange - Application protocol: Explicit draughting
AS 10303.202:1999 Industrial automation systems and integration - Product data representation and exchange - Application protocol: Associative draughting
AS 1141.26:2008 Methods for sampling and testing aggregates - Secondary minerals content in igneous rocks
AS 1141.26:2019 Methods for sampling and testing aggregates - Secondary minerals content in igneous rocks

Institute of Electrical and Electronics Engineers (IEEE), Herborist Ingredients

IEEE Std P1801/D13, January 2013 IEEE Draft Standard for Design and Verification of Low Power Integrated Circuits
P3156/D2.1, September 2023 IEEE Draft Standard for Requirements of Privacy-preserving Computation Integrated Platforms
IEEE P3156/D2, July 2023 IEEE Draft Standard for Requirements of Privacy-preserving Computation Integrated Platforms
IEEE Unapproved Draft Std P1481/D2, Jun 2009 IEEE Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE P1481/D1, August 2019 IEEE Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE Unapproved Draft Std P1481/D2, Oct 2008 IEEE Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE P1838_D1 January 2019 IEEE Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
IEEE P1838_D2.0, August 2019 IEEE Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
IEEE P1851/D1.3, April 2012 IEEE Draft Standard for Design Criteria of Integrated Sensor-based Test Applications for Household Appliances
IEEE P1481/D2, September 2019 IEEE Approved Draft Standard for Integrated Circuit (IC) Open Library Architecture (OLA)
IEEE P1547.4/D11, March 2011 IEEE Draft Guide for Design, Operation, and Integration of Distributed Resource Island Systems with Electric Power Systems
IEEE P1547.4/D12, April 2011 IEEE Draft Guide for Design, Operation, and Integration of Distributed Resource Island Systems with Electric Power Systems
IEEE P1500/D1.4, November 2021 IEEE Draft Standard Testability Method for Embedded Core-based Integrated Circuits
IEEE P1801a/D01, May 2014 IEEE Draft Standard for Design and Verification of Low-Power Integrated Circuit -- Amendment 1
IEEE P1838_D3.00, September 2019 IEEE Approved Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits
IEEE P1851/D1.1, August 2011 IEEE Draft Standard for Design Criteria of Integrated Sensor-based Test Applications for Household Appliances
IEEE P1851/D1.2, March 2012 Ieee draft standard for design criteria of integrated sensor-based test applications for household appliances
IEEE P1851/D2.4, July 2022 IEEE Approved Draft Standard for Design Criteria of Integrated Sensor-Based Test Applications for Household Appliances
IEEE P1500/D1.5, February 2022 IEEE Approved Draft Standard Testability Method for Embedded Core-based Integrated Circuits
IEEE P1851 IEEE Approved Draft Standard for Design Criteria of Integrated Sensor-Based Test Applications for Household Appliances
IEEE P2030.2/D7.0, April 2014 IEEE Draft Guide for the Interoperability of Energy Storage Systems Integrated with the Electric Power Infrastructure
IEEE P2030.2/D8.0, October 2014 IEEE Draft Guide for the Interoperability of Energy Storage Systems Integrated with the Electric Power Infrastructure
IEEE Std P1500/D11, Jan 06 IEEE Draft Standard Testability Method for Embedded Core-Based Integrated Circuits
IEEE P1500/D1.3, May 2021 IEEE Draft Standard Testability Method for Embedded Core-based Integrated Circuits
ISO/IEC/IEEE P24748-6, March 2021 ISO/IEC/IEEE Draft Standard - Systems and Software Engineering -- Life Cycle Management -- Part 6: Systems and Software Integration
ISO/IEC/IEEE P24748-6/CD2, September 2021 ISO/IEC/IEEE Draft Standard - Systems and Software Engineering -- Life Cycle Management -- Part 6: Systems and Software Integration
ISO/IEC/IEEE P24748-6/FDIS, March 2023 ISO/IEC/IEEE Draft Standard - Systems and Software Engineering -- Life Cycle Management -- Part 6: Systems and Software Integration
IEEE/ISO/IEC P24748-6 ISO/IEC/IEEE Draft Standard - Systems and Software Engineering -- Life Cycle Management -- Part 6: Systems and Software Integration
ISO/IEC/IEEE P24748-6/DIS, May 2022 ISO/IEC/IEEE Draft Standard - Systems and Software Engineering -- Life Cycle Management -- Part 6: Systems and Software Integration
IEEE P2411 IEEE Draft Human Factors Engineering Guide for the Validation of System Designs and Integrated Systems Operations at Nuclear Facilities
IEEE P2660_1/D2, June 2020 IEEE Draft Recommended Practices on Industrial Agents: Integration of Software Agents and Low Level Automation Functions
IEEE P2660.1/D1, May 2020 IEEE Draft Recommended Practices on Industrial Agents: Integration of Software Agents and Low Level Automation Functions
IEEE P2048.101/D5.0, July 2023 IEEE Draft Standard for Augmented Reality on Mobile Devices: General Requirements for Software Framework, Components, and Integration
IEEE P2048.101/D4.0, January 2023 IEEE Draft Standard for Augmented Reality on Mobile Devices: General Requirements for Software Framework, Components, and Integration
IEEE P1685/D1, April 2022 IEEE Draft Standard for IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows
IEEE P1685/D4, February 2014 IEEE Draft Standard for IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows
IEEE P2411/D2, April 2021 IEEE Approved Draft Human Factors Engineering Guide for the Validation of System Designs and Integrated Systems Operations at Nuclear Facilities
IEEE P2660.1/D3, July 2020 IEEE Approved Draft Recommended Practices on Industrial Agents: Integration of Software Agents and Low Level Automation Functions
IEEE P1685/D2, July 2022 IEEE Approved Draft Standard for IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows
IEEE P1685/D5, April 2014 IEEE Approved Draft Standard for IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows
IEEE P1636/D7, September 2017 IEEE Draft Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA)
IEEE P1636/D6, July 2017 IEEE Draft Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA)
IEEE Unapproved Draft Std P1636/D1.6, Mar 2008 IEEE Draft Trial-Use Standard for Software Interface for Maintenance Information Collection and Analysis

PT-IPQ, Herborist Ingredients

PL-PKN, Herborist Ingredients

PN T01610-1972 Integra ted circuits Classification
PN T01305-1992 Semiconductor devices. Integrated circuits. Sectional specificatiion for semiconductor integrated circuits excluding hybrid circuits

European Standard for Electrical and Electronic Components, Herborist Ingredients

EN 163100:1991 Sectional specification: film and hybrid integrated circuits

Korean Agency for Technology and Standards (KATS), Herborist Ingredients

KS C IEC 63011-1:2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C IEC 60748-4:2004 Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-3:2002 Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-2:2001 Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-2-2001(2021) Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-2-2001(2016) Semiconductor devices－integrated circuits－Part 2：Digital integrated circuits
KS C IEC 60748-4-2004(2020) Semiconductor devices－Integrated circuits－Part 4：Interface integrated circuits
KS C IEC 60748-3-2002(2017) Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-3-2002(2022) Semiconductor devices－Integrated circuits Part 3：Analogue integrated circuits
KS C IEC 60748-2-20:2002 Semiconductor devices－Integrated circuits－Part 2－20：Digital integrated circuits－Family specification－Low voltage integrated circuits
KS C IEC 60748-2-20:2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
KS C IEC 60748-5:2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5:2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-20:2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-1:2003 Semiconductor devices－Integrated circuits－Part 20：Generic specification for film integrated circuits and hybrid film integrated circuits－Section 1：Requirements for internal visual examination
KS C IEC 60748-20:2003 Semiconductor devices－Integrated circuits－Part 20：Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-5:2003 Semiconductor devices－Integrated circuits－Part 5：Semicustom integrated circuits
KS C IEC 60748-3-1:2002 Semiconductor devices－Integrated circuits－Part 3：Analogue integrated circuits－Section 1：Blank detail specification for monolithic integrated operational amplifiers
KS C IEC 60748-2-8:2002 Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 8：Blank detail specification for integrated circuits static read/write memories
KS C IEC 60748-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20:2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-3-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 3：Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
KS C IEC 60748-2-7:2002 Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 7：Blank detail specification for integrated circuits fusible－link programmable bipolar read－only memories
KS B ISO 18876-2:2004 Industrial automation systems and integration－Integration of industrial data for exchange, access and sharing－Part 2：Integration and mapping methodology
KS B ISO 18876-2-2004(2020) Industrial automation systems and integration - Integration of industrial data for exchange, access and sharing - Part 2: Integration and mapping methodology
KS C IEC 60748-2-6-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 6：Blank detail specification for microprocessor integrated circuits
KS C IEC 60748-2-6-2002(2017) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 6：Blank detail specification for microprocessor integrated circuits
KS C IEC 60748-2-6:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits Section 6:Blank detail specification for microprocessor integrated circuits
KS C IEC 60748-3-1-2002(2017) Semiconductor devices－Integrated circuits－Part 3：Analogue integrated circuits－Section 1：Blank detail specification for monolithic integrated operational amplifiers
KS C IEC 60748-3-1-2002(2022) Semiconductor devices－Integrated circuits－Part 3：Analogue integrated circuits－Section 1：Blank detail specification for monolithic integrated operational amplifiers
KS B ISO 10303-54-2011(2016) Industrial automation systems and integration－Product data representation and exchange－Part 54：Integrated generic resource：Classification and set theory
KS B ISO 10303-54-2011(2021) Industrial automation systems and integration－Product data representation and exchange－Part 54：Integrated generic resource：Classification and set theory
KS C IEC 60748-2-3:2002 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 3:Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
KS C IEC 60748-2-4-2002(2017) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 4：Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
KS C IEC 60748-2-10:2001 Semiconductor integrated circuits－Part 2：Digital integrated circuits Section 10－Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
KS C IEC 60748-2-8-2002(2017) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 8：Blank detail specification for integrated circuits static read/write memories
KS C IEC 60748-2-8-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 8：Blank detail specification for integrated circuits static read/write memories
KS C IEC 60748-11:2004 Semiconductor devices－Integrated circuits－Part 11：Sectional specification for semiconductor integrated circuits excluding hybrid circuits
KS C IEC 60748-2-2:2003 Semiconductor devices-Integrated circuits-Part 2:Digital integrated circuits-Section 2:Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
KS C IEC 60748-2-2-2003(2019) Semiconductor devices — Integrated circuits — Part 2: Digital integrated circuits — Section 2: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
KS C IEC 60748-2-12-2002(2017) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 12：Digital integrated circuits－Blank detail specification for programmable logic devices(PLDs)
KS B ISO 11807-2-2017(2022) Integrated optics — Vocabulary — Part 2: Terms used in classification
KS C IEC 60748-20-1-2003(2019) Semiconductor devices — Integrated circuits — Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits — Section 1: Requirements for internal visual examination
KS C IEC 60748-2-5-2002(2017) Semiconductor devices－Integrated circuits Part 2：Digital integrated circuits Section 5－Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
KS C IEC 60748-2-12-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 12：Digital integrated circuits－Blank detail specification for programmable logic devices(PLDs)
KS C IEC 60748-2-4-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 4：Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
KS B ISO 11807-2:2007 Integrated optics－Vocabulary－Part 2：Terms used in classification
KS C IEC 60748-11:2020 Semiconductor devices — Integrated circuits — Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
KS C IEC 60748-2-1:2001 Semiconductor integrated circuits－Part 2：Digital integrated circuits Section One：Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
KS C IEC 60748-2-5-2002(2022) Semiconductor devices－Integrated circuits Part 2：Digital integrated circuits Section 5－Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
KS C IEC 60748-2-11-2002(2017) Semiconductor devices－Integrated circuits－Part 2－11：Digital integrated circuits－Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read－only memory
KS C IEC 60748-2-7-2002(2022) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 7：Blank detail specification for integrated circuits fusible－link programmable bipolar read－only memories
KS B ISO 10303-104:2004 Industrial automation systems and integration－Product data representation and exchange－Part 104：Integrated application resource：Finite element analysis
KS B ISO 10303-104-2004(2020) Industrial automation systems and integration－Product data representation and exchange－Part 104：Integrated application resource：Finite element analysis
KS C IEC 60748-2-11:2002 Semiconductor devices－Integrated circuits－Part 2－11：Digital integrated circuits－Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read－only memory
KS B ISO 15745-1:2004 Industrial automation systems and integration-Open systems application integration framework-Part 1:Generic reference description
KS X ISO 15745-1:2015 Industrial automation systems and integration — Open systems application integration framework — Part 1: Generic reference description
KS C IEC 63011-2:2022 Integrated circuits — Three dimensional integrated circuits —Part 2: Alignment of stacked dies having fine pitch interconnect
KS X ISO 15745-1-2015(2020) Industrial automation systems and integration — Open systems application integration framework — Part 1: Generic reference description
KS B ISO 15745-1:2013 Industrial automation systems and integration－Open systems application integration framework－Part 1：Generic reference description
KS B ISO 15745-1-2004(2009) Industrial automation systems and integration－Open systems application integration framework－Part 1：Generic reference description
KS C IEC 60748-2-5:2002 Semiconductor devices－Integrated circuits Part 2：Digital integrated circuits Section 5－Blank detail specification for complementary MOS digital integrated circuits(series 4 000B and 4 000UB)
KS C IEC 60748-2-4:2002 Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 4：Family specification for complementary MOS digital integrated circuits, series 4 000 B and 4 000 UB
KS C IEC 60748-2-11-2002(2022) Semiconductor devices－Integrated circuits－Part 2－11：Digital integrated circuits－Blank detail specification for single supply integrated circuit,electrically erasable, and programmable read－only memory
KS C IEC 60748-2-10-2001(2021) Semiconductor integrated circuits－Part 2：Digital integrated circuits Section 10－Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
KS C IEC 60748-2-10-2001(2016) Semiconductor integrated circuits－Part 2：Digital integrated circuits Section 10－Blank detail specification for integrated circuit dynamic read/write memories(excluding uncommitted logic arrays)
KS C IEC 60748-2-7-2002(2017) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits Section 7：Blank detail specification for integrated circuits fusible－link programmable bipolar read－only memories
KS C IEC 60748-2-1-2001(2021) Semiconductor integrated circuits－Part 2：Digital integrated circuits Section One：Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
KS C IEC 60748-2-1-2001(2016) Semiconductor integrated circuits－Part 2：Digital integrated circuits Section One：Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
KS C IEC 60748-2-3-2002(2017) Semiconductor devices－Integrated circuits－Part 2：Digital integrated circuits－Section 3：Blank detail specification for HCMOS digital integrated circuits(series 54/74 HC, 54/74 HCT, 54/74 HCU)
KS B ISO 10303-101:2015 Industrial automation systems and integration — Product data representation and exchange — Part 101: Integrated application resource: Draughting
KS B ISO 10303-101:2005 Industrial automation systems and integration-Product data representation and exchange-Part 101:Integrated application resources:Draughting
KS B ISO 10303-54:2011 Industrial automation systems and integration－Product data representation and exchange－Part 54：Integrated generic resource：Classification and set theory
KS B ISO 10303-105:2005 Industrial automation systems and integration－Product data representation and exchange－Part 105：Integrated application resource：Kinematics
KS B ISO 10303-105-2005(2020) Industrial automation systems and integration－Product data representation and exchange－Part 105：Integrated application resource：Kinematics
KS C IEC 60748-1:2002 Semiconductor devices－Integrated circuits－Part 1：General

KR-KS, Herborist Ingredients

KS C IEC 63011-1-2022 Integrated circuits — Three dimensional integrated circuits — Part 1: Terminology
KS C IEC 60748-2-20-2021 Semiconductor devices — Integrated circuits — Part 2-20: Digital integrated circuits — Family specification — Low voltage integrated circuits
KS C IEC 60748-5-2021 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-5-2019 Semiconductor devices — Integrated circuits —Part 5: Semicustom integrated circuits
KS C IEC 60748-20-2021 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-2-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-20-2019 Semiconductor devices — Integrated circuits —Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
KS C IEC 60748-11-2020 Semiconductor devices — Integrated circuits — Part 11:Sectional specification for semiconductor integrated circuits excluding hybrid circuits
KS C IEC 63011-2-2022 Integrated circuits — Three dimensional integrated circuits —Part 2: Alignment of stacked dies having fine pitch interconnect

International Electrotechnical Commission (IEC), Herborist Ingredients

IEC 63011-1:2018 Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology
IEC 60748-2-20:2000 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits; Family specifications: Low voltage integrated circuits
IEC 60748-20:1988 Semiconductor devices - Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
IEC 60748-2:1997 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
IEC 60748-3:1986 Semiconductor devices. Integrated circuits.. Part 3 : Analogue integrated circuits
IEC 60748-4:1987 Semiconductor devices - Intergrated circuits.. Part 4: Interface integrated circuits.
IEC 60748-2-20:2008 Semicondutor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits
IEC 60748-5:1997 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits
IEC 60748-21:1997 Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
IEC 60748-3:1986/AMD2:1994 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
IEC 60748-3:1986/AMD1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 1
IEC 60748-2-11:1999 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
IEC 60748-20:1988/AMD1:1995 Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
IEC 60748-3/AMD2/COR1:1996 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
IEC 60748-2-6:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section six: blank detail specification for microprocessor integrated circuits
IEC 60748-2/AMD1:1991 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; amendment 1
IEC 60748-4/AMD1:1991 Semiconductor devices; intergrated circuits; part 4: interface integrated circuits; amendment 1
IEC 60748-2-4:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section four: family specification for complementary MOS digital integrated circuits; series 4000 B and 4000 UB
IEC 62264-2:2013 Enterprise-control system integration - Part 2: Object and attributes for enterprise-control sytem integration
IEC 60748-20-1:1994 Semiconductor devices; integrated circuits; part 20: generic specification for film integrated circuits and hybrid film integrated circuits; section 1: requirements for internal visual examination
IEC 60748-3-1:1991 Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; section 1: blank detail specification for monolithic integrated operational amplifiers
IEC 60748-2-10:1994 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 10: Blank detail specification for integrated circuit dynamic read/write memories
IEC 60748-11:1990 Semiconductor devices; integrated circuits; part 11: sectional specification for semiconductor integrated circuits excluding hybrid circuits
IEC 60748-2-5:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section five: blank detail specification for complementary MOS digital integrated circuits; series 4000 B and 4000 UB
IEC 60748-2-2:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 2: familiy specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU
IEC 60748-2-7:1992 Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
IEC 63011-3:2018 Integrated circuits - Three dimensional integrated circuits - Part 3: Model and measurement conditions of through-silicon via
IEC 60748-2-1:1991 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 1: blank detail specification for bipolar monolithic digital integrated circuits gates (excluding uncommitted logic arrays)
IEC 60748-2-3:1992 Semiconductor devices; integrated circuits; part 2: digital integrated circuits; section 3: blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)
IEC 60748-3:1986/AMD2:1994/COR1:1996 Corrigendum 1 to Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
IEC 62769-1:2021 Field Device Integration (FDI) - Part 1: Overview
IEC 62769-1:2015 Field device integration (FDI) - Part 1: Overview
IEC 62769-4:2023 RLV Field Device Integration (FDI？) - Part 4: FDI Packages
IEC 62769-1:2021 RLV Field Device Integration (FDI) - Part 1: Overview
IEC 62769-103-4:2023 RLV Field Device Integration (FDI)？ - Part 103-4: PROFINET
IEC 62769-1:2023 RLV Field Device Integration (FDI？) - Part 1: Overview
IEC 62769-4:2015 Field Device Integration (FDI) - Part 4: FDI Packages
IEC 62769-4:2023 Field Device Integration (FDI？) - Part 4: FDI Packages
IEC 62769-1:2023 Field Device Integration (FDI？) - Part 1: Overview
IEC 62769-103-4:2023 Field Device Integration (FDI)？ - Part 103-4: PROFINET
IEC 63011-2:2018 Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
IEC 60748-11:1990/AMD2:1999 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 2
IEC 62769-4:2021 Field Device Integration (FDI) - Part 4: FDI Packages
IEC 62769-3:2021 Field device integration (FDI) - Part 3: Server
IEC 62769-2:2023 RLV Field Device Integration (FDI？) - Part 2: Client
IEC 62769-3:2023 RLV Field Device Integration (FDI？) - Part 3: Server
IEC 62769-4:2021 RLV Field Device Integration (FDI) - Part 4: FDI Packages
IEC 62769-3:2021 RLV Field Device Integration (FDI) - Part 3: Server
IEC 62769-3:2023 Field Device Integration (FDI？) - Part 3: Server
IEC 62769-2:2023 Field Device Integration (FDI？) - Part 2: Client
IEC 60748-22-1:1991 Semiconductor devices; integrated cirucits; part 22: section 1: blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
IEC 60748-11:1990/AMD1:1995 Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
IEC 60748-2-2:1992/AMD1:1994 Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54
IEC 62769-7:2021 Field Device Integration (FDI) - Part 7: Communication Devices
IEC 62769-5:2021 Field device integration (FDI) - Part 5: Information Model
IEC 60748-1:1984 Semiconductor devices. Integrated circuits.. Part 1 : General
IEC 62769-6:2021 Field Device Integration (FDI) - Part 6: Technology Mapping
IEC 62769-3:2015 Field Device Integration (FDI) - Part 3: FDI Server
IEC 62769-2:2021 RLV Field Device Integration (FDI) - Part 2: FDI Client
IEC 62769-103-4:2020 RLV Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET
IEC 62769-7:2021 RLV Field Device Integration (FDI) - Part 7: Communication Devices
IEC 62769-6:2021 RLV Field Device Integration (FDI) - Part 6: Technology Mapping
IEC 62769-7:2023 RLV Field Device Integration (FDI？) - Part 7: Communication Devices
IEC 62769-5:2021 RLV Field Device Integration (FDI) - Part 5: Information Model
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General

Inner Mongolia Provincial Standard of the People's Republic of China, Herborist Ingredients

DB15/T 1960.2-2020 Grass Industry Data Specification Part 2: Base Code Set for Forage Grass
DB15/T 2021.4-2020 Prairie Big Data Part 4: Code Sets
DB15/T 2590.2-2022 Specifications for Description and Data Collection of Ranunculaceae Grass Germplasm Resources Part 2: Aconitum Aconitum

BR-ABNT, Herborist Ingredients

ABNT MB-7-1939

General Administration of Quality Supervision, Inspection and Quarantine of the People‘s Republic of China, Herborist Ingredients

GB/T 17574.20-2006 Semiconductor devices Integrated circuits Part 2-20: Digital integrated circuits Family specification Low voltage integrated circuits
GB/T 17574-1998 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
GB/T 17940-2000 Semiconductor devices Integrated circuits Part 3:Analogue integrated circuits
GB/T 20515-2006 Semiconductor devices. Integrated circuits. Part 5: Semicustom integrated circuits
GB/T 11498-1989 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedure
GB/T 16465-1996 Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
GB/T 17574.10-2003 Semiconductor devices-Integrated circuits-Part 2-10:Digital integrated circuits-Blank detail specification for integrated circuit dynamic read/write memories
GB/T 17572-1998 Semiconductor devices--Integrated circuits. Part 2: Digital integrated circuits. Section four--Family specification for complementary MOS digital integrated circuits, series 4000B and 4000UB
GB/T 16656.54-2010 Industrial automation systems and integration.Product data representation and exchange.Part 54:Integrated generic resource:Classification and set theory
GB/T 41771.4-2022 Field device integration—Part 4： Packages
GB/T 43035-2023 Semiconductor Device Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements
GB/T 12750-2006 Semiconductor devices. Integrated circuits. Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
GB/T 17023-1997 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section two-Family specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74HCU
GB/T 9424-1998 Semiconductor devices lntegrated circuits Part 2: Digital integrated circuits Section five--Blank detail specification for complementary MOS digital integrated circuits, series 4000B and 4000UB
GB/T 41771.1-2022 Field device integration—Part 1: overview
GB/T 17024-1997 Semiconductor devices. Integrated circuits--Part 2: Digital integrated circuits. Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC, 54/74HCT, 54/74HCU
GB/T 41771.3-2022 Field device integration—Part 3: Server
GB/T 41771.2-2022 Field device integration—Part 2: Client
GB/T 17574.11-2006 Semiconductor devices Integrated circuits Part 2-11: Digital integrated circuits Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory
GB/T 25241.1-2010 Rules for tobacco intensive seeding production.Part 1:Seedling with float system
GB/T 25241.2-2010 Rules for tobacco intensive seedling production.Part 2:Seedling in tray
GB/T 25241.3-2010 Rules for tobacco intensive seedling production.Part 3:Seedling with sand culture
GB/T 41771.5-2022 Field device integration—Part 5：Information model
GB/T 16656.101-1998 Industrial automation systems and integration--Product data representation and exchange--Part 101: Integrated application resources: draughting
GB/T 16656.45-2001 Industrial automation systems and integration Product data representation and exchange Part 45: Integrated generic resource: Materials
GB/T 16656.101-2010 Industrial automation systems and integration.Product data representation and exchange.Part 101:Integrated application resources:Draughting
GB/T 16656.56-2010 Industrial automation systems and integration.Product data representation and exchange.Part 56:Integrated generic resource:State
GB/T 19659.1-2005 Industrial automation systems and integration-Open systems application integration framework-Part 1:Generic reference description
GB/T 18975.13-2023 Industrial Automation Systems and Integrated Process Plants (Including Oil and Gas Production Facilities) Life Cycle Data Integration Part 13: Integrated Asset Planning Life Cycle
GB/T 16656.105-2010 Industrial automation systems and integration.Product data representation and exchange.Part 105:Integrated application resource:Kinematics
GB/T 16656.105-1999 Industrial automation systems and integration--Product data representation and exchange--Part 105:Integrated application resource:kinematics

CZ-CSN, Herborist Ingredients

CSN IEC 748-3:1994 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
CSN IEC 748-2:1994 Semiconductor devices.Integrated circuits.Part 2:Digital integrated circuits
CSN IEC 748-4:1994 Semiconductor devices.Integrated circuits.Part 4:Interface integrated circuits
CSN IEC 748-20:1993 Semiductors devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
CSN IEC 748-1:1993 Semiconductor devices. Integrated circuits. Part 1: General

RO-ASRO, Herborist Ingredients

SR CEI 748-3+A1-1991 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
STAS SR CEI 748-2/A1-1994 DISPOZITIVE CU SEMICONDUCTOARE Circuite integrate. Partea 2: Circuite integrate digitale

Danish Standards Foundation, Herborist Ingredients

DS/IEC 748-2:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits
DS/IEC 748-3:1993 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
DS/IEC 748-4:1993 Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits
DS/IEC 748-3+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 3: analogue integrated circuits
DS/IEC 748-4+Amd.1:1993 Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits
DS/IEC 748-20:1990 Semiconductor devices. Intergrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film intergrated circuits
DS/IEC 748-21:1993 Semiconductor devices. Integrated circuits. Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure
DS/IEC 748-2-6:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section six: Blank detail specification for microprocessor integrated circuits
DS/IEC 748-3-1:1993 Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits. Section one: Blank detail specification for monolithic integrated operational amplifiers
DS 434.1:1989 Lightweight aggregate concrete components. Determination of moisture content
DS/IEC 748-11/A1,2:2001 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
DS/EN IEC 62769-1:2021 Field Device Integration (FDI) – Part 1: Overview
DS/EN IEC 62769-4:2021 Field Device Integration (FDI) – Part 4: FDI Packages
DS/EN IEC 62769-3:2021 Field Device Integration (FDI) – Part 3: Server
DS/IEC 748-2-1:1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Section one: Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)
DS/IEC 748-21-1:1993 Semiconductor devices. Integrated circuits. Part 21: Secdtion one: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure
DS/IEC 748-22-1:1993 Semiconductor devices. Integrated circuits. Part 22: Secdtion one: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
DS/ISO 15745-1:2004 Industrial automation systems and integration - Open systems application integration framework - Part 1: Generic reference description
DS/EN IEC 62769-5:2021 Field Device Integration (FDI) – Part 5: Information Model
DS/EN IEC 62769-2:2021 Field Device Integration (FDI) – Part 2: FDI Client
DS/EN IEC 62769-7:2021 Field Device Integration (FDI) – Part 7: Communication devices
DS/EN IEC 62769-6:2021 Field Device Integration (FDI) – Part 6: Technology Mapping

Association Francaise de Normalisation, Herborist Ingredients

NF C96-042:1989 Semiconductor Devices Integrated circuits Part 2:Digital integrated circuits
NF C86-200*NF EN 190100:2013 Sectional specification : digital monolithic integrated circuits
NF C46-068-2*NF EN 62264-2:2014 Enterprise-control system integration - Part 2 : objects and attributes for enterprise-control system integration
NF EN 165000-3:1996 Circuits intégrés à couches et hybrides - Partie 3 : liste d'auto-vérification et rapport pour les fabricants de circuits intégrés à couches et hybrides
NF EN 62264-2:2014 Intégration des systèmes entreprise-contrôle - Partie 2 : objets et attributs pour l'intégration des systèmes de commande d'entreprise
NF C96-045:1992 Semiconductors devices. Integrated circuits. Part 11 : sectional specification for semiconducteur integrated circuits excluding hybrid circuits
NF C86-410*NF EN 163100:1991 Sectional Specification : film and hybrid integrated circuits
NF C46-068-4*NF EN 62264-4:2016 Enterprise-control system integration - Part 4 : objects model attributes for manufacturing operations management integration
NF EN 62264-4:2016 Intégration des systèmes entreprise-contrôle - Partie 4 : attributs des modèles d'objets pour l'intégration de la gestion des opérations de fabrication
NF EN IEC 62878-1:2019 Techniques d'assemblage avec appareil(s) integré(s) - Partie 1 : spécification générique pour substrats avec appareil(s) intégré(s)
NF S10-130-2:2005 Integrated optics - Vocabulary - Part 2 : terms used in classification.
NF C46-769-4*NF EN 62769-4:2015 Field device integration (FDI) - Part 4 : FDI packages
NF C46-769-1*NF EN 62769-1:2015 Field device integration (FDI) - Part 1 : overview
NF C46-769-1*NF EN IEC 62769-1:2021 Field Device Integration (FDI) - Part 1 : overview
NF C46-769-4*NF EN IEC 62769-4:2021 Field Device Integration (FDI) - Part 4 : FDI Packages
NF EN 163100:1991 Spécification intermédiaire : circuits intégrés hybride et à couches
NF EN IEC 62769-1:2021 Intégration des appareils de terrain (FDI) - Partie 1 : vue d'ensemble
NF P18-622-11*NF EN 933-11:2009 Tests for geometrical properties of aggregates - Part 11 : classification test for the constituents of coarse recycled aggregate.
NF EN IEC 62769-2:2023 Intégration des appareils de terrain (FDI) - Partie 2 : client FDI
NF C96-005:1994 Discrete devices and integrated circuits. Part 5 : optoelectronic devices.
NF EN 165000-5:2015 Circuits intégrés à couches et hybrides - Partie 5 : procédure d'homologation
NF EN ISO 11807-2:2021 Optique intégrée - Vocabulaire - Partie 2 : termes utilisés pour la classification
NF C46-769-2*NF EN 62769-2:2015 Field device integration (FDI) - Part 2 : FDI client
NF C46-769-6*NF EN IEC 62769-6:2021 Field Device Integration (FDI) - Part 6 : technology Mapping
NF C46-769-2*NF EN IEC 62769-2:2021 Field Device Integration (FDI) - Part 2 : FDI Client
NF C46-769-3*NF EN 62769-3:2015 Field device integration (FDI) - Part 3 : FDI server
NF C46-769-3*NF EN IEC 62769-3:2021 Field Device Integration (FDI) - Part 3 : FDI Server
NF C46-769-5*NF EN IEC 62769-5:2021 Field Device Integration (FDI) - Part 5 : information Model
NF C96-041/A1:1991 Semiconductor Devices Integrated circuits Part 1:General

Professional Standard - Electron, Herborist Ingredients

SJ/Z 11359-2006 Taxonomy of functional verification for integrated circuit IP core development and integration
SJ/Z 11358-2006 Integrated circuit IP core model taxonomy
SJ/T 9534-1993 Grading standard of quality for semiconductor integrated circuits

CU-NC, Herborist Ingredients

NC 29-10-1985 Plague Killers. Bentiocarb. Determination of Active Ingredient
NC 29-06-1985 Plague Killers. "Diuron". Determination of Active Ingredient

RU-GOST R, Herborist Ingredients

GOST 29108-1991 Semiconductor devices. Integrated circuits. Part 3. Analog integrated circuits
GOST 29107-1991 Semiconductor devices. Integrated circuits. Part 2. Digital integrated circuits
GOST 29109-1991 Semiconductor devices. Integrated circuits. Part 4. Interface integrated circuits
GOST R ISO 18435-3-2016 Industrial automation systems and integration. Diagnostics, capability assessment and maintenance applications integration. Part 3. Applications integration description method
GOST R 55345-2012 Industrial automation systems and integration. Integration of industrial data for exchange, access and sharing. Part 2. Integration and mapping methodology
PNST 172-2016 Enterprise-control system integration. Part 4. Objects and attributes for manufacturing operations management integration
GOST R IEC 62264-2-2016 Enterprise-control system integration. Part 2. Object and attributes for enterprise-control system integration
GOST R ISO 10303-53-2015 Industrial automation systems and integration. Product data representation and exchange. Part 53. Integrated generic resource. Numerical analysis
GOST R ISO 15745-1-2010 Industrial automation systems and integration. Open systems application integration framework. Part 1. Generic reference description
GOST R ISO 15745-1-2014 Industrial automation systems and integration. Open systems application integration framework. Part 1. Generic reference description
GOST R ISO 10303-45-2000 Industrial automation systems and inregration. Product data representation and exchange. Part 45. Integrated generic resource. Materials
GOST R 56271-2014 Industrial automation systems and integration. Integration of life-cycle data for process plants including oil and gas production facilities. Part 7. Implementation methods for the integration of distributed systems. Template methodology
GOST R ISO 10303-58-2015 Industrial automation systems and integration. Product data representation and exchange. Part 58. Integrated generic resource. Risk
GOST R ISO 10303-54-2011 Industrial automation systems and integration. Product data representation and exchange. Part 54. Integrated generic resources. Classification and set theory
GOST R ISO 10303-56-2015 Industrial automation systems and integration. Product data representation and exchange. Part 56. Integrated generic resource. State
GOST R 59703-2021 Monolithic microwave integrated circuits. Classification and system of designations

国家市场监督管理总局、中国国家标准化管理委员会, Herborist Ingredients

GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
GB/T 20720.2-2020 Enterprise-control system integration—Part 2: Objects and attributes for enterprise-control system integration
GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1：Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
GB/T 20720.4-2021 Enterprise-control system integration—Part 4: Object model attributes for manufacturing operations management integration
GB/T 38002.1-2019 Automation system and integration—Serial real time communication system for manufacturing integration—Part 1:General overview and architecture

US-FCR, Herborist Ingredients

FCR NAV GSH 2.7 REVISION 1-1970 TOPSOILING, FINISHED GRADING, SEEDING AND SODDING
FCR COE 2.7 REVISION 1-1970 TOPSOILING, FINISHED GRADING, SEEDING AND SODDING
FCR NAV GSH 2.7-1966 TOPSOILING, FINISHED GRADING, SEEDING AND SODDING
FCR COE 2.7-1966 TOPSOILING, FINISHED GRADING, SEEDING AND SODDING
FCR AF M85-25 SEC 2.7-1966 TOPSOILING, FINISHED GRADING, SEEDING AND SODDING

IN-BIS, Herborist Ingredients

IS 12970 Pt.2/Sec.2-1992
IS 5001 Pt.2-1973
IS 12970 Pt.2/Sec.3-1993 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Essential rating and characteristics. Section 3: Integrated circuit microprocessors
IS 12970 Pt.3/Sec.1-1992
IS 12970 Pt.6/Sec.1-1992
IS 12970 Pt.6/Sec.3-1992
IS 12970 Pt.3/Sec.3-1993
IS 12970 Pt.3/Sec.2-1992 Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits. Measuring methods. Section 2: Static characteristics
IS 12970 Pt.6/Sec.2-1992
IS 12970 Pt.2/Sec.1-1992

International Organization for Standardization (ISO), Herborist Ingredients

ISO/TS 10303-1792:2022 Industrial automation systems and integration — Product data representation and exchange — Part 1792: Application module: Sketch
ISO/TS 10303-1792:2018 Industrial automation systems and integration — Product data representation and exchange — Part 1792: Application module: Sketch
ISO 18435-3:2015 Industrial automation systems and integration - Diagnostics, capability assessment and maintenance applications integration - Part 3: Applications integration description method
ISO/TS 18876-2:2003 Industrial automation systems and integration - Integration of industrial data for exchange, access and sharing - Part 2: Integration and mapping methodology
IEC 62264-2:2015 Enterprise-control system integration — Part 2: Objects and attributes for enterprise-control system integration
IEC 62264-4:2015 Enterprise-control system integration — Part 2: Objects and attributes for enterprise-control system integration
ISO 11807-2:2001 Integrated optics - Vocabulary - Part 2: Terms used in classification
ISO 11807-2:2021 Integrated optics - Vocabulary - Part 2: Terms used in classification
ISO/CD TR 23797 Intelligent transport systems — Mobility integration — Gap and overlap analysis of ISO/TC 204 work programme for mobility integration
ISO 23218-2:2022 Industrial automation systems and integration — Numerical control systems for machine tools — Part 2: Requirements for numerical control system integration
ISO 10303-53:2011 Industrial automation systems and integration - Product data representation and exchange - Part 53: Integrated generic resource: Numerical analysis
ISO 10303-104:2000 Industrial automation systems and integration - Product data representation and exchange - Part 104: Integrated application resource: Finite element analysis
ISO 15745-1:2003 Industrial automation systems and integration - Open systems application integration framework - Part 1: Generic reference description
ISO 15926-13:2018 Industrial automation systems and integration - Integration of life-cycle data for process plants including oil and gas production facilities - Part 13: Integrated asset planning life-cycle
ISO/TS 10303-1675:2006 Industrial automation systems and integration - Product data representation and exchange - Part 1675: Application module: Functional decomposition to assembly design
ISO 10303-58:2011 Industrial automation systems and integration - Product data representation and exchange - Part 58: Integrated generic resource: Risk
ISO 10303-101:2011 Industrial automation systems and integration - Product data representation and exchange - Part 101: Integrated application resource: Draughting
ISO 10303-101:2014 Industrial automation systems and integration - Product data representation and exchange - Part 101: Integrated application resource: Draughting
ISO 10303-56:2005 Industrial automation systems and integration - Product data representation and exchange - Part 56: Integrated generic resource: State
ISO 10303-45:1998 Industrial automation systems and integration - Product data representation and exchange - Part 45: Integrated generic resource: Materials
ISO 10303-101:1994 Industrial Automation Systems and Integration - Product Data Representation and Exchange - Part 101: Intergrated Application Resources: Draughting (First Edition; Corrigendum 1: 04/15/1999)
ISO 10303-101:2022 Industrial automation systems and integration — Product data representation and exchange — Part 101: Integrated application resource: Draughting
ISO 10303-56:2019 Industrial automation systems and integration — Product data representation and exchange — Part 56: Integrated general resource: State
ISO 10303-101:2019 Industrial automation systems and integration — Product data representation and exchange — Part 101: Integrated application resource: Draughting
ISO 10303-101:2018 Industrial automation systems and integration — Product data representation and exchange — Part 101: Integrated application resource: Draughting
ISO/TS 10303-1315:2010 Industrial automation systems and integration - Product data representation and exchange - Part 1315: Application module: Mechanical design presentation representation with draughting
ISO 10303-54:2005 Industrial automation systems and integration - Product data representation and exchange - Part 54: Integrated generic resource: Classification and set theory
ISO 10303-105:2014 Industrial automation systems and integration - Product data representation and exchange - Part 105: Integrated application resource: Kinematics
ISO 10303-105:1996 Industrial Automation Systems and Integration - Product Data Representation and Exchange - Part 105: Integrated Application Resource: Kinematics (First Edition; Technical Corrigendum 1:03/01/2000; Technical Corrigendum 2: 10/15/2000)

European Committee for Electrotechnical Standardization（CENELEC）, Herborist Ingredients

EN 165000-5:1997 Film and Hybrid Integrated Circuits Part 5: Procedure for Qualification Approval
EN 165000-3:1996 Film and Hybrid Integrated Circuits Part 3: Self-Audit Checklist and Report for Film and Hybrid Integrated Circuit Manufacturers
EN 165000-1:1996 Film and Hybrid Integrated Circuits Part 1: Generic Specification Capability Approval Procedure
EN 62264-2:2013 Enterprise-control system integration - Part 2: Objects and attributes for enterprise-control system integration
EN 190100:1993 Sectional Specification: Digital Monolithic Integrated Circuits
EN 165000-2:1996 Film and Hybrid Integrated Circuits Part 2: Internal Visual Inspection and Special Tests
EN 62264-4:2016 Enterprise-control system integration - Part 4: Object model attributes for manufacturing operations management integration
EN IEC 62769-4:2021 Field Device Integration (FDI) - Part 4: FDI Packages
EN 62769-4:2015 Field Device Integration (FDI) - Part 4: FDI Packages
EN 62769-1:2015 Field device integration (FDI) - Part 1: Overview
EN 62769-3:2015 Field Device Integration - Part 3: FDI Server
EN IEC 62769-2:2021 Field Device Integration (FDI) - Part 2: FDI Client
EN 62769-2:2015 Field Device Integration (FDI) - Part 2: FDI Client

Japanese Industrial Standards Committee (JISC), Herborist Ingredients

JIS X 6319-1:2005 Specification of implementation for integrated circuit(s) cards -- Part 1: Integrated circuit(s) cards with contacts
JIS X 6319-1:2010 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts
JIS X 6319-1:2023 Specification of implementation for integrated circuit cards -- Part 1: Integrated circuit cards with contacts
JIS B 3700-45:1999 Industrial automation systems and integration -- Product data representation and exchange -- Part 45: Integrated generic resource: Materials
JIS X 6320-2:2009 Identification cards -- Integrated circuit cards -- Part 2: Cards with contacts -- Dimensions and location of the contacts

Hebei Provincial Standard of the People's Republic of China, Herborist Ingredients

DB13/T 5552.4-2022 Government service "one window (network) integration office" work specification part 4: integrated approval
DB13/T 5552.3-2022 Government service "one window (network) integration office" work specification part 3: integration review

US-CFR-file, Herborist Ingredients

CFR 27-41.1-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.1:Importation of tobacco products, cigarette papers and tubes, and processed tobacco.
CFR 27-41.85-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.85:Release from customs custody of imported tobacco products or cigarette papers or tubes.
CFR 27-40.183-2013 Alcohol,tobacco products and firearms. Part40:Manufacture of tobacco products, cigarette papers and tubes, and processed tobacco. Section40.183:Record of tobacco products.
CFR 27-40.213-2013 Alcohol,tobacco products and firearms. Part40:Manufacture of tobacco products, cigarette papers and tubes, and processed tobacco. Section40.213:Tobacco products labeled for export.
CFR 27-41.50-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.50:Exemptions.
CFR 27-41.141-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.141:Reports.
CFR 27-41.81-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.81:Taxpayment.
CFR 27-40.233-2013 Alcohol,tobacco products and firearms. Part40:Manufacture of tobacco products, cigarette papers and tubes, and processed tobacco. Section40.233:Transfer in bond.
CFR 27-41.86-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.86:Procedure for release.
CFR 27-41.193-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.193:Corporate documents.
CFR 27-41.195-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.195:Trade name certificate.
CFR 27-41.197-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.197:Additional information.
CFR 27-41.228-2013 Alcohol,tobacco products and firearms. Part41:Importation of tobacco products, cigarette papers and tubes, and processed tobacco. Section41.228:Change in address.

Group Standards of the People's Republic of China, Herborist Ingredients

T/ZZB 2085-2021 Gravity integrated circuit handlers
T/ICMTIA BS0030-2022 IC material product classification
T/NXSCJS 069-2023 Ceramic composition data collection and naming standards
T/HPAESRCU 0001-2020 Integrated standard for complete set of gas distributed energy system
T/ICMTIA BS0029-2022 Classification and definition of IC material product maturity level
T/SPEMF 0029-2021 Technical specification for the classification of integrated box mobile house
T/SZMHA 0001-2021 Classification technical specification for integrated box-type activity room
T/CNIA 0090-2021 Waste lithium ion battery crushing and sorting integrated equipment

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会, Herborist Ingredients

GB/T 27758.3-2017 Industrial automation systems and integration—Diagnostics, capability assessment and maintenance applications integration—Part 3: Applications integration description method
GB/T 32854.2-2017 Automation systems and integration—Integration of advanced process control and optimization software for manufacturing systems—Part 2: Framework and functions

German Institute for Standardization, Herborist Ingredients

DIN EN 165000-5:1998 Film and hybrid integrated circuits - Part 5: Procedure for qualification approval; German version EN 165000-5:1997
DIN EN 190100:1995-02 Sectional specification: Digital monolithic integrated circuits; German version EN 190100:1993
DIN EN 62264-2:2014-06 Enterprise-control system integration - Part 2: Objects and attributes for enterprise-control system integration (IEC 62264-2:2013); English version EN 62264-2:2013 / Note: DIN EN 62264-2 (2008-07) remains valid alongside this standard until 2016-08-01.
DIN 41850-1:1986 Integrated film circuits; substrates
DIN EN 62264-4:2016-10 Enterprise-control system integration - Part 4: Object model attributes for manufacturing operations management integration (IEC 62264-4:2015); English version EN 62264-4:2016 / Note: Applies in conjunction with DIN EN 62264-3 (2008-01).
DIN EN ISO 11807-2:2005 Integrated optics - Vocabulary - Part 2: Terms used in classification (ISO 11807-2:2001); German version EN ISO 11807-2:2005
DIN EN IEC 62769-1:2022-09 Field Device Integration (FDI) - Part 1: Overview (IEC 62769-1:2021); English version EN IEC 62769-1:2021 / Note: DIN EN 62769-1 (2016-03) remains valid alongside this standard until 2024-03-12.
DIN EN IEC 62769-4:2022-09 Field Device Integration (FDI) - Part 4: FDI Packages (IEC 62769-4:2021); English version EN IEC 62769-4:2021 / Note: DIN EN 62769-4 (2016-03) remains valid alongside this standard until 2024-03-12.
DIN 41850-4:1976 Integrated film circuits; material, methods for judgement of thick film resistor compositions
DIN EN IEC 62769-3:2022-09 Field Device Integration (FDI) - Part 3: Server (IEC 62769-3:2021); English version EN IEC 62769-3:2021 / Note: DIN EN 62769-3 (2016-03) remains valid alongside this standard until 2024-03-12.
DIN EN 165000-3:1996 Film and hybrid integrated circuits - Part 3: Self-audit checklist and report for film and hybrid integrated circuit manufacturers; German version EN 165000-3:1996

Electronic Components, Assemblies and Materials Association, Herborist Ingredients

ECA EIA-850-2000 ECA Component Registration Integrated Passive Devices Product Registrations

SE-SIS, Herborist Ingredients

SIS SS CECC 90100-1987 Sectional specification: Digital monolithic integrated circuits
SIS SS CECC 90200-1988 Sectional specification: Analogue monolithic integrated circuits
SIS SS CECC 90300-1988 Sectional specification: Interface monolithic integrated circuits
SIS SS CECC 63100-1985 Sectional specification: Film and hybrid integrated circuits

IECQ - IEC: Quality Assessment System for Electronic Components, Herborist Ingredients

QC 760000-1988 Semiconductor Devices Integrated Circuits Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits (IEC 748-20 ED 1)
QC 760200-1992 Semiconductor Devices Integrated Circuits Part 22: Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures (IEC 748-22 ED 1)
QC 790109-1992 Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Two - Family Specification for HCMOS Digital Integrated Circuits@ Series 54/74 HC@ 54/74 HCT@ 54/74 HCU (IEC 748-2-2 ED 1)
QC 790107-1994 Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 10: Blank Detail Specification for Integrated Circuit Dynamic Read/Write Memories (IEC 748-2-10 ED 1)
QC 790100-1990 Semiconductor Devices Integrated Circuits Part 11: Sectional Specification for Semiconductor Integrated Circuits Excluding Hybrid Circuits (IEC 748-11 ED 1)
QC 760000-1990 Semiconductor Devices Integrated Circuits Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits (IEC 748-20: 1988; AMD 6754; September 1991; AMD 9331 January 15@ 1997)

ISA - International Society of Automation, Herborist Ingredients

ISA 95.00.02-2018 Enterprise-Control System Integration ? Part 2: Objects and Attributes for Enterprise-Control System Integration
ISA 95.00.04-2012 Enterprise-Control System Integration ? Part 4: Objects and attributes for manufacturing operations management integration
ISA 95.00.04-2018 Enterprise-Control System Integration ? Part 4: Objects and attributes for manufacturing operations management integration

ES-UNE, Herborist Ingredients

UNE-EN 62264-2:2013 Enterprise-control system integration - Part 2: Objects and attributes for enterprise-control system integration (Endorsed by AENOR in November of 2013.)
UNE-EN 62264-4:2016 Enterprise-control system integration - Part 4: Object model attributes for manufacturing operations management integration (Endorsed by AENOR in May of 2016.)
UNE-EN IEC 62769-1:2021 Field device integration (FDI) - Part 1: Overview (Endorsed by Asociación Española de Normalización in May of 2021.)
UNE-EN IEC 62769-4:2021 Field Device Integration (FDI) - Part 4: FDI Packages (Endorsed by Asociación Española de Normalización in May of 2021.)
UNE-EN 62769-4:2015 Field Device Integration (FDI) - Part 4: FDI Packages (Endorsed by AENOR in August of 2015.)
UNE-EN 62769-1:2015 Field device integration (FDI) - Part 1: Overview (Endorsed by AENOR in August of 2015.)
UNE-EN IEC 62769-1:2023 Field Device Integration (FDI®) - Part 1: Overview (Endorsed by Asociación Española de Normalización in June of 2023.)
UNE-EN 62769-3:2015 Field Device Integration - Part 3: FDI Server (Endorsed by AENOR in August of 2015.)
UNE-EN IEC 62769-3:2021 Field Device Integration (FDI) - Part 3: Server (Endorsed by Asociación Española de Normalización in May of 2021.)
UNE-EN IEC 62769-103-4:2023 Field Device Integration (FDI)® - Part 103-4: PROFINET (Endorsed by Asociación Española de Normalización in July of 2023.)
UNE-EN IEC 62769-4:2023 Field Device Integration (FDI®) - Part 4: FDI Packages (Endorsed by Asociación Española de Normalización in July of 2023.)

YU-JUS, Herborist Ingredients

JUS B.B8.004-1986 Crvshed aggregats. Determination od petrographic composition

Lithuanian Standards Office , Herborist Ingredients

LST EN 190100-2001 Sectional specification. Digital monolithic integrated circuits

Beijing Provincial Standard of the People's Republic of China, Herborist Ingredients

DB11/T 1764.8-2021 Water Ratings Part 8: Integrated Circuits

Professional Standard - Commodity Inspection, Herborist Ingredients

SN/T 1200-2003 Protocol of qualitative PCR for the detection of genetically modified components in tobacco
SN/T 4108-2015 Determination of active ingredient content in pyroxsulam water dispersible granule.High performance liquid chromatography

IEEE - The Institute of Electrical and Electronics Engineers@ Inc., Herborist Ingredients

IEEE P1636/D7-2017 Draft Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA)
IEEE P1636/D8-2017 Draft Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA)
IEEE P1636/D6-2017 Draft Standard for Software Interface for Maintenance Information Collection and Analysis (SIMICA)

European Committee for Standardization (CEN), Herborist Ingredients

EN ISO 11807-2:2021 Integrated optics - Vocabulary - Part 2: Terms used in classification (ISO 11807-2:2021)

CEN - European Committee for Standardization, Herborist Ingredients

EN ISO 11807-2:2005 Integrated optics - Vocabulary - Part 2: Terms used in classification

ES-AENOR, Herborist Ingredients

INTA 15 21 35

HU-MSZT, Herborist Ingredients

MSZ 18000/4-1971

American Society for Testing and Materials (ASTM), Herborist Ingredients

ASTM C294-98 Standard Descriptive Nonmenclature for Constituents of Concrete Aggregates
ASTM C294-12 Standard Descriptive Nomenclature for Constituents of Concrete Aggregates
ASTM C294-04 Standard Descriptive Nomenclature for Constituents of Concrete Aggregates
ASTM C294-05 Standard Descriptive Nomenclature for Constituents of Concrete Aggregates

Institute of Interconnecting and Packaging Electronic Circuits (IPC), Herborist Ingredients

IPC 9503-1999 Moisture Sensitivity Classification for Non-IC Components

Yunnan Provincial Standard of the People's Republic of China, Herborist Ingredients

DB53/T 498-2013 Determination of main chemical constituents of tobacco and tobacco products Near-infrared diffuse reflectance spectrometry

NL-NEN, Herborist Ingredients

NEN 5942-1990 Aggregates for concrete - Determination of the composition of granular debris

Defense Logistics Agency, Herborist Ingredients

DLA MIL-DTL-13791 G-2009 DISTRIBUTOR, IGNITION SYSTEM: INTEGRAL COIL, WATERPROOF 24 VOLT