31.020 电子元器件综合 标准查询与下载
共找到 1123 条与 电子元器件综合 相关的标准，共 75 页
General test procedure of failure rate for electronic components
- ICS
- 31.020
- CCS
- 发布
- 20210913
- 实施
- 20210913
Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide
- ICS
- 31.020
- CCS
- L10
- 发布
- 2021-09-10
- 实施
- 2021-09-10
Audio frequency induction loop drivers up to 45 amperes in the frequency range 10 Hz to 9 kHz; Harmonised Standard for access to radio spectrum (ETSI EN 303348 V1.2.1 (2021-06))
- ICS
- 31.020
- CCS
- 发布
- 2021-09-01
- 实施
- 2021-09-01
本文件规定了曲面有机发光二极管（OLED）屏幕用防指纹光学保护膜（以下简称保护膜）的产品结构、基本要求、技术要求、试验方法、检验规则、标志、包装、运输、贮存及质量承诺等内容。 本文件适用于曲面有机发光二极管（OLED）屏幕用防指纹光学保护膜。
Anti-fingerprint optical protective film for curved Organic Light-Emitting Diode（ OLED）screens
- ICS
- 31.020
- CCS
- C404
- 发布
- 2021-08-26
- 实施
- 2021-09-03
Electronic components - Long-term storage of electronic semiconductor devices - Part 9: Special cases
- ICS
- 31.020
- CCS
- 发布
- 2021-08-25
- 实施
Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices
- ICS
- 31.020
- CCS
- 发布
- 2021-08-12
- 实施
- 2021-08-12
Interoperability specifications and communication method for external power supplies used with computing and consumer electronics devices
- ICS
- 31.020
- CCS
- 发布
- 2021-08-12
- 实施
- 2021-08-12
This standard specifies a test method for the determination of the bonding strength and bonding behavior of adhesives and potting compounds with a shear test with small bonding areas. This test method can also be used to assess the bondability of components.
Adhesive bondings in electronic applications - Bonding strength at surfaces - Part 2: Shear test
- ICS
- 31.020
- CCS
- 发布
- 2021-08-00
- 实施
IEC 62435-2:2017 is related to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied. This part also includes guidance on test methods that may be used to assess generic deterioration mechanisms. Typically, this part is used in conjunction with IEC 62435-1:2017 for any device long-term storage whose duration may be more than 12 months for product scheduled for long duration storage.
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
- ICS
- 31.020
- CCS
- 发布
- 2021-07-01
- 实施
IEC 63002:20016 defines interoperability guidelines for external power supplies used with portable computing devices that implement the IEC 62680-1-2: Universal Serial Bus Power Delivery Specification with the IEC 62680-1-3: Universal Serial Bus Interfaces for data and power-Common Components- Type-CTM Type-C Cable and Connector Specification. It specifies the data objects used by a portable computing system using IEC 62680-1-2 to understand the identity, design and performance characteristics, and operating status of an external power supply. This International Standard is applicable to external power supplies under 100 watts for portable computing devices, with a focus on power delivery application for notebook computers, tablets, smartphones and other related multimedia devices.
Identification and communication interoperability method for external power supplies used with portable computing devices
- ICS
- 31.020
- CCS
- 发布
- 2021-07-01
- 实施
IEC 62435-4:2018 specifies long-term storage methods and recommended conditions for long-term storage of electronic components including logistics, controls and security related to the storage facility. Long-term storage refers to a duration that may be more than 12 months for products scheduled for long duration storage. The philosophy of such storage, good working practices and general means to facilitate the successful long-term storage of electronic components are also addressed.
Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
- ICS
- 31.020
- CCS
- 发布
- 2021-07-01
- 实施
IEC 62435-5:2017 is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1:2017 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
- ICS
- 31.020
- CCS
- 发布
- 2021-07-01
- 实施
IEC 62435-1:2017 on long-term-storage covers the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy. Long-term storage refers to a duration that can be more than 12 months for products scheduled for long duration storage. Philosophy, good working practice, and general means to facilitate the successful long-term-storage of electronic components are also addressed. This standard cancels and replaces IEC/PAS 62435 published in 2005. This first edition constitutes a technical revision.
Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
- ICS
- 31.020
- CCS
- 发布
- 2021-07-01
- 实施
General method to declare the use of critical raw materials in energy-related products
- ICS
- 31.020
- CCS
- 发布
- 2021-06-17
- 实施
- 2021-06-17
Methods for providing information relating to material efficiency aspects of energy-related products
- ICS
- 31.020
- CCS
- 发布
- 2021-06-17
- 实施
- 2021-06-17
Fixed inductors for electromagnetic interference suppression - Part 1: Generic specification
- ICS
- 31.020
- CCS
- 发布
- 2021-06-16
- 实施
Guide for Reliability-Based Placement of Overhead and Underground Switching and Overcurrent Protection Equipment up to and Including 38 kV
- ICS
- 31.020
- CCS
- F20
- 发布
- 2021-06-16
- 实施
Packaging of components for automatic handling – Part 1: Tape packaging of components with axial leads on continuous tapes
- ICS
- 31.020
- CCS
- 发布
- 2021-05-26
- 实施
- 2021-05-26
Electronic components - Long-term storage of electronic semiconductor devices - Part 8: Passive electronic devices (IEC 62435-8:2020)
- ICS
- 31.020
- CCS
- 发布
- 2021-04-12
- 实施
- 2021-04-12
Surface mounting technology -- Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 61760-1:2020)
- ICS
- 31.020
- CCS
- 发布
- 2021-04-08
- 实施
- 2021-04-08
