共找到 1415 条与 半导体器分立件综合 相关的标准,共 95 页
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopic examination of plastically encapsulated electronic components
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
Semiconductor Devices Part 16-2: Microwave Integrated Circuit Prescalers
Mechanical and Climatic Test Methods for Semiconductor Devices Part 26: Electrostatic Discharge (ESD) Susceptibility Test Human Body Model (HBM)
Semiconductor Devices Part 16-5: Microwave Integrated Circuit Oscillators
Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
Semiconductor Devices Mechanical and Climatic Test Methods Part 31: Flammability of Plastic Encapsulated Devices (Internally Induced)
Mechanical and Climatic Test Methods for Semiconductor Devices Part 27: Electrostatic Discharge (ESD) Susceptibility Test Machine Model (MM)
Mechanical and climatic test methods for semiconductor devices Part 32: Flammability of plastic encapsulated devices (externally induced)
Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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