31.080.01 半导体器分立件综合 标准查询与下载
共找到 1415 条与 半导体器分立件综合 相关的标准，共 95 页
Semiconductor devices — Mechanical and climatic test methods — Part 3: External visual examination
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 18: Ionizing radiation(total dose)
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 32: Flammability of plastic-encapsulated devices(externally induced)
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Mechanical and climatic test methods — Part 23: High temperature operating life
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices — Part 14-1: Semiconductor sensors — Generic specification for sensors
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Semiconductor devices - Mechanical and climatic test methods — Part 17: Neutron irradiation
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-29
- 实施
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
- ICS
- 31.080.01
- CCS
- 发布
- 2021-12-14
- 实施
1 Scope This part of IEC 63287 gives guidelines for reliability qualification plans of semiconductor integrated circuit products. This document is not intended for military- and space-related applications. NOTE 1 The manufacturer can use flexible sample sizes to reduce cost and maintain reasonable reliability by this guideline adaptation based on EDR-4708, AEC Q100, JESD47 or other relevant document can also be applicable if it is specified. NOTE 2 The Weibull distribution method used in this document is one of several methods to calculate the appropriate sample size and test conditions of a given reliability project.
Semiconductor devices. Generic semiconductor qualification guidelines - Guidelines for IC reliability qualification
- ICS
- 31.080.01
- CCS
- 发布
- 2021-11-30
- 实施
- 2021-11-30
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- ICS
- 31.080.01
- CCS
- 发布
- 2021-11-29
- 实施
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
- ICS
- 31.080.01
- CCS
- 发布
- 2021-11-29
- 实施
本文件是针对元器件级的失效模式及影响分析，是对系统及整机级的FMEA标准的有效补充，可保证元器件制造和应用方了解和掌握影响元器件可靠性的主要失效机理、模式及原因，并预先采取有效的预防措施；支撑元器件的可靠性设计、生产工艺控制以及整机用户的可靠性应用。
General Methods and Procedures for Failure Mechanism, Modes and Effects Analysis (FMMEA) of Electronic Components
- ICS
- 31.080.01
- CCS
- C397
- 发布
- 2021-11-22
- 实施
- 2022-01-25
本文件以IGBT中体二极管导通电压为热敏参数，建立适用于逆导型 IGBT器件的热阻测试电路和方法，规范逆导型IGBT的热阻测试流程，提高测试准确性。
Thermal resistance test method of reverse conduction IGBT
- ICS
- 31.080.01
- CCS
- C397
- 发布
- 2021-11-22
- 实施
- 2022-01-25
本文件给出半导体器件大气中子单粒子效应试验方法与程序。专门针对使用散裂中子源对半导体器件进行大气中子单粒子效应加速试验，根据半导体器件工艺和散裂中子源测试条件变化，编制新标准，覆盖热中子和高能中子协同测试，提升试验效率，覆盖高速大容量器件测试、MBU测试分析、1MeV~10MeV中子贡献等半导体器件大气中子单粒子效应测试中的关键环节。通过开展散裂中子源加速辐照试验、数据处理分析和计算，可以得到半导体器件在实际应用环境下的大气中子单粒子效应敏感性数据，为半导体器件抗辐射能力评价提供依据，为电子系统软错误模型和分析评价提供基础数据。
Atmospheric neutron single event effect test methods and procedures for semiconductor devices
- ICS
- 31.080.01
- CCS
- C397
- 发布
- 2021-11-22
- 实施
- 2022-01-25
本文件参考国际相关标准，结合行业实际应用需求，制定了多热源组件（MCM/SiP）热性能指标及评价方法标准，以解决实际应用中多热源组件缺乏规范的热性能表征参数和规范的检测评价方法问题。本文件可作为半导体分立器件、微电路器件热性能表征及热性能评价标准体系的重要组成部分。
Thermal performance index and evaluation method of multi-heat source module (MCM/SiP)
- ICS
- 31.080.01
- CCS
- C397
- 发布
- 2021-11-22
- 实施
- 2022-01-25
本文件给出的基于失效物理的故障树构建方法及规范要求，解决了电子元器件故障树建树过程中故障事件演绎不充分、上下事件因果逻辑关系易混乱的问题，可以建立以故障树为载体且失效信息因果逻辑关系清晰的电子元器件故障信息库。本文件方法适用于产品尺寸小、内部结构性能难以直接测量的电子元器件产品。
Electronic Components Fault Tree Analysis Method and Program
- ICS
- 31.080.01
- CCS
- C397
- 发布
- 2021-11-22
- 实施
- 2022-01-25
Semiconductor devices. Semiconductor devices for wireless power transfer and charging. General requirements and specifications
- ICS
- 31.080.01
- CCS
- 发布
- 2021-11-05
- 实施
- 2021-11-05
本文件规定了车规级半导体功率模块的测试认证要求。 本文件适用于汽车应用的硅基和碳化硅基功率模块的测试认证。
Test qualification for power modules in automotive applications
- ICS
- 31.080.01
- CCS
- C3670
- 发布
- 2021-11-01
- 实施
- 2021-11-04
