J00 标准化、质量管理 标准查询与下载

DB37/T 110-1988 煤矿机电产品图样和技术文件的完整性

规定了机电产品图样和技术文件的完整性及技术文件的内容，适用于新产品开发和老产品的技术改进

Integrity of drawings and technical documents of coal mine electromechanical products

DB37/T 109-1988 煤矿机电产品图样和技术文件标准化审查

规定了煤矿机电产品图样和技术文件的标准化审查的范围、内容、程序和方法

Coal mine mechanical and electrical product drawings and standardization review of technical documents

IPC TM-650 2.6.3.2-1988 灵活电介质的绝缘和防潮性 修订版B 1988年5月

This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes. It is not intended as an assembly production specification or a stand alone qualification document. The procedure consists of a set of assembly process simulations which can be performed by either the component user or manufacturer prior to reliability testing as specified in the applicable component qualification and reliability monitoring documents. The simulations include alternative conditions depending on the component type, physical characteristics and anticipated use.

Insulation and Moisture Resistance, Flexible Base Dielectric; Revision B - May 1988

IPC TM-650 2.5.16-1988 多层印刷线路的筛余 修订版A 1988年11月

If you are in the electronics industry, at one time you have, will, or should wrestle with the issue of the cleanliness of the unpopulated printed circuit boards (bare boards). Residues on circuit boards are directly related to the reliability of the produced hardware and can result in serious failures if not known or monitored.

Shorts, Internal on Multilayer Printed Wiring; Revision A - November 1988

IPC TM-650 2.5.28-1988 柔性印刷线路材料Q共振 修订版A 1988年4月

This document provides information on land pattern geometries

Q Resonance, Flexible Printed Wiring Materials; Revision A - April 1988

IPC TM-650 2.3.23-1988 治愈(永久性)热治愈焊料口罩 修订版B 1988年2月

This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only

Cure (Permanency) Thermally Cured Solder Masks; Revision B - February 1988

IPC TM-650 2.3.23.1-1988 治愈(永久性)紫外发起干膜焊料口罩 修订版A 1988年2月

This specification covers paper made from cellulosic fibers intended as a reinforcing material in laminated plastics for electrical and electronic use.

Cure (Permanency) UV Initiated Dry Film Solder Masks; Revision A - February 1988

IPC TM-650 2.4.27.2-1988 焊接面罩磨损(铅笔法) 修订版A 1988年2月

IPC Standards and Publications are designed to serve the public interest through eliminating misunderstanáings between manufacairers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or selling products not conforming to such Standards and Publication, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally.

Solder Mask Abrasion (Pencil Method); Revision A - February 1988

IPC TM-650 2.6.6-1987 印刷线路板温度循环 修订版B 1987年12月

The IPC-9194 should be used in conjunction with IPC- 9191. The IPC-9191 provides general guidelines for implementing SPC in electronics industry.

Temperature Cycling, Printed Wiring Board; Revision B - December 1987

AIA/NAS NAS 855-1987 Rev. 1 工业包装标准

This standard specifies the requirements for the preparation of material for delivery within a defined distribution cycle. Procedures and packaging material selected must meet the performance requirements as outlined herein. The supplier has the responsibility to assure the integrity of the package throughout its defined distribution cycle.

Industrial Packaging Standard Rev. 1

IPC TM-650 2.5.1-1986 印刷线路材料电弧电阻 修订版B 1986年5月

This standard specifies data formats used to describe parts lists and bill of material generation methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers.

Arc Resistance of Printed Wiring Material; Revision B - May 1986

IPC TM-650 2.5.6-1986 刚性印刷布线材料的绝缘击穿 修订版B 1986年5月

This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only

Dielectric Breakdown of Rigid Printed Wiring Material; Revision B - May 1986

IPC TM-650 5.8-1984 子目录 修订版A 1984年3月

This test method is used to determine the major constituents and plating characteristics in nickel sulfate/low chloride (watts type), nickel sulfate/high chloride, and all chloride nickel plating baths.

Subsection Table of Contents; Revision A - March 1984

ISO 2372:1974/Amd 1:1983 第1次修改

Mechanical vibration of machines with operating speeds from 10 to 200 rev/s; basis for specifying evaluation standards; amendment 1

IPC TM-650 2.2.10-1983 孔位置及指挥位置 修订版A 1983年12月

Chlorofluorocarbon (CFC) compounds have been identified as agents contributing to the reduction of stratospheric ozone. It is incumbent upon the electronics industry, as a primary user of CFC solvents, to find alternative processes and materials which eliminate the need for CFCs. One such alternative is the substitution of water-soluble fluxes and aqueous cleaning for rosin fluxes and CFC cleaning.

Hole Location and Conductor Location; Revision A - December 1983

IPC TM-650 2.2.13.1-1983 镀在孔微欧姆法中的厚度 修订版A 1983年1月

Analyze solder, determine source of contamination, correct solder composition, eliminate contamination by solder replacement or dilution and eliminate source of contamination where possible.

Thickness, Plating in Holes Micro-Ohms Method; Revision A - January 1983

IPC TM-650 2.4.17.1-1982 弹性绝缘材料繁殖撕裂强度,修订版A,1982年12月

Because of a need for technical information, and to develop standards in the field

Propagation Tear Strength, Flexible Insulating Material; Revision A - December 1982

IPC TM-650 2.3.8-1982 灵活绝缘材料的易燃性 修订版A - 1982年12月

This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2nd level interconnects, and for indicating certain types of Pb-free material and the maximum assembly temperature. It also establishes the requirements for labeling a bare board if the base resin is halogen free and the type of conformal coating used after assembly.

Flammability, Flexible Insulating Materials; Revision A - December 1982

IPC TM-650 2.4.16-1982 弹性绝缘材料起始撕裂强度 修订版A 1982年12月

IPC-TR-464 was originally published in April of 1984. This Technical Report was developed to meet the growing

Initiation Tear Strength, Flexible Insulating Materials; Revision A - December 1982

IPC TM-650 2.3.30-1981 无水氟碳溶剂pH值测定 修订版A 1981年11月

material is advisory only and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement. Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.

Solvent pH Determination in Anhydrous Fluorocarbon Solvents; Revision A - November 1981