L08 标志、包装、运输、贮存 标准查询与下载

BS EN 60286-5:2004+A1:2009 自动装卸元件的包装.第5部分:矩阵盘

This part of IEC 60286 describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays. Matrix trays are designed to facilitate the transport and handling of electronic components during their testing, baking, transport/storage, and final mounting by automatic placement equipment. The generic rules for their design are given in this standard.. Newly developed trays which follow these rules will not be listed individually . Only those trays which conform to the design rules set forth herein are classified as “standard trays” and are thus preferred for use. NOTE Matrix trays listed in Annex A which do not conform to the design rules set forth herein shall be considered as “non-standard trays” and are not preferred for use.

Packaging of components for automatic handling — Part 5: Matrix trays

JEDEC JESD8-17-2004 1.8V供电点对点驱动规程

This material is intended to be reflected in supplier specifications for point to point DDR devices ranging from 400 Mb/s to 800 Mb/s operation.

Driver Specifications for 1.8 V Power Supply Point-to-Point Drivers

IEC 60286-5:2003 自动装配用元件的包装.第5部分:矩阵式料盘

Describes the common dimensions, tolerances and characteristics of the tray. It includes only those dimensions which are essential for the handling of the trays for the stated purpose and for placing or removing components from the trays.

Packaging of components for automatic handling - Part 5: Matrix trays

KS C IEC 60286-1:2003 自动处理用元件的封装.第1部分:具有轴向连续带的元件带状包装

이 규격은 전자 기기에 사용하기 위한 반대 방향 리드를 갖는 부품의 테이프 패키징에 적

Packaging of components for automatic handling-Part 1:Tape packaging of components with axial leads on continuous tapes

KS C IEC 60286-4:2003 自动处理用元件的封装.第4部分:E和G型包装件中密封电子元件用的粘着料斗

(엔드 스토퍼를 포함하는)스틱 매거진은 전자 부품 보관, 제조자로부터 고객으로의 수송

Packaging of components for automatic handling-Part 4:Stick magazines for electronic components encapsulated in packages of form E and G

KS C IEC 60286-5:2003 自动处理用元件的封装.第5部分:矩阵式料盘

1.1 매트릭스 트레이는 자동 배치 장비에 의해 시험, 베이킹, 수송/보관 및 최종 실

Packaging of components for automatic handling-Part 5:Matrix trays

KS C IEC 60286-3:2003 自动处理用元件的封装.第3部分:表面安装的元件在连续带上的封装

이 규격은 전자 회로에 연결하려는 리드가 없거나 또는 리드 스텀프가 있는 전자 부품의

Packaging of components for automatic handling-Part 3:Packaging of surface mount components on continuous tapes

KS C IEC 60286-2:2003 自动处理用元件的封装.第2部分:具有单向引线的元件在连续带上的带式封装

이 규격은 전자 기기에 사용하기 위한 2개 이상의 동일 방향 리드를 갖는 부품의 테이프

Packaging of components for automatic handling-Part 2:Tape packaging of components with unidirectional leads on continuous tapes

IEC 62090:2002 使用条形码和二维符号的电子元器件用产品包装标签

Applies to labels on the packaging of electronic components for automatic handling. These labels use linear bar code and two-dimensional (2D) symbols. Bar code and 2D symbols markings are used, in general, for automatic identification and handling of com

Product package labels for electronic components using bar code and two-dimensional symbologies

SJ/T 11277-2002 防静电周转容器通用规范

本规范适用于电子产品用周转容器的研制、生产和交付。

General specification for reusable containers and boxes for electrostatic protection

IEC PAS 62169:2000 对湿敏/逆流敏表面安装器件的处置、包装、发货和使用的标准

3.1 Packages 3.1.1 This standard applies to all nonhermetic SMDs subjected to bulk solder reflow processes during PCB assembly, including plastic encapsulated packages and all other packages made with moisture-permeable polymeric materials (epoxies, silicones, etc.) that are exposed to the ambient air. 3.1.2 Hermetic components are not at risk and do not require moisture precautionary handling.3.2 Assembly processes 3.2.1 This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR), and vapor phase reflow (VPR) processes. It does not apply to bulk solder reflow processes that immerse the component bodies in molten solder (e.g., backside wave solder). Such processes are not allowed for many SMDs and are not covered by the component qualifications standards used as a basis for this document. 3.2.2 This standard also applies to moisture sensitive components that are removed or attached singly by local ambient heating, i.e., "hot air rework." 3.2.3 This standard does not apply to components that are socketed and not exposed to solder reflow temperatures. Such components are not at risk and do not require moisture precautionary handling. 3.2.4 This standard does not apply to components in which only the leads are heated to reflow the solder, e.g., hand-soldering, hot bar attach of gull wing leads, and pin-thru-hole with backside wave solder. The heat absorbed by the package body from such operations is typically much lower than for bulk surface mount reflow or hot air rework, and moisture precautionary measures are typically not needed. 3.3 Reliability 3.3.1 The methods set forth in this specification ensure that adequate component reliability, as evaluated and verified by J-STD-020 and/or by JESD22-A113 plus environmental reliability testing, is maintained during and after the PCB assembly operation. 3.3.2 This specification does not address or ensure solder joint reliability of attached components.

Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices

SJ 20767-1999 电气和纤维光学开关的包装通用规范

本规范规定了电气和纤维光学开关、开关组件及有关附件的防护包装、装箱、包装标志的要求和质量保证规定。 本规范适用于开关及其附件的防护包装、装箱和包装标志。

Switches,electrical and fiber optic,packaging of,general specification for

JIS C 0806-2:1999 自动装卸用元件的包装.第2部分:连续包装带上单向抽头的元件的带包装

この規格は，2本以上のラジアルリード線端子をもつ電子機器用部品の，テープによるパッケージングについて適用する。通常，部品のリード線端子をテープで固定する。この規格は，自動実装.リード線端子成形，挿入などの操作を行う装置を用いるテービングの要求事項について規定し，上記の目的で用いられる部品のテーピングに必要な寸法に限定して規定する。

Packaging of components for automatic handling -- Part 2: Tape packaging of components with unidirectional leads on continuous tapes

JIS C 0806-1:1999 自动装卸用元件的包装.第1部分:连续包装带上轴向抽头的元件的带包装

この規格は，電子機器用アキシャルリード線端子部品のテープによるペッもソグージングについて適用する。通常，部品のリード線端子をテープで固定する。この規格は，自動実装，リード線端子の加工，挿入などの操作を行う装置を用いるテーピングの要求事項について規定する。また，上記の目的のため.部品のテーピングに必要な寸法に限定して規定する。

Packaging of components for automatic handling -- Part 1: Tape packaging of components with axial leads on continuous tapes

JIS C 0806-3:1999 自动搬运的元器件的包装.第3部分:连续胶带上表面安装元器件的包装

この規格は，電子回路に使用するリードなし形又はスタンプリード形の電子部品のテーピングについて適用する。また，部品の自動実装に用いるためのテーピングの要求事項について規定する。上記の目的のために部品のテーピングに必要な寸法に限定して規定する。

Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes

NF C90-711:1999 表面安装技术.第2部分:表面安装装置(SMD)的运输和存储条件.应用指南(欧洲标准EN 61760-2)

Surface mounting technology. Part 2 : transportation and storage conditions of surface mounting devices (SMD). Application guide.

JEDEC JESD51-5-1999 带热感式附件部分的包装热测试板标准的扩充

This specification provides for additional design geometries to be added to established thermal test board standards. The additions are only to allow testing of packages that need direct thermal contact with the thermal test board. Boards designed with this specification are not to be used on packages that do not require direct thermal attachment to the test board. Following the intent of the previous test board specifications, this specification allows design of both universal test boards for a wide number of package geometries within a package family or for the design of unique boards for single packages.

Extension of Thermal Test Board Standards for Packages with Direct Thermal Attachment Mechanisms

SJ/T 11197-1999 环氧模塑料

本标准规定了半导体工业用环氧模塑料的分类，要求，试验方法，检验规则及标志、包装、运输、贮存。 本标准适用于半导体工业中封装分立器件、中小规模集成电路、大规模集成电路、超大规模集成电路、特大规模集成电路等用环氧模塑料。

Epoxy molding compounds

IEC 60286-6:1998 自动装配用元件的包装 第6部分:表面安装组件的散装盒包装

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components

IEC 60286-2:1997 自动装配用元件的包装 第2部分:具有单向引线的元件在连续编带上的带式包装

This Standard applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment. In general, the tape is applied to the component leads. It covers requirements for taping techniques used with equipment for automatic handling, preforming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.

Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes