L08 标志、包装、运输、贮存 标准查询与下载

DIN 6113-1:2010 包装业.无源无线射频识别(RFID)芯片用严格工业包装,定位和系统阐述的射频识别.第1部分:总则

Packaging - Radio-frequency identification of rigid industrial packaging, positioning and system parameters for passive RFID chips - Part 1: General

DIN 6113-3:2010 包装业.无源无线射频识别(RFID)芯片用严格工业包装,定位和系统阐述的射频识别.第3部分:总容量超过200 l的可拆端盖(开式)无塞子/塞子关闭系统的铁桶

Packaging - Radio-frequency identification of rigid industrial packaging, positioning and system parameters for passive RFID chips - Part 3: Removable head (open head) steel drum without plug/bung closure system of total capacity exceeding 200 l

BS EN 60286-3-1:2009 自动处理用部件的包装.在连续传送带上的表面安装部件的包装.类型V.压力输送带

This part of IEC 60286 is applicable to the taping of surface mount components using carrier tapes which have concave cavities ed by compression of the base material.

Packaging of components for automatic handling - Packaging of surface mount components on continuous tapes - Type V. Pressed carrier tapes

BS EN 60286-3-2:2009 自动处理用元件的包装.连续带上表面安装元器件的包装.VI型.4 mm宽泡状载带

This part of IEC 60286 is applicable to the tape packing of ultra small surface mount components using plastic blister carrier tape of 4 mm in width which has concave cavities for containing components of 1 mm in pitch of the component compartments (W4P1).

Packaging of components for automatic handling - Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width

DIN EN 60286-3-2:2010 自动处理用元件的包装.第3-2部分:连续胶带上的表面黏着方式组件包装.VI型.4 mm宽胶纸承载带起泡剂(IEC 60286-3-2-2009).德文版本 EN 60286-3-2-2009

This part of IEC 60286 is applicable to the tape packing of ultra small surface mount components using plastic blister carrier tape of 4 mm in width which has concave cavities for containing components of 1 mm in pitch of the component compartments (W4P1).

Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width (IEC 60286-3-2:2009); German version EN 60286-3-2:2009

DIN EN 60286-3-1:2010 自动装卸部件的封装.第3-1部分:用连续胶带对表面安装部件进行封装.类型V.压力输送带(IEC 60286-3-1-2009).德文版本EN 60286-3-1-2009

This part of IEC 60286 is applicable to the taping of surface mount components using carrier tapes which have concave cavities ed by compression of the base material.

Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes (IEC 60286-3-1:2009); German version EN 60286-3-1:2009

IEC 60286-3-1:2009 自动装配用元件的包装.第3-1部分:连续带上表面安装元器件的包装.V型.加压承载编带

This part of IEC 60286 is applicable to the taping of surface mount components using carrier tapes which have concave cavities ed by compression of the base material.

Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes

IEC 60286-3-2:2009 自动处理用元件的包装.第3-2部分:连续带上表面安装元器件的包装.VI型.4 mm宽泡状载带

Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width

IEC 60286-5:2009 自动装配用元件的包装.第5部分:矩阵式料盘

Packaging of components for automatic handling - Part 5: Matrix trays

JEDEC JESD51-31-2008 用于多片包装的热试验环境改善

This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, “Guideline to Support Effective Use of MCP Thermal Measurements” which is being prepared.

Thermal Test Environment Modifications for MultiChip Packages

BS DD CLC/TS 50466:2006 电子元件的长期存储.实施规范

Although it has always existed to some extent, obsolescence of electronic components, and particularly integrated circuits, has become increasingly intense over the last few years. I ndeed, with the existing technological boom, the commercial life of a component has become very short compared with the life of industrial equipment such as those encountered in the aeronautical field, the railway industry or the energy sector. The many solutions enabling obsolescence to be resolved are now identified. However, selecting one of these solutions must be preceded by a case by case technical and economic feasibility study, depending on whether storage is envisaged for field service or production. Remedial storage as soon as components are no longer marketed. Preventive storage anticipating declaration of obsolescence. Taking into account the expected life of some installations, sometimes covering several decades, the qualification times, and the unavailability costs, which can also be very high, the solution to be adopted to resolve obsolescence must often be rapidly implemented. This is why the solution retained in most cases consists in systematically storing components which are in the process of becoming obsolescent. The technical risks of this solution are, a priori, fairly low. However, it requires the perfect mastery of the implemented process, and especially of the storage environment, although this mastery becomes critical when it comes to long term storage. All handling, protection, storage and test operations should be performed in accordance with the technology requirements of the component.

Long duration storage of electronic components - Specification for implementation

NF C93-013-3:2008 自动处理用元件的包装.第3部分:连续传送带上表面装配元件的包装

Packaging of components for automatic handling - Part 3 : packaging of surface mount components on continuous tapes.

DIN EN 60286-3:2008 自动处理用元件的包装.第3部分:表面装配元件在连续传送带上的包装

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes (IEC 60286-3:2007); German version EN 60286-3:2007

IEC 60286-2:2008 自动装配元件的包装.第2部分:具有单向引线的元件在连续编带上的带式包装

This part of IEC60286 applies to the packaging of components with two or more unidirectional leads for use in electronic equipment. In general, the tape is applied to the component leads. This standard covers requirements for taping techniques used with equipment for automatic handling, preforming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.

Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes

BS EN 60286-3:2007 自动处理用元件的包装.在连续传送带上的表面安装元件的包装

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the abovementioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Packaging of components for automatic handling - Packaging of surface mount components on continuous tapes

IEC 60286-3:2007 自动处理用元件的包装.第3部分:表面装配元件在连续传送带上的包装

This part of IEC 60286 is applicable to the (ape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

JEITA ED-7306-2007 升温下包装弯曲的测定方法和最大容许值

This standard stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA

Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

AIMC 0002-2006 无源射频标签通用技术规范

本标准规定了无源射频标签的通用技术要求和测试方法。 参照ISO/IEC18000-n系统标准，包括：低于135kHz（ISO/IEC 18000-2），13.56MHz（ISO/IEC 18000-3，ISO 15693，ISO 14443）2.45GHz（ISO/IEC 18000-4），860MHz～960MHz（ISO/IEC 18000-6）,433MHz（ISO/IEC 18000-7）。 对标签应用环境条件特殊的，可能要求采取减缓措施。

General technical specifications for passive tag

ANSI/GEIA STD-0003-2006 电子设备的长期存储程序

Document defines different methods of storage such as nitrogen or a bag with desiccant that absorbs not only moisture but also corrosive gases. Also describes labeling, marking, and minimal mention of inventory control requirements.

Procedures for Long Term Storage of Electronic Devices

JIS C 0806-6:2006 自动化处理用组件的包装.第6部分:表面安装组件的散装箱包装

この規格は，表面実装部品(以下,SMDという。)を収納するバルクケースによるパッケージングについて規定する。バルクケースは，部品の輸送，保管及び直接又は適切なフィーダを用いて装着機に部品を供給できるように設計されている。バルクケースは，接続部によってフィーダ又は自動装着機に取り付ける。

Packaging of components for automatic handling -- Part 6: Bulk case packaging for surface mounting components