标志、包装、运输、贮存标准-分析测试百科网

IEC 60286-3:1997 自动装配用元件的包装第3部分:表面安装的元件在连续编带上的包装

This Standard is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. It includes only those dimensions which are essential for the taping of components intended for the above-mentioned purposes.

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

ICS: 31.020;55.060
CCS: L08
发布: 1997-12
实施: 2007-06-07

IEC 60286-4:1997 自动装配用元件的包装第4部分:封装在E和G型包装件中的电子元件用的粘着料斗

Stick magazines (including end stoppers) are intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components.

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of form E and G

ICS: 31.020;55.060
CCS: L08
发布: 1997-12
实施: 2013-07-30

BS EN 60286-5:1997 元件自动封装.第5部分:矩阵盘

Packaging of components for automatic handling - Matrix trays

ICS: 31.020;55.160
CCS: L08
发布: 1997-10-15
实施: 1997-10-15

JEDEC JEP126-1996 开发和记录包装电子模型指南

A package electrical model') can be created fi-om the results of an electromagnetic analysis of the package geometry and material properties. The output of this analysis is a representation of the package that approximates its electrical behavior.

Guideline for Developing and Documenting Package Electrical Models Derived from Computational Analysis

ICS
CCS: L08
发布: 1996-05-01
实施

JIS C 0806:1995 连续胶带上电子元器件的包装(表面包装设备)

Packaging of electronic components on continuous tapes (surface mounting devices)

ICS: 31.190
CCS: L08
发布: 1995-11-01
实施: 1995-11-01

SJ 20526-1995 微电路包装规范

Specification for microcicuits packaging

ICS: 31.020
CCS: L08
发布: 1995-05-25
实施: 1995-12-01

CEA 624-1995 电子工业协会-非零售适用的产品包装条形码标签标准

This standard defines minimum requirements for identieng product packages that are distributed outside the originating location.

Electronic Industries Association - Product Package Bar Code Label Standard for Non-Retail Applications

ICS: 01.040.49
CCS: L08
发布: 1995-01-01
实施

JEDEC JEP123-1995 电子包装感应系数和电容模式参数测量指南

The characterization of model parameters for semiconductor package leads has been notorious for the lack of repeatability of modeling and of testing between sites. This lack of repeatability has been caused less by inaccuracy of basic test instrumentation, but more by lack of uniform conditions in test fixtures and by the diversity of methods applied. Thus, the intent for test methodology prescribed by this guideline is to ensure the reproducibility of uniform test conditions to be used at various test sites. As test conditions influence electrical parameter values, they must, to a large extent, emulate the application environment in which semiconductor devices are ultimately used.

Guideline for Measurement of Electronic Package Inductance and Capacitance Model Parameters