L10 电子元件综合 标准查询与下载

JEITA ET7501-105-2006 表面安装装置用地面类型设计指南(四个方向带有J字头的晶片载体)

Land pattern design guideline for surface mount devices :Sectional requirements （Chip carriers with J-Leads on four sides)

DLA DSCC-DWG-89028 REV B-2006 固定敷金属薄膜或敷金属纸和聚酯薄膜介质密封的电容器

This drawing describes the requirements for metallized film (200 V dc) and metallized paper and polyester film impregnated with high-temperature mineral wax capacitors (400 V dc through 1,000 V dc).

CAPACITORS, FIXED, METALLIZED FILM OR METALLIZED PAPER AND POLYESTER FILM, DIELECTRIC, HERMETICALLY SEALED

DLA DSCC-DWG-94006 REV D-2006 固定片状陶瓷电容器

This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip.

CAPACITORS, FIXED, CERAMIC, CHIP

DLA DSCC-DWG-06019-2006 高频片状陶瓷固定电容器

This drawing and MIL-PRF-123 describe the requirements for high frequency ceramic chip capacitors.

CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY

DLA DSCC-DWG-06022-2006 高频片状陶瓷固定电容器

This drawing and MIL-PRF-123 describe the requirements for high frequency ceramic, chip capacitors.

CAPACITORS, FIXED, CERAMIC, CHIP, HIGH FREQUENCY

IPC M-105-2006 刚性印制电路板手册

Fabricate boards in accordance with IPC-RB-276, Class 3. Finished boards must meet quality conformance testing and inspection as specified.

Rigid Printed Board Manual

DLA DSCC-DWG-89012 REV C-2006 固定极化电解质氧化铝及低螺母插入的电容器

This drawing describes the requirements for aluminum oxide, electrolytic capacitors.

CAPACITORS, FIXED, ELECTROLYTIC POLARIZED, ALUMINUM OXIDE, LOW SCREW-INSERT

JEITA EM3603B-2006 SOI晶片标准和度量衡学

This standard specifies the standard of thin film SOI wafers for MOS device and their metrology.

Standard of SOI wafers and metrology

DLA DSCC-DWG-97006 REV B-2006 固定陶瓷介质馈穿非全密封的电容器

This drawing and MIL-PRF-28861 describe the requirements for feedthrough capacitors.

CAPACITORS, FIXED, CERAMIC DIELECTRIC, NON- HERMETICALLY SEALED, FEEDTHROUGH

DLA DSCC-DWG-89062 REV B-2006 固定敷金属聚酯碳酸非密封的电容器

This drawing describes the requirements for metallized polycarbonate capacitors screened to MIL-PRF-55514.

CAPACITORS, FIXED, METALLIZED POLYCARBONATE, NON HERMETICALLY SEALED

IPC 4821-2006 刚性及多层印制板嵌入式无源器件电容器材料规格

This document describes materials that can be used for the fabrication of embedded passive capacitor devices within the finished printed circuit board substrate. For this document, embedded passive devices and the phrase embedded passives are considered to be equivalent. It provides information on general designations and associated characteristics of embedded passive device (EPD) capacitor materials. The document shall be used as a qualification and conformance standard for these materials.

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

DLA DSCC-DWG-95008 REV B-2006 固定电磁干扰抑制馈穿电容器(金属箱内全密封)

This drawing describes the requirements for radio requency/electromagnetic interference suppression feed through capacitors, hermetically sealed in metal cases.

CAPACITORS, FIXED, FEED THROUGH, ELECTROMAGNETIC INTERFERENCE SUPPRESSION, (HERMETICALLY SEALED IN METAL CASES)

DLA DSCC-DWG-89085 REV C-2006 固定极化电解质氧化铝及SNAP安装薄片电容器

This drawing describes the requirements for aluminum oxide, electrolytic capacitors.

CAPACITORS, FIXED, ELECTROLYTIC POLARIZED, ALUMINUM OXIDE, SNAP MOUNT, LOW PROFILE

DLA MIL-PRF-39018 F-2006 有可靠性和非既定的可靠性固定(氧化铝)指标电容器一般规格

This specification covers the general requirements for established reliability (ER) and non-ER, aluminum oxide, electrolytic, fixed capacitors (see 6.1). Capacitors meeting the ER requirements of this specification have reliability established on the basis of life tests performed at rated voltage at 85°C for failure rate (FR) levels ranging from 1.0 percent to 0.001 percent per 1,000 hours in accordance with MIL-STD-690. These FR levels are established at a 60-percent confidence level and are maintained at a 10 percent producer’s risk. The level of reliability is identified by the following FR level symbols

CAPACITORS, FIXED, ELECTROLYTIC (ALUMINUM OXIDE), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

DLA QPL-20-136-2006 陶瓷介电(温度补偿)的建立了可靠性和非既定可靠性的固定电容器.一般规格

This list has been prepared for use by or for the Government in the acquisition of products covered by subject specification and such listing of a product is not intended to and does not connote endorsement of the product by the Department of Defense.

CAPACITOR, FIXED, CERAMIC DIELECTRIC (TEMPERATURE COMPENSATING), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

JEDEC JESD22-A117A-2006 电子可清除可编程ROM程序/清除耐久力和数据保持测试

The following details shall be specified in the applicable device specification and/or the supplier's internal stress test specification, along with the rationale

Electrically Erasable Programmable ROM (EEPROM) Program/Erase Endurance and Data Retention Test

QC 001004-2006 IEC电子元器件质量评定体系.规范表

IEC Quality Assessment System for Electronic Components (IECQ) - Specifications list

DLA SMD-5962-88629 REV C-2006 12位数位类比转换器四方线性混合动力微电路

This drawing documents one product assurance class, class H (high reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

MICROCIRCUIT, HYBRID, LINEAR, QUAD, 12-BIT, DIGITAL TO ANALOG CONVERTER

DLA QPL-62-86-2006 电解(直流两极化铝制干电解质)的固定电容器.一般规格

This list has been prepared for use by or for the Government in the acquisition of products covered by Specification MIL-C-62. Listing of a product is not intended to and does not connote endorsement of the product by the Department of Defense.

CAPACITORS, FIXED, ELECTROLYTIC (DC, ALUMINUM, DRY ELECTROLYTE, POLARIZED) GENERAL SPECIFICATION FOR

DLA SMD-5962-87687 REV E-2006 解算器或同步到数字转换器,直线混合微型处理器

This drawing documents one product assurance class, class H (high reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

MICROCIRCUIT, HYBRID, LINEAR, RESOLVER OR SYNCHRO-TO-DIGITAL CONVERTER