L10 电子元件综合 标准查询与下载

KS C IEC 62137-1-2:2009 表面安装技术.表面装配焊接接缝的环境和耐久性试验方法.第1-2部分:剪切强度试验

IEC 62137 중 이 표준은 인쇄회로기판과의 조립시에 IEC 61190에 따라 전자 조

Surface mounting technology－Environmental and endurance test methods for surface mount solder joint－Part 1-2: Shear strength test

SJ/Z 11388-2009 电子信息产品环保使用期限通则

本指导性技术文件提出了含有有毒有害物质或元素的电子信息产品确定环保使用期限的通用规则。 本指导性技术文件适用于《电子信息产品污染控制管理办法》调整范围内的有毒有害物质或元素的含量超出SJ/T 11363-2006规定的限量要求的电子信息产品。

General guidelines of enviroment-friendly use period of electronic information products

DIN EN 62137-1-4:2009 表面安装技术.表面安装焊点的环境忍受力试验方法.第1-4部分:周期性挠曲试验(IEC 62137-1-4:2009),德文版本EN 62137-1-4:2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test (IEC 62137-1-4:2009); German version EN 62137-1-4:2009

BS EN 62137-1-5:2009 表面安装技术.表面安装焊接点的环境和耐受试验方法.第1-5部分:机械剪切疲劳试验

The test method described in this part of IEC 62137 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5:Mechanical shear fatigue test

DIN EN 62137-1-3:2009 表面安装技术.表面安装焊接点用环境和持久测试方法.第1-3部分:循环跌落试验(IEC 62137-1-3-2008).德文版本EN 62137-1-3-2009

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 62137-1-3:2008); German version EN 62137-1-3:2009

DIN EN 60915 Berichtigung 1:2009 电子设备用电容器和电阻器.单孔轴套安装的轴电子元件的轴端和轴套的优选尺寸(IEC 60915:2006+勘误表2007),德文版本EN 6091

Fixed capcitors and resistors for use in electronic equipment - Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components (IEC 60915:2006 + corrigendum 2007); German version EN 60915

GJB 6777-2009 军用电子元器件252Cf源单粒子效应实验方法

本标准规定了军用电子元器件Cf源上进行实验室单粒子效应实验的方法和基本要求。 本标准适用于军用电子元器件Cf源单粒子效应试验。商用电子元器件亦可参照执行。

Testing method of single event effects in Cf radiation source for military electronic devices

GJB 2443A-2009 军用温差电致冷组件通用规范

本规范规定了军用温差致冷组件（以下简称“组件”）的通用技术要求、质量保证规定及交货准备等。 本规范适用于TEC和TES系列各型号单级温差电致冷组件，多级温差电致冷组件可参照采用。

General specification for military thermoelectric cooling modules

NF C93-704-1-4*NF EN 62137-1-4:2009 表面安装技术.表面安装焊点的环境和耐久性试验方法.第1-4部分:循环弯曲试验

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4 : cyclic bending test.

BS EN 62137-1-3:2009 表面安装技术.表面安装焊缝的环境和耐久性试验方法.循环跌落试验

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic drop test

BS EN 62137-1-4:2009 表面安装技术.表面安装焊点的环境忍受力试验方法.周期性挠曲试验

The test method described in this part of IEC 62137 applies to surface mount components with a thin and wide basal plane, such as QFP and BGA. This test method evaluates the endurance of the solder joints between component leads and lands on a substrate by cyclic bending of substrate. This test also evaluates the effects of repeated mechanical stress, such as key pushing in cell phones, the strength of the solder joint between component terminals and lands on a substrate. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclically bend the substrate to a certain degree of depth until fracture of the solder joints occurs. The properties of the solder joints (e.g, solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Cyclic bending test

IEC 60915/COR1:2009 电子设备用电容器和电阻器.单孔轴套安装的轴驱动电子元件的安装、轴端和轴套的优选尺寸

Capacitors and resistors for use in electronic equipment - Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components

ANSI/EIA 4899-A:2009 电子元件管理计划制定用标准

This is a 2 stage process: 1-ANSI/EIA 4899 is intended to be identical to IEC TS 62239. Stage one is to create the match. Approval of stage 1 is the voting members of the APMC. 2-The I. C. industry has changed sufficiently that both ANSI/GEIA 4899 and IEC TS 62239 are not implemental as written. An ECMP implementation matrix is being developed to guide the ECMP audit process. Stage 2 is to bring both specifications into compliance with the ECMP matrix. Approval of stage 2 is the voting members of stage 2 and as a separate action the approval of IEC TS-107.

Standard for Preparing an Electronics Component Management Plan

KS C IEC 60512-10-4:2008 电子设备连接件.试验和测量方法.第10-4部分:撞击试验(自由元件)、静负荷试验(固定元件)、寿命试验和过负荷试验.试验10d:连接器电过负荷

이 표준은 커넥터에 결합한 접촉자 쌍의 전기적 과부하 시험을 규정한다.이 시험의 목

Connectors for electronic equipment-Tests and measurements-Part 10-4:Impact tests(free components), static load tests(fixed components), endurance tests and overload tests-Test 10d:Electrical overload(connectors)

KS C IEC PAS 62239:2008 电子元件管理计划

이 표준은 계획서 소유자의 장비에 설치된 모든 전자 구성품이 유효한 절차에 따라 선정되고

Electronic component management plans

JEDEC JESD201A-2008 锡和锡合金表面磨光的锡晶须磁化率环境验收要求

The methodology described in this document is applicable for environmental acceptance testing of tin based surface finishes and mitigation practices for tin whiskers. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This specification is intended for use in conjunction with JESD22A121, This specification does not apply to components with bottom-only terminations where the full plated surface is wetted during assembly (for example: QFN and BGA components, Flip Chip bump terminations). Adherence to this standard shall include meeting the reporting requirements described in clause 7.

Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes

DIN EN 61193-2:2008 质量评估系统.第2部分:电子元件和包装件的检验用抽样策略的选择和使用

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007); German version EN 61193-2:2007

GEIA-STD-0006-2008 利用浸焊替代电子单一零件整饰的要求

This standard defines the requirements for fully replacing undesirable surface finishes using solder dip. Requirements for qualifying and testing the refinished piece parts are also included. This standard covers the replacement of pure tin and Pb-free tin alloy finishes with SnPb finishes. This dipping is different from dipping to within some distance of the body for the purposes of solderability; solder dipping for purposes other than full replacement of pure tin and other Pb-free tin alloy finishes are beyond the scope of this document. It covers process and testing requirements for robotic and semi-automatic dipping process but does not cover purely manual dipping processes, due to the lack of understanding of the appropriate requirements for hand-dipping for tin whisker mitigation at this time. This standard does not apply to piece-part manufacturers who build piece parts with a hot solder dip finish. It applies to refinishing performed by any other group, including a third party supplier, production facilities at the supplier and other organizations, whenever the intent of the dipping is to have full coverage and replacement of Pb-free tin. The intent of this standard is for suppliers and users to incorporate these requirements into their operations to provide a consistent and well-controlled process for product applications that require significant control, typically Control Levels 2C or 3 of GEIA-STD-0005-2. Each user shall determine the applicability of this standard and the need for full replacement of the existing termination finish. This standard does not guarantee a particular yield or reliability of piece parts going through solder dipping. Some applications may have unique requirements that exceed the scope of this standard, and should be specified separately. Pb-free tin piece parts which have been dipped in compliance with this standard are no longer considered to be Pb-free tin finished for the purposes of GEIA-STD-0005-2.

Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts

IEC 91/784/PAS:2008 电子学装配技术.焊料连接件用环境和耐久性试验方法的选择指南

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

IECQ 01-2008 电子元器件用IEC质量评估体系(IECQ系统).基本规则

IEC quality assessment system for electronic components (IECQ system) - Basic rules