L10 电子元件综合 标准查询与下载

DLA QPL-39003-92-2007 电解质(固体电解质)钽固定电容器确立可靠性一般规格

An asterisk (*) adjacent to the product listing indicates that qualified parts listed on the QPL are available through distributors authorized by the manufacturer in accordance with Military Standard MIL-STD-790. Names and addresses of the distributors are listed in the back of this QPL. This list is being furnished merely as an aid in identifying authorized sources of ER parts and the responsibility for complying with contractual provisions requiring use of such parts rests with the user of such parts. Such list has been compiled from information furnished by the manufacturers of ER parts prior to release of this QPL for printing.

CAPACITORS, FIXED, ELECTROLYTIC (SOLID ELECTROLYTE), TANTALUM, ESTABLISHED RELIABILILTY, GENERAL SPECIFICATION FOR

DLA QPL-39018-72-2007 电解(氧化铝)固定电容器确定可靠性和非确定可靠性一般规格

An asterisk (*) adjacent to the product listing indicates that qualified parts listed on the QPL are available through distributors authorized bythe manufacturer in accordance with Military Standard MIL-STD-790. Names and addresses of the distributors are listed in the back of this QPL and are being furnished merely as an aid in identifying authorized sources of ER parts and the responsibility for complying with contractual provisions requiring use of such parts rests with the user of such parts. Such lists have been compiled from information furnished by the manufacturers of ER parts prior to release of this QPL.

CAPACITORS, FIXED, ELECTROLYTIC (ALUMINUM OXIDE), ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

DLA SMD-5962-88615 REV A-2007 硅单片12位模拟数字转换器微处理器兼容线性微电路

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

MICROCIRCUIT, LINEAR, MICROPROCESSOR COMPATIBLE, 12-BIT ANALOG-TO-DIGITAL CONVERTERS, MULTICHIP

DLA DSCC-DWG-86131 REV H-2007 非密封能抗射频/电磁干扰的过滤器和电容器

This drawing and MIL-PRF-28861 describe the complete requirements for radio frequency interference filters and capacitors.

FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, NONHERMETICALLY SEALED

DLA DSCC-DWG-98024 REV B-2007 射频/电磁干扰抑制全密封的过滤器和电容器

This drawing and MIL-PRF-28861 describe the requirements for radio frequency interference filters and capacitors.

FILTERS AND CAPACITORS, RADIO FREQUENCY/ ELECTROMAGNETIC INTERFERENCE SUPPRESSION, HERMETICALLY SEALED

DLA DSCC-DWG-88051 REV G-2007 射频和电磁干扰抑制的非全密封的过滤器和电容器

This drawing and MIL-PRF-28861 describe the complete requirements for radio frequency interference filters and capacitors.

FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, NONHERMETICALLY SEALED

ANSI/NISO Z39.85-2007 都柏林核心元数据集

Defines fifteen metadata elements for resource discovery in a cross-disciplinary information environment.

Dublin Core Metadata Element Set

IPC 4554-2007 印刷电路板沉浸镀锡规格

This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boards. It is intended for use by supplier, manufacturer, contract manufacturer (CM) and original equipment manufacturer (OEM).

Specification for Immersion Tin Plating for Printed Circuit Boards

JEITA EM-3510-2007 硅晶片用边缘转降测定方法

Edge Roll-Off Measurement Method for Silicon Wafers

ASTM E1854-07 确保电子部件的中子引起的位移损伤试验一致性的标准实施规程

1.1 This practice sets forth requirements to ensure consistency in neutron-induced displacement damage testing of silicon and gallium arsenide electronic piece parts. This requires controls on facility, dosimetry, tester, and communications processes that affect the accuracy and reproducibility of these tests. It provides background information on the technical basis for the requirements and additional recommendations on neutron testing. In addition to neutrons, reactors are used to provide gamma-ray pulses of intensities and durations that are not achievable elsewhere. This practice also provides background information and recommendations on gamma-ray testing of electronics using nuclear reactors.1.2 Methods are presented for ensuring and validating consistency in neutron displacement damage testing of electronic parts such as integrated circuits, transistors, and diodes. The issues identified and the controls set forth in this practice address the characterization and suitability of the radiation environments. They generally apply to reactor and 14-MeV neutron sources when used for displacement damage testing, and apply to 252Cf testing when this source is used for this application. Facility and environment characteristics that introduce complications or problems are identified, and recommendations are offered as to how problems can be recognized and minimized or solved. This practice may be used by facility users, test personnel, facility operators, and independent process validators to determine the suitability of a specific environment within a facility and of the testing process as a whole, with the exception of the electrical measurements, which are addressed in other standards. Additional information on conducting irradiations can be found in Practices E 798 and F 1190. This practice also may be of use to test sponsors (that is, organizations that establish test specifications or otherwise have a vested interest in the performance of electronics in neutron environments).1.3 Methods for evaluation and control of undesired contributors to damage are discussed in this practice, and references to relevant ASTM standards and technical reports are provided. Processes and methods used to arrive at the appropriate test environments and specification levels for electronics systems are beyond the scope of this practice; however, the process for determining the 1-MeV equivalent displacement specifications from operational environment neutron spectra should employ the methods and parameters described herein. Some important considerations are addressed in through (Nonmandatory information)..This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Standard Practice for Ensuring Test Consistency in Neutron-Induced Displacement Damage of Electronic Parts

KS C IEC 61190-1-3:2006 电子组件用连接材料.第1-3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊接材料用要求

KS C IEC(또는 IEC) 61190 계열규격 중 이 규격은 전자 등급 땜납 합금, 땜

Attachment materials for electronic assembly－Part 1－3：Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

DIN CLC/TS 50466:2006 电子元件的长期存储.实施规则

This document, which is in line with IEC/PAS 62435 relating to the management of obsolescence of electronic components, is first of all a practical guide to methods of long duration storage (more than 5 years) which summarizes the existing practices in the industry

Long duration storage of electronic components - Specification for implementation; German version CLC/TS 50466:2006

SJ/T 11365-2006 电子信息产品中有毒有害物质的检测方法

本标准规定了电子信息产品中有的铅(Pb)、汞(Hg)、镉(Cd)、六价铬[Cr(Ⅵ)]、多溴联苯(PBB)和多溴二苯醚(PBDE)六种限用的有毒有害物质或元素的检测方法。 本标准适用于《管理办法》定义的电子信息产品。

Testing methods for hazardous substances in electronic information products

SJ/T 11364-2006 电子信息产品污染控制标识要求

本标准规定了电子信息产品中有毒有害物质或元素的名称和含量、环保使用期限、可否回收利用及包装材料名称的标识要求。 本标准适用于在中华人民共和国境内销售的电子信息产品。

Marking for control of pollution caused by electronic information products

SJ/T 11363-2006 电子信息产品中有毒有害物质的限量要求

本标准规定了电子信息产品中有毒有害物质的最大允许浓度。 本标准适用于《电子信息产品污染控制管理办法》中规定的进入污染控制重点管理目录的电子信息产品。

Requirements for concentration limits for certain hazardous substances in electronic infromation products

IEC 60915:2006 电子设备用电容器和电阻器.轴端、衬套和单孔衬套安装轴驱动电子元器件安装的优选尺寸

This International Standard is applicable to variable capacitors, potentiometers and variable resistors for use in electronic equipment. The dimensions given in this standard have been selected from IEC 60390 and IEC 60620 because the ranges of dimensions included in these standards were considered too large and contained too many variants for capacitors and resistors for electronic equipment. Consequently this standard contains preferred dimensions for shaft ends and bushes and for the mounting of single-hole, bush-mounted, shaft-operated variable capacitors, variable resistors and potentiometers. If other dimensions not listed in this standard have to be used, it is recommended to select them also from the above-mentioned standards.

Capacitors and resistors for use in electronic equipment - Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components

GJB 5814-2006 军用电子器件X射线剂量增强效应测量方法

本标准规定了军用电子器件 X 射线剂量增强效应的测量方法。 本标准适用于军用电子器件 X 射线剂量增强因子的试验测量，属于损伤性测量方法。本标准只适用稳态辐照，不适用于瞬态辐照。

Testing method of X-ray dose enhancement effect for military electronic devices

GJB 4027A-2006 军用电子元器件破环性物理分析方法

本标准规定了军用电子元器件破坏性物理分析（DPA）的通用方法，包括DPA程序的一般要求以及典型电子元器件DPA试验与分析的通用方法和缺陷判据。 本标准适用于有DPA要求的军用电子元器件。

Methods of destructive physical analysis for military electronic components

BS EN 61760-1:2006 表面安装技术.表面安装元件(SMDs)规范的标准方法

This International Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)

DLA MIL-PRF-39003 L-2006 有可靠性指标的气密封固体电解质钽电容器一般规格

This specification covers the general requirements for established reliability, insulated tantalum, electrolytic (solid electrolyte), fixed capacitors, hermetically sealed 1/ in metal cases (see 6.1). Rated voltages range from 6 to 100 volts dc with surge voltages of 8 to 130 volts dc, respectively (see 4.7.19).

CAPACITORS, FIXED, ELECTROLYTIC (SOLID ELECTROLYTE), TANTALUM ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR