L94 电子设备机械结构件 标准查询与下载

GEIA SP4900-2002 生产商规定温度范围以外的半导体器件的使用

Traditionally, industries that produce electronic equipment for rugged applications have relied on the military specification system for semiconductor device standards; and upon manufacturers of militaryspecified devices as device sources. This assured

Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges Comment Period Expires: May 27, 2002; ANSI/EIA-4900

BS EN 60512-1:2001 电子设备用机电元件.基本试验程序和测量方法.总则

To be read in conjunction with BS EN 60068, BS EN 60512-1-100

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - General

JEDEC JESD51-11-2001 通孔区域排列有引线的封装热测量的测试板

This specification covers through-hole area array leaded packages intended to be mounted on a PCB. It does not cover area array packages that require sockets.

Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements

IEC 61969-3:2001 电子设备用机械结构件 室外机壳 第3部分：分规范 机箱和机盒的气候、机械试验及安全方面

This part of IEC 61969 specifies environmental requirements and tests for empty cabinets and cases as well as safety aspects for the assessment of product properties under conditions of non-weatherprotected outdoor locations above ground. This standard applies to cabinets and cases as specified in the IEC 61969 series (dimensions). The purpose is to establish defined levels of physical performance in order to meet the requirements of storage, transport and final location conditions. It is also intended to provide a common base for the comparison and selection of products in use in the market place.

Mechanical structures for electronic equipment - Outdoor enclosures - Part 3: Sectional specification; Climatic, mechanical tests and safety aspects for cabinets and cases

NF C93-400-20-2*NF EN 60512-20-2:2001 电子设备的机电元件.基本试验程序和测量方法.第20-2部分:试验 20b.易燃性试验.防火性

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2 : test 20b - Flammability tests - Fireproofness.

IEC 60297-5-101:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-101部分：分机柜和相关插入单元 插入把手/拉出把手

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-101: Subracks and associated plug-in units; Injector/extractor handle

IEC 60297-5-102:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-102部分：分机柜和相关插入单元 电磁屏蔽装置

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-102: Subracks and associated plug-in units; Electromagnetic shielding provision

IEC 60297-5-103:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-103部分：分机柜和相关插入单元 静电放电保护装置

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-103: Subracks and associated plug-in units; Electrostatic discharge protection

IEC 60297-5-104:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-104部分：分机柜和相关插入单元 锁扣装置

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-104: Subracks and associated plug-in units; Keying

IEC 60297-5-107:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-107部分：分机柜和相关插入单元 背面安装的插入单元

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-107: Subracks and associated plug-in units; Rear-mounted plug-in units

IEC 60297-5-105:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-105部分：分机柜和相关插入单元 定位钉和（或）接地钉

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-105: Subracks and associated plug-in units; Alignment and/or earth pin

IEC 60297-5-100:2001 电子设备用机械结构件 482.6mm(19in)系列机械结构件的尺寸 第5-100部分：分机柜和相关插入单元 设计综述

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 5-100: Subracks and associated plug-in units; Design overview

GEIA EIA-4899-2001 制定电子元件管理计划标准

This document defines the requirements for developing an Electronic Components Management Plan (ECMP), hereinafter also called the Plan, to assure customers and regulatory agencies that all of the electronic components in the equipment of the Plan owne

Standard for Preparing an Electronic Components Management Plan

GEIA-4900-2001 生产商规定温度范围以外的半导体器件的使用

This document prescribes processes for using semiconductor devices in wider temperature ranges than those specified by the device manufacturer. It applies to any designer or manufacturer of equipment intended to operate under conditions that require sem

Use of Semiconductor Devices Outside Manufacturers?Specified Temperature Ranges

IEC 61587-2:2000 电子设备的机械结构.IEC 60917和IEC 60297的试验.第2部分:箱、支架的地震荷载试验

This part of IEC 61587 specifies seismic requirements for cabinets or racks as defined in the IEC 60917 and IEC 60297 series. It applies, in whole or in part, only to the mechanical structures of cabinets or racks for electronic equipment, according to the IEC 60297 and the IEC 60917 series, and does not apply to electronic equipment or systems within the mechanical structures. The object of this standard is to help ensure physical integrity and environmental performance in mechanical cabinets or racks, taking into account the need for different levels of performance in different applications and geographical regions. It is intended to give the user a high level of confidence in the selection of an equipment practice to meet specific needs. A specific test specimen has been selected (see figure 1).

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks

ANSI/EIA 448-2A:2000 机电元件的试验标准.机械焊接的环境效应

Evaluates lectromechanical components, which have been subjected to the environmental effects of machine soldering and the associated fluxing, preheating and cleaning operations.

Test Standard for Electromechanical Components Environmental Effects of Machine Soldering

ANSI/EIA 448-21A:2000 机电元件的试验标准.开关.用红外系统法确定机械焊接的交替环境效应

Evaluates electromechanical surface mountable components which have been subjected to the environmental effects of machine soldering using an infrared system.

Test Standard for Electromechanical Components - Switch Environmental Effects of Machine Soldering Using an Infrared System

ANSI/EIA 448-19A:2000 机电元件的试验标准.用气相系统法确立机械焊接的环境效应

Evaluates electromechanical surface mountable components that have been subjected to the environmental effects of machine soldering using the batch type vapor phase system.

Test Standard for Electromechanical Components - Environmental Effects of Machine Soldering Using a Vapor Phase System

NF C93-476-2-1:2000 电子设备的机械结构.室外外壳.第2-1部分:详细规范.壳体的尺寸

Mechanical structures for electronic equipment - Outdoors enclosures - Part 2-1 : detail spécification - Dimensions for cabinets.

NF C93-476-2-2:2000 电子设备的机械结构.室外外壳.第2-2部分:详细规范.外壳尺寸

Mechanical structures for electronic equipment - Outdoor enclosures - Part 2-2 : detail specification - Dimensions for cases.