IPC/EIA J-STD-028-1999

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

IPC/EIA J-STD-028-1999 发布历史

This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document which includes such diverse terminations as solder bumps@ columns@ non-melting stand-offs and conductive polymer deposits. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.

IPC/EIA J-STD-028-1999由IPC - Association Connecting Electronics Industries 发布于 1999-08-01，并于 2000-04-19 实施。

IPC/EIA J-STD-028-1999的历代版本如下：

• 1999年08月01日 IPC/EIA J-STD-028-1999

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标准号

IPC/EIA J-STD-028-1999

发布日期

1999年08月01日

实施日期

2000年04月19日

废止日期

无

中国标准分类号

/

国际标准分类号

/

发布单位

IPC - Association Connecting Electronics Industries

引用标准

36

适用范围

This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document which includes such diverse terminations as solder bumps@ columns@ non-melting stand-offs and conductive polymer deposits. The specific standards for different terminations will therefore be appropriately matched to the particular interconnection.