L30 印制电路 标准查询与下载

BS EN 61191-6:2010 印刷电路板组件.球栅阵列(BGA)和网格阵列(LGA)的焊接接头内空隙及测量方法用评定标准

This part of IEC 61191 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 μm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 μm in diameter. This standard is intended for evaluation purposes and is applicable to ? research studies, ? off-line production process control and ? reliability assessment of assembly

Printed board assemblies - Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

IEC 61249-2-41:2010 印制板和其它互连结构用材料 第2-41部分 包覆和非包覆增强基材 无铅装配用限定燃烧性(垂直燃烧试验)的覆铜溴化环氧纤维素纸/织物E型玻璃增强层压板

This part of IEC 61249 gives requirements for properties of brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 100 °C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), coppe

IEC 61249-2-42:2010 印制板和其它互连结构用材料 第2-42部分 包被和非包被增强基材 无铅装配用限定燃烧性(垂直燃烧试验)的覆铜溴化环氧纤维素非织物/织物E型玻璃增强层压板

This part of IEC 61249 gives requirements for properties of brominated epoxide non-woven reinforced core/woven E-glass reinforced surface laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly in thicknesses of 0,60 mm up to 1,70 mm. The flammability rating is achieved through the use of brominated fire retardants reacted as part of the epoxide polymeric structure. The glass transition temperature is defined to be 105 °C minimum. Some property requirements may have several classes of performance. The class desired should be specified on the purchase order, otherwise the default class of material will be supplied.

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

ASTM F1896-10 测定印制导电材料的电阻率的试验方法

Resistivity is useful to suppliers and manufacturers as follows: when designing membrane switch interface circuitry, when selecting the appropriate conductive material, for conductive material quality verification, and for conductive material cure optimization and quality control.1.1 This test method covers the determination of the electrical resistivity of a conductive material as used in the manufacture of a membrane switch. 1.2 This test method is not suitable for measuring force sensitive conductive materials. 1.3 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard. 1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Test Method for Determining the Electrical Resistivity of a Printed Conductive Material

KS C IEC 61249-2-5:2009 印刷电路板和其他互联结构用材料.第2-5部分:包覆或非包覆增强基材.阻燃型(垂直燃烧试验)铜包被的溴化环氧纤维素纸增强芯/编织的E型玻璃增强表面层压板

IEC 61249 중 이 표준은 0.80∼1.70 mm 두께의 동박적층난연등급(수직연소시험

Materials for printed boards and other interconnecting structures-Part 2-5:Reinforced base materials, clad and unclad-Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability(vertical bu

KS C IEC 61188-5-2:2009 印制板和印制板组件.设计和使用.第5-2部分:焊接(焊接区/焊缝)要求.分立器件

이 표준은 개별 전자부품의 표면부착에 사용되는 랜드패턴에 대한 요구사항을 수록하고 있다.

Printed boards and printed board assemblies-Design and use-Part 5-2:Attachment(land/joint) considerations-Discrete components

KS C IEC 61188-5-5:2009 印制板和印制板组件.设计和使用.第5-5部分:焊接(焊接区/接缝)要求.四面带有翅形引线的部件

이 표준은 네 면의 걸-윙 리드 부품의 표면부착에 사용되는 랜드패턴에 대한 정보를 제공한다

Printed boards and printed board assemblies-Design and use-Part 5-5:Attachment (land/joint) considerations-Components with gull-wing leads on four sides

KS C IEC 61193-1:2009 质量评定系统.第1部分:印制版组装件缺陷的登记和分析

KS C IEC 61193 중 이 표준은 인쇄회로기판과의 조립시에 남땜된 인쇄회로기판 부품

Quality assessment systems－Part 1：Registration and analysis of defects on printed board assemblies

KS C IEC 62137:2009 环境和耐用试验.区域阵列式包装件表面安装板的试验方法FBGA、BGA、FLGA、LGA、SON和QFN

이 표준은 반도체 소자를 제조할 때에 KS C IEC 60068-1에 따라 산업용이나 소비

Environmental and endurance testing－Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

KS C IEC 61188-5-4:2009 印制板和印制板组件.设计和使用.第5-4部分:焊接(焊接区/接缝)要求.两面带有J形引线的部件

이 표준은 KS C IEC 60286의 리플로 솔더링 공정에 사용될 양면의 J 리드 부품을

Printed boards and printed board assemblies-Design and use-Part 5-4:Attachment(land/joint) considerations-Components with J leads on two sides

KS C IEC 61188-5-6:2009 印制板和印制板组件.设计和使用.第5-6部分:焊接(焊接区/接缝)要求.四面带有J形引线的片状载体

이 표준은 네 면의 J-리드를 지닌 부품의 표면부착에 사용되는 랜드패턴에 대한 정보를 제공

Printed boards and printed board assemblies &##8211; Design and use-Part 5-6:Attachment(land/joint) considerations-Chip carriers with J-leads on four sides

KS C IEC 61188-5-3:2009 印制板和印制板组件.设计和使用.第5-3部分:焊接(焊接区/接缝)要求.两面带有翅形引线的部件

이 표준은 양면의 걸-윙 리드 부품의 표면부착에 사용되는 랜드패턴에 대한 정보를 제공한다.

Printed boards and printed board assemblies-Design and use-Part 5-3:Attachment(land/joint) considerations-Components with gull-wing leads on two sides

KS C IEC 61188-5-8:2009 印制板和印制板组件.设计和使用.第5-8部分:焊接(焊接区/接缝)要求.区域阵列组件(BGA、.FBGA、.CGA、.LGA)

이 표준은 솔더볼, 솔더칼럼, 보호 코팅된 랜드 등의 형태로 된 면 배열형 터미네이션을 지

Printed board and printed board assemblies-Design and use-Part 5-8:Attachment(land/joint) considerations-Area array components(BGA, FBGA, CGA, LGA)

KS C IEC 61189-5:2009 电气材料、互连结构和组件的试验方法.第5部分:印制电路板组件的试验方法

이 표준은 인쇄기판 조립품 시험에 적용될 시험방법-방법론과 절차를 규정하고 있다.

Test methods for electrical materials, interconnection structures and assemblies－Part 5：Test methods for printed board assemblies

KS C IEC 61249-2-8:2009 印刷电路板和其他互连结构用材料.第2-8部分:包覆或非包覆增强基材.规定了易燃性的包铜改良溴化环氧编织玻璃纤维增强层压板(垂直燃烧试验)

IEC 61249 중 이 표준은 0.05∼3.2 mm 동박적층난연등급(수직연소시험)의 유리

Materials for printed boards and other interconnecting structures－Part 2-8：Reinforced base materials clad and unclad－Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability(vertical burning test), copper-clad

KS C IEC 61249-2-6:2009 印刷电路板和其他互联结构用材料.第2-6部分:包覆或非包覆增强基材.阻燃型(垂直燃烧试验)铜包被的溴化环氧非编织/编织的E型玻璃增强表面层压板

IEC 61249 중 이 표준은 0.80∼1.70 mm 두께의 동박적층난연등급(수직연소시험

Materials for printed boards and other interconnecting structures-Part 2-6:Reinforced base materials, clad and unclad-Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability(vertical burning test), copper-clad

DIN EN 61249-4-17:2009 印制板和其它互连结构用材料.第4-17部分:非包被预浸处理材料分规范集(多层板的生产).阻燃型(垂直燃烧试验)多功能非卤化编织E.玻璃环氧预浸料坯

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (ve

DIN EN 61188-7:2009 印刷版和印刷版总成.设计和使用.第7部分:CAD图书馆结构的电子元器件零方向(IEC 61188-7:2009),德文版本 EN 61188-7:2009

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2009); German version EN 61188-7:2009

DIN EN 61249-4-16:2009 印制板和其它互连结构用材料.第4-16部分:非包被预浸处理材料分规范集(多层板的生产).阻燃型(垂直燃烧试验)多功能非卤化编织E.玻璃环氧预浸料坯

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined

DIN EN 61249-4-14:2009 印制板和其它互连结构用材料.第4-14部分:非包被预浸处理材料分规范集(多层板的生产).阻燃型(垂直燃烧试验)卤化编织E.玻璃环氧预浸料坯

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning t