01.100.25;31.080.01;31.240 标准查询与下载

IEC 60191-1:2018 半导体器件的机械标准化.第1部分:分立器件外形图的一般规则

This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the preparation of outline drawings of surface-mounted discrete devices with a lead count higher or equal to 8, IEC 60191-6 should be referred to as well. The primary object of these drawings is to indicate the space to be allowed for devices in equipment, together with other dimensional characteristics required to ensure mechanical interchangeability. Complete interchangeability involves other considerations such as the electrical and thermal characteristics of the semiconductor devices concerned. The international standardization represented by these drawings therefore encourages the manufacturers of devices to comply with the tolerances shown on the drawings in order to extend their range of customers internationally. It also gives equipment designers an assurance of mechanical interchangeability between the devices obtained from suppliers in different countries, provided they allow the space in their equipment that is indicated by the drawings and take note of the more precise information on bases, studs, etc. NOTE Additional details of reference letter symbols used in this document are given in Annex A.

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

IEC 60191-6-22:2012 半导体器件的机械标准化.第6-22部分:表面安装半导体器件封装外形图绘制的通用规则.硅细间距球阵列和硅细间距栅格阵列半导体封装的的设计指南(S-FBGA和S-FLGA)

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silico

IEC 60191-6-17:2011 半导体器件的机械标准化 第6-17部分 表面安装半导体器件封装外形图绘制的一般规则 堆叠式封装的设计指南 精细倾斜球状网阵排列和精细栅格阵列(P-PFBGA和P-PFLAGA)

This part of IEC 60191 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land gr

IEC 60191-6-18:2010/COR1:2010 半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.球状栅极阵列封装体(BGA)的设计指南

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

BS EN 60191-6-18:2010 半导体设备的机械标准化.平面式安装半导体器件外壳外形图绘制的一般规则.球栅阵列(BGA)用设计指南

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

IEC 60191-6-18:2010 半导体器件的机械标准化.第6-18部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列(BGA)的设计指南

This part of IEC 60191 provides standard outline drawings@ dimensions@ and recommended variations for all square ball grid array packages (BGA)@ whose terminal pitch is 1 mm or larger.

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

IEC 60191-6:2009 半导体器件的机械标准化.第6部分:表面安装半导体器件封装外形图绘制的一般规则

This part of IEC 60191 gives general rules for the preparation of outline drawings of surfacemounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8@ as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

IEC PAS 60191-6-19:2008 半导体装置的机械标准化.第6-19部分:升温时包裹热变形和最大允许热变形的测量方法

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

IEC 60191-6-16:2007 半导体器件的机械标准化.第6-16部分:半导体试验术语表和BGA、LGA、FBGA和FLGA用老化插座

This part of IEC 60191 gives a glossary of semiconductor sockets for BGA, LGA, FBGA and FLGA. This standard intends to establish definitions and unification of terminology relating to tests and burn-in sockets for BGA, LGA, FBGA and FLGA.

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA